Search

David A. Zarneke

Examiner (ID: 17793)

Most Active Art Unit
2891
Art Unit(s)
2829, 2812, 2827, 2891
Total Applications
2255
Issued Applications
1829
Pending Applications
145
Abandoned Applications
326

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18821126 [patent_doc_number] => 20230395467 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS [patent_app_type] => utility [patent_app_number] => 17/833648 [patent_app_country] => US [patent_app_date] => 2022-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11034 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17833648 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/833648
GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS Jun 5, 2022 Pending
Array ( [id] => 18741329 [patent_doc_number] => 20230350310 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-02 [patent_title] => OVERLAY MARK [patent_app_type] => utility [patent_app_number] => 17/824909 [patent_app_country] => US [patent_app_date] => 2022-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2350 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17824909 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/824909
Overlay mark May 25, 2022 Issued
Array ( [id] => 18741329 [patent_doc_number] => 20230350310 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-02 [patent_title] => OVERLAY MARK [patent_app_type] => utility [patent_app_number] => 17/824909 [patent_app_country] => US [patent_app_date] => 2022-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2350 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17824909 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/824909
Overlay mark May 25, 2022 Issued
Array ( [id] => 18741329 [patent_doc_number] => 20230350310 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-02 [patent_title] => OVERLAY MARK [patent_app_type] => utility [patent_app_number] => 17/824909 [patent_app_country] => US [patent_app_date] => 2022-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2350 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17824909 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/824909
Overlay mark May 25, 2022 Issued
Array ( [id] => 18112921 [patent_doc_number] => 20230005801 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-05 [patent_title] => SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE [patent_app_type] => utility [patent_app_number] => 17/824365 [patent_app_country] => US [patent_app_date] => 2022-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13348 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17824365 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/824365
Semiconductor module and method for manufacturing semiconductor module May 24, 2022 Issued
Array ( [id] => 18226287 [patent_doc_number] => 20230065281 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-02 [patent_title] => SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 17/751819 [patent_app_country] => US [patent_app_date] => 2022-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5461 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17751819 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/751819
Semiconductor devices May 23, 2022 Issued
Array ( [id] => 18533176 [patent_doc_number] => 20230238252 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-27 [patent_title] => MANUFACTURING METHOD OF PACKAGE STRUCTURE OF ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 17/751643 [patent_app_country] => US [patent_app_date] => 2022-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6367 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17751643 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/751643
Manufacturing method of package structure of electronic device May 22, 2022 Issued
Array ( [id] => 18533176 [patent_doc_number] => 20230238252 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-27 [patent_title] => MANUFACTURING METHOD OF PACKAGE STRUCTURE OF ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 17/751643 [patent_app_country] => US [patent_app_date] => 2022-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6367 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17751643 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/751643
Manufacturing method of package structure of electronic device May 22, 2022 Issued
Array ( [id] => 19123609 [patent_doc_number] => 11967604 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-23 [patent_title] => Image sensor and display device having the same [patent_app_type] => utility [patent_app_number] => 17/750687 [patent_app_country] => US [patent_app_date] => 2022-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 22 [patent_no_of_words] => 13728 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 222 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17750687 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/750687
Image sensor and display device having the same May 22, 2022 Issued
Array ( [id] => 17986375 [patent_doc_number] => 20220352412 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-03 [patent_title] => DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATION AND LASER-INDUCED HEATING [patent_app_type] => utility [patent_app_number] => 17/751090 [patent_app_country] => US [patent_app_date] => 2022-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 61354 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17751090 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/751090
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating May 22, 2022 Issued
Array ( [id] => 18024322 [patent_doc_number] => 20220375821 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-24 [patent_title] => BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 17/748074 [patent_app_country] => US [patent_app_date] => 2022-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11067 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17748074 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/748074
BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD May 18, 2022 Pending
Array ( [id] => 18039960 [patent_doc_number] => 20220384177 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-01 [patent_title] => ELEMENT CHIP MANUFACTURING METHOD AND SUBSTRATE PROCESSING METHOD [patent_app_type] => utility [patent_app_number] => 17/663452 [patent_app_country] => US [patent_app_date] => 2022-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10730 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -3 [patent_words_short_claim] => 256 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17663452 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/663452
Element chip manufacturing method and substrate processing method May 15, 2022 Issued
Array ( [id] => 17833720 [patent_doc_number] => 20220271024 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-25 [patent_title] => SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/743455 [patent_app_country] => US [patent_app_date] => 2022-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10816 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17743455 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/743455
Semiconductor structure and manufacturing method thereof May 12, 2022 Issued
Array ( [id] => 19842693 [patent_doc_number] => 12255093 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-18 [patent_title] => 3D memory structure and method of forming the same [patent_app_type] => utility [patent_app_number] => 17/743239 [patent_app_country] => US [patent_app_date] => 2022-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 6876 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17743239 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/743239
3D memory structure and method of forming the same May 11, 2022 Issued
Array ( [id] => 19842760 [patent_doc_number] => 12255160 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-18 [patent_title] => Semiconductor package and package-on-package including the same [patent_app_type] => utility [patent_app_number] => 17/742862 [patent_app_country] => US [patent_app_date] => 2022-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 15453 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 177 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17742862 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/742862
Semiconductor package and package-on-package including the same May 11, 2022 Issued
Array ( [id] => 18639547 [patent_doc_number] => 11764169 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-09-19 [patent_title] => Semiconductor device package with warpage control structure [patent_app_type] => utility [patent_app_number] => 17/739990 [patent_app_country] => US [patent_app_date] => 2022-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 2967 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17739990 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/739990
Semiconductor device package with warpage control structure May 8, 2022 Issued
Array ( [id] => 18757507 [patent_doc_number] => 20230360969 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-09 [patent_title] => METHOD OF FABRICATING CONTACT STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/738009 [patent_app_country] => US [patent_app_date] => 2022-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8594 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17738009 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/738009
Method of fabricating contact structure May 5, 2022 Issued
Array ( [id] => 18757484 [patent_doc_number] => 20230360946 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-09 [patent_title] => METHOD FOR FORMING SEMICONDUCTOR STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/738182 [patent_app_country] => US [patent_app_date] => 2022-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7322 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17738182 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/738182
Method for forming semiconductor structure May 5, 2022 Issued
Array ( [id] => 19079479 [patent_doc_number] => 11948855 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2024-04-02 [patent_title] => Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader [patent_app_type] => utility [patent_app_number] => 17/736002 [patent_app_country] => US [patent_app_date] => 2022-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 2445 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 235 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17736002 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/736002
Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader May 2, 2022 Issued
Array ( [id] => 18338407 [patent_doc_number] => 20230130356 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 17/734424 [patent_app_country] => US [patent_app_date] => 2022-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4273 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17734424 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/734424
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME May 1, 2022 Abandoned
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