Search

David A Zarneke

Examiner (ID: 17793, Phone: (571)272-1937 , Office: P/2891 )

Most Active Art Unit
2891
Art Unit(s)
2829, 2812, 2827, 2891
Total Applications
2255
Issued Applications
1829
Pending Applications
145
Abandoned Applications
326

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5005063 [patent_doc_number] => 20070202633 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-30 [patent_title] => 'Semiconductor package and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 11/651708 [patent_app_country] => US [patent_app_date] => 2007-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2518 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0202/20070202633.pdf [firstpage_image] =>[orig_patent_app_number] => 11651708 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/651708
Semiconductor package and method for fabricating the same Jan 8, 2007 Abandoned
Array ( [id] => 4474495 [patent_doc_number] => 07867829 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-01-11 [patent_title] => 'Semiconductor device manufacturing method, semiconductor wafer, and semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/618038 [patent_app_country] => US [patent_app_date] => 2006-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 1843 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/867/07867829.pdf [firstpage_image] =>[orig_patent_app_number] => 11618038 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/618038
Semiconductor device manufacturing method, semiconductor wafer, and semiconductor device Dec 28, 2006 Issued
Array ( [id] => 173765 [patent_doc_number] => 07659144 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-02-09 [patent_title] => 'Semiconductor device and manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/618188 [patent_app_country] => US [patent_app_date] => 2006-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 34 [patent_no_of_words] => 12719 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/659/07659144.pdf [firstpage_image] =>[orig_patent_app_number] => 11618188 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/618188
Semiconductor device and manufacturing the same Dec 28, 2006 Issued
Array ( [id] => 4752600 [patent_doc_number] => 20080160675 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'Microelectronic package with thermal access' [patent_app_type] => utility [patent_app_number] => 11/648719 [patent_app_country] => US [patent_app_date] => 2006-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 7454 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0160/20080160675.pdf [firstpage_image] =>[orig_patent_app_number] => 11648719 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/648719
Microelectronic package with thermal access Dec 28, 2006 Issued
Array ( [id] => 4752599 [patent_doc_number] => 20080160674 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING MULTIPLE DIE REDISTRIBUTION LAYER' [patent_app_type] => utility [patent_app_number] => 11/617689 [patent_app_country] => US [patent_app_date] => 2006-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 4536 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0160/20080160674.pdf [firstpage_image] =>[orig_patent_app_number] => 11617689 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/617689
Method of making a semiconductor device having multiple die redistribution layer Dec 27, 2006 Issued
Array ( [id] => 4752676 [patent_doc_number] => 20080160751 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'MICROELECTRONIC DIE INCLUDING SOLDER CAPS ON BUMPING SITES THEREOF AND METHOD OF MAKING SAME' [patent_app_type] => utility [patent_app_number] => 11/617589 [patent_app_country] => US [patent_app_date] => 2006-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3484 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0160/20080160751.pdf [firstpage_image] =>[orig_patent_app_number] => 11617589 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/617589
MICROELECTRONIC DIE INCLUDING SOLDER CAPS ON BUMPING SITES THEREOF AND METHOD OF MAKING SAME Dec 27, 2006 Abandoned
Array ( [id] => 4752595 [patent_doc_number] => 20080160670 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'PHYSICAL ALIGNMENT FEATURES ON INTEGRATED CIRCUIT DEVICES FOR ACCURATE DIE-IN-SUBSTRATE EMBEDDING' [patent_app_type] => utility [patent_app_number] => 11/616479 [patent_app_country] => US [patent_app_date] => 2006-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 3407 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0160/20080160670.pdf [firstpage_image] =>[orig_patent_app_number] => 11616479 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/616479
PHYSICAL ALIGNMENT FEATURES ON INTEGRATED CIRCUIT DEVICES FOR ACCURATE DIE-IN-SUBSTRATE EMBEDDING Dec 26, 2006 Abandoned
Array ( [id] => 4879817 [patent_doc_number] => 20080153200 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-26 [patent_title] => 'Stacked semiconductor components' [patent_app_type] => utility [patent_app_number] => 11/644329 [patent_app_country] => US [patent_app_date] => 2006-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4714 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0153/20080153200.pdf [firstpage_image] =>[orig_patent_app_number] => 11644329 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/644329
Stacked semiconductor components Dec 21, 2006 Abandoned
Array ( [id] => 7689300 [patent_doc_number] => 20070105398 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-10 [patent_title] => 'Method of producing insulator thin film, insulator thin film, method of manufacturing semiconductor device, and semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/644236 [patent_app_country] => US [patent_app_date] => 2006-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5771 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0105/20070105398.pdf [firstpage_image] =>[orig_patent_app_number] => 11644236 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/644236
Method of producing insulator thin film, insulator thin film, method of manufacturing semiconductor device, and semiconductor device Dec 21, 2006 Issued
Array ( [id] => 5250641 [patent_doc_number] => 20070132097 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-14 [patent_title] => 'Projected contact structures for engaging bumped semiconductor devices' [patent_app_type] => utility [patent_app_number] => 11/644333 [patent_app_country] => US [patent_app_date] => 2006-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 7976 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0132/20070132097.pdf [firstpage_image] =>[orig_patent_app_number] => 11644333 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/644333
