
David A Zarneke
Examiner (ID: 17793, Phone: (571)272-1937 , Office: P/2891 )
| Most Active Art Unit | 2891 |
| Art Unit(s) | 2829, 2812, 2827, 2891 |
| Total Applications | 2255 |
| Issued Applications | 1829 |
| Pending Applications | 145 |
| Abandoned Applications | 326 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 285392
[patent_doc_number] => 07550318
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-06-23
[patent_title] => 'Interconnect for improved die to substrate electrical coupling'
[patent_app_type] => utility
[patent_app_number] => 11/502679
[patent_app_country] => US
[patent_app_date] => 2006-08-11
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/550/07550318.pdf
[firstpage_image] =>[orig_patent_app_number] => 11502679
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/502679 | Interconnect for improved die to substrate electrical coupling | Aug 10, 2006 | Issued |
Array
(
[id] => 5685972
[patent_doc_number] => 20060284287
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-12-21
[patent_title] => 'TWO-POLE SMT MINIATURE HOUSING FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE MANUFACTURE THEREOF'
[patent_app_type] => utility
[patent_app_number] => 11/463127
[patent_app_country] => US
[patent_app_date] => 2006-08-08
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[pdf_file] => publications/A1/0284/20060284287.pdf
[firstpage_image] =>[orig_patent_app_number] => 11463127
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/463127 | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof | Aug 7, 2006 | Issued |
Array
(
[id] => 482762
[patent_doc_number] => 07220673
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-05-22
[patent_title] => 'Method for depositing tungsten-containing layers by vapor deposition techniques'
[patent_app_type] => utility
[patent_app_number] => 11/461909
[patent_app_country] => US
[patent_app_date] => 2006-08-02
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/461909 | Method for depositing tungsten-containing layers by vapor deposition techniques | Aug 1, 2006 | Issued |
Array
(
[id] => 387012
[patent_doc_number] => 07304381
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-12-04
[patent_title] => 'Package and method for attaching an integrated heat spreader'
[patent_app_type] => utility
[patent_app_number] => 11/461803
[patent_app_country] => US
[patent_app_date] => 2006-08-02
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[pdf_file] => patents/07/304/07304381.pdf
[firstpage_image] =>[orig_patent_app_number] => 11461803
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/461803 | Package and method for attaching an integrated heat spreader | Aug 1, 2006 | Issued |
Array
(
[id] => 5625429
[patent_doc_number] => 20060263934
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-23
[patent_title] => 'CHIP-TYPE MICRO-CONNECTOR AND METHOD OF PACKAGING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/461458
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/461458 | CHIP-TYPE MICRO-CONNECTOR AND METHOD OF PACKAGING THE SAME | Jul 31, 2006 | Abandoned |
Array
(
[id] => 5054458
[patent_doc_number] => 20070057379
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[patent_issue_date] => 2007-03-15
[patent_title] => 'Method of manufacturing a semiconductor device'
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[firstpage_image] =>[orig_patent_app_number] => 11495718
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Array
(
[id] => 4695601
[patent_doc_number] => 20080217785
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[patent_issue_date] => 2008-09-11
[patent_title] => 'Semiconductor Device with Grounding Structure'
[patent_app_type] => utility
[patent_app_number] => 11/997240
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/997240 | Semiconductor device with grounding structure | Jul 30, 2006 | Issued |
Array
(
[id] => 5520221
[patent_doc_number] => 20090028202
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-29
[patent_title] => 'Nitride light emitting device and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/919639
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[patent_app_date] => 2006-07-31
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[firstpage_image] =>[orig_patent_app_number] => 11919639
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/919639 | Nitride light emitting device and manufacturing method thereof | Jul 30, 2006 | Issued |
Array
(
[id] => 592918
[patent_doc_number] => 07436055
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[patent_issue_date] => 2008-10-14
[patent_title] => 'Packaging method of a plurality of chips stacked on each other and package structure thereof'
[patent_app_type] => utility
[patent_app_number] => 11/459919
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[patent_app_date] => 2006-07-25
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/459919 | Packaging method of a plurality of chips stacked on each other and package structure thereof | Jul 24, 2006 | Issued |
Array
(
[id] => 5242414
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[patent_issue_date] => 2007-01-25
[patent_title] => 'Forming of conductive bumps for an integrated circuit'
[patent_app_type] => utility
[patent_app_number] => 11/491838
[patent_app_country] => US
[patent_app_date] => 2006-07-24
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/491838 | Forming of conductive bumps for an integrated circuit | Jul 23, 2006 | Abandoned |
Array
(
[id] => 519881
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[patent_title] => 'Stacking system and method'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/489956 | Stacking system and method | Jul 19, 2006 | Issued |
Array
(
[id] => 587839
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/458479 | Interconnect structure for semiconductor package | Jul 18, 2006 | Issued |
Array
(
[id] => 5056941
[patent_doc_number] => 20070059863
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[patent_title] => 'Method of manufacturing quad flat non-leaded semiconductor package'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/486569 | Method of manufacturing quad flat non-leaded semiconductor package | Jul 13, 2006 | Abandoned |
Array
(
[id] => 4801662
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[patent_issue_date] => 2008-01-17
[patent_title] => 'Method for Producing a Dielectric Layer for an Electronic Component'
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Array
(
[id] => 5659241
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[patent_title] => 'Integrated circuit cooling and insulating device and method'
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Array
(
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Array
(
[id] => 330452
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[patent_title] => 'Method for wafer level packaging and fabricating cap structures'
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Array
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Array
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/476160 | Micro camera module and method of manufacturing the same | Jun 27, 2006 | Issued |