Search

David A. Zarneke

Examiner (ID: 8778, Phone: (571)272-1937 , Office: P/2891 )

Most Active Art Unit
2891
Art Unit(s)
2891, 2812, 2829, 2827
Total Applications
2297
Issued Applications
1864
Pending Applications
130
Abandoned Applications
332

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17963692 [patent_doc_number] => 20220344273 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-27 [patent_title] => ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY [patent_app_type] => utility [patent_app_number] => 17/861125 [patent_app_country] => US [patent_app_date] => 2022-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7674 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -20 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17861125 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/861125
Ultra small molded module integrated with die by module-on-wafer assembly Jul 7, 2022 Issued
Array ( [id] => 18882991 [patent_doc_number] => 20240006360 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-04 [patent_title] => SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/853978 [patent_app_country] => US [patent_app_date] => 2022-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8300 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17853978 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/853978
Semiconductor structure having copper pillar within solder bump and manufacturing method thereof Jun 29, 2022 Issued
Array ( [id] => 20598224 [patent_doc_number] => 12581964 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-03-17 [patent_title] => Lead frame, semiconductor device, and lead frame manufacturing method [patent_app_type] => utility [patent_app_number] => 17/854943 [patent_app_country] => US [patent_app_date] => 2022-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 29 [patent_no_of_words] => 1175 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 15 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17854943 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/854943
Lead frame, semiconductor device, and lead frame manufacturing method Jun 29, 2022 Issued
Array ( [id] => 20175937 [patent_doc_number] => 12394693 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-08-19 [patent_title] => Integrated circuit package with star-connected lead [patent_app_type] => utility [patent_app_number] => 17/854526 [patent_app_country] => US [patent_app_date] => 2022-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 11 [patent_no_of_words] => 1098 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17854526 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/854526
Integrated circuit package with star-connected lead Jun 29, 2022 Issued
Array ( [id] => 20734649 [patent_doc_number] => 12641914 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-05-26 [patent_title] => Light detection element, receiving device, and light sensor device [patent_app_type] => utility [patent_app_number] => 17/845050 [patent_app_country] => US [patent_app_date] => 2022-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 31 [patent_no_of_words] => 11904 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17845050 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/845050
Light detection element, receiving device, and light sensor device Jun 20, 2022 Issued
Array ( [id] => 17917581 [patent_doc_number] => 20220319977 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-06 [patent_title] => CHIP STRUCTURE AND WIRELESS COMMUNICATION APPARATUS [patent_app_type] => utility [patent_app_number] => 17/843365 [patent_app_country] => US [patent_app_date] => 2022-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9943 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17843365 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/843365
CHIP STRUCTURE AND WIRELESS COMMUNICATION APPARATUS Jun 16, 2022 Pending
Array ( [id] => 18848921 [patent_doc_number] => 20230411325 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-21 [patent_title] => CHIP PACKAGE INTEGRATION WITH HYBRID BONDING [patent_app_type] => utility [patent_app_number] => 17/841454 [patent_app_country] => US [patent_app_date] => 2022-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5124 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17841454 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/841454
CHIP PACKAGE INTEGRATION WITH HYBRID BONDING Jun 14, 2022 Abandoned
Array ( [id] => 20705901 [patent_doc_number] => 12628633 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-05-12 [patent_title] => Semiconductor device including spacer via structure and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/841245 [patent_app_country] => US [patent_app_date] => 2022-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 22 [patent_no_of_words] => 3354 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17841245 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/841245
Semiconductor device including spacer via structure and method of manufacturing the same Jun 14, 2022 Issued
Array ( [id] => 18097619 [patent_doc_number] => 20220415960 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-29 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/840926 [patent_app_country] => US [patent_app_date] => 2022-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16514 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -43 [patent_words_short_claim] => 177 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17840926 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/840926
Semiconductor device and method of manufacturing semiconductor device Jun 14, 2022 Issued
Array ( [id] => 18848903 [patent_doc_number] => 20230411307 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-21 [patent_title] => Semiconductor Device and Method Forming Same [patent_app_type] => utility [patent_app_number] => 17/841275 [patent_app_country] => US [patent_app_date] => 2022-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8529 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17841275 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/841275
Semiconductor device and method forming same Jun 14, 2022 Issued
Array ( [id] => 17886584 [patent_doc_number] => 20220302062 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-22 [patent_title] => Semiconductor Die Connection System and Method [patent_app_type] => utility [patent_app_number] => 17/837492 [patent_app_country] => US [patent_app_date] => 2022-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6954 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17837492 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/837492
Semiconductor die connection system and method Jun 9, 2022 Issued
Array ( [id] => 18224030 [patent_doc_number] => 20230063024 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-02 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/806205 [patent_app_country] => US [patent_app_date] => 2022-06-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7107 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 257 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17806205 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/806205
Semiconductor device Jun 8, 2022 Issued
Array ( [id] => 18563113 [patent_doc_number] => 11728367 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-15 [patent_title] => Optical device having a detector and an optical element mounted on an epoxy fence [patent_app_type] => utility [patent_app_number] => 17/835300 [patent_app_country] => US [patent_app_date] => 2022-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4048 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17835300 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/835300
Optical device having a detector and an optical element mounted on an epoxy fence Jun 7, 2022 Issued
Array ( [id] => 18696615 [patent_doc_number] => 20230327056 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-12 [patent_title] => SURFACE MOUNTABLE OPTOELECTRONIC DEVICE WITH SIDE WALLS INCLUDING SLOTS FILLED WITH A LAMINATED ENCAPSULANT MATERIAL [patent_app_type] => utility [patent_app_number] => 17/834862 [patent_app_country] => US [patent_app_date] => 2022-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3723 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17834862 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/834862
Surface mountable optoelectronic device with side walls including slots filled with a laminated encapsulant material Jun 6, 2022 Issued
Array ( [id] => 18821104 [patent_doc_number] => 20230395445 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS [patent_app_type] => utility [patent_app_number] => 17/833650 [patent_app_country] => US [patent_app_date] => 2022-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11010 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17833650 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/833650
GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS Jun 5, 2022 Pending
Array ( [id] => 18821126 [patent_doc_number] => 20230395467 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS [patent_app_type] => utility [patent_app_number] => 17/833648 [patent_app_country] => US [patent_app_date] => 2022-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11034 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17833648 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/833648
GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS Jun 5, 2022 Pending
Array ( [id] => 18741329 [patent_doc_number] => 20230350310 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-02 [patent_title] => OVERLAY MARK [patent_app_type] => utility [patent_app_number] => 17/824909 [patent_app_country] => US [patent_app_date] => 2022-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2350 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17824909 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/824909
Overlay mark May 25, 2022 Issued
Array ( [id] => 18112921 [patent_doc_number] => 20230005801 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-05 [patent_title] => SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE [patent_app_type] => utility [patent_app_number] => 17/824365 [patent_app_country] => US [patent_app_date] => 2022-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13348 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17824365 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/824365
Semiconductor module and method for manufacturing semiconductor module May 24, 2022 Issued
Array ( [id] => 18226287 [patent_doc_number] => 20230065281 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-02 [patent_title] => SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 17/751819 [patent_app_country] => US [patent_app_date] => 2022-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5461 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17751819 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/751819
Semiconductor devices May 23, 2022 Issued
Array ( [id] => 17986375 [patent_doc_number] => 20220352412 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-03 [patent_title] => DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATION AND LASER-INDUCED HEATING [patent_app_type] => utility [patent_app_number] => 17/751090 [patent_app_country] => US [patent_app_date] => 2022-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 61354 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17751090 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/751090
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating May 22, 2022 Issued
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