Projected contact structures for engaging bumped semiconductor devices Dec 21, 2006 Abandoned
Array ( [id] => 5091785 [patent_doc_number] => 20070113394 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-24 [patent_title] => 'AIR SOCKET FOR TESTING INTEGRATED CIRCUITS' [patent_app_type] => utility [patent_app_number] => 11/614609 [patent_app_country] => US [patent_app_date] => 2006-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 5432 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0113/20070113394.pdf [firstpage_image] =>[orig_patent_app_number] => 11614609 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/614609
AIR SOCKET FOR TESTING INTEGRATED CIRCUITS Dec 20, 2006 Abandoned
Array ( [id] => 5019571 [patent_doc_number] => 20070145537 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-28 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/614748 [patent_app_country] => US [patent_app_date] => 2006-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1866 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20070145537.pdf [firstpage_image] =>[orig_patent_app_number] => 11614748 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/614748
Semiconductor device and method for manufacturing the same Dec 20, 2006 Issued
Array ( [id] => 5031757 [patent_doc_number] => 20070096296 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-03 [patent_title] => 'Manufacture of mountable capped chips' [patent_app_type] => utility [patent_app_number] => 11/642354 [patent_app_country] => US [patent_app_date] => 2006-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4941 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0096/20070096296.pdf [firstpage_image] =>[orig_patent_app_number] => 11642354 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/642354
Manufacture of mountable capped chips Dec 19, 2006 Issued
Array ( [id] => 5019638 [patent_doc_number] => 20070145604 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-28 [patent_title] => 'CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS' [patent_app_type] => utility [patent_app_number] => 11/610319 [patent_app_country] => US [patent_app_date] => 2006-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2835 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20070145604.pdf [firstpage_image] =>[orig_patent_app_number] => 11610319 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/610319
CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS Dec 12, 2006 Abandoned
Array ( [id] => 4977443 [patent_doc_number] => 20070218676 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-20 [patent_title] => 'Method for forming metal bumps' [patent_app_type] => utility [patent_app_number] => 11/635498 [patent_app_country] => US [patent_app_date] => 2006-12-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2303 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0218/20070218676.pdf [firstpage_image] =>[orig_patent_app_number] => 11635498 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/635498
Method for forming metal bumps Dec 7, 2006 Issued
Array ( [id] => 267061 [patent_doc_number] => 07566586 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-07-28 [patent_title] => 'Method of manufacturing a semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/634119 [patent_app_country] => US [patent_app_date] => 2006-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 20 [patent_no_of_words] => 5099 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/566/07566586.pdf [firstpage_image] =>[orig_patent_app_number] => 11634119 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/634119
Method of manufacturing a semiconductor device Dec 5, 2006 Issued
Array ( [id] => 5253434 [patent_doc_number] => 20070134890 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-14 [patent_title] => 'Cutting method for substrate and cutting apparatus therefor' [patent_app_type] => utility [patent_app_number] => 11/634768 [patent_app_country] => US [patent_app_date] => 2006-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 8046 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0134/20070134890.pdf [firstpage_image] =>[orig_patent_app_number] => 11634768 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/634768
Cutting method for substrate and cutting apparatus therefor Dec 5, 2006 Issued
Array ( [id] => 5185968 [patent_doc_number] => 20070164275 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-19 [patent_title] => 'LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE, AND ELECTRONIC APPARATUS' [patent_app_type] => utility [patent_app_number] => 11/565319 [patent_app_country] => US [patent_app_date] => 2006-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6943 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0164/20070164275.pdf [firstpage_image] =>[orig_patent_app_number] => 11565319 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/565319
Light-emitting device, method for manufacturing light-emitting device, and electronic apparatus Nov 29, 2006 Issued
Array ( [id] => 810556 [patent_doc_number] => 07417313 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-08-26 [patent_title] => 'Method for manufacturing an adhesive substrate with a die-cavity sidewall' [patent_app_type] => utility [patent_app_number] => 11/601674 [patent_app_country] => US [patent_app_date] => 2006-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 2748 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/417/07417313.pdf [firstpage_image] =>[orig_patent_app_number] => 11601674 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/601674
Method for manufacturing an adhesive substrate with a die-cavity sidewall Nov 19, 2006 Issued
Array ( [id] => 5056944 [patent_doc_number] => 20070059866 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-15 [patent_title] => 'Fan out type wafer level package structure and method of the same' [patent_app_type] => utility [patent_app_number] => 11/595970 [patent_app_country] => US [patent_app_date] => 2006-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3163 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0059/20070059866.pdf [firstpage_image] =>[orig_patent_app_number] => 11595970 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/595970
Fan out type wafer level package structure and method of the same Nov 12, 2006 Abandoned
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