Search

David A Zarneke

Examiner (ID: 17793, Phone: (571)272-1937 , Office: P/2891 )

Most Active Art Unit
2891
Art Unit(s)
2829, 2812, 2827, 2891
Total Applications
2255
Issued Applications
1829
Pending Applications
145
Abandoned Applications
326

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 299766 [patent_doc_number] => 07537965 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-05-26 [patent_title] => 'Manufacturing method for a leadless multi-chip electronic module' [patent_app_type] => utility [patent_app_number] => 11/471869 [patent_app_country] => US [patent_app_date] => 2006-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 2067 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/537/07537965.pdf [firstpage_image] =>[orig_patent_app_number] => 11471869 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/471869
Manufacturing method for a leadless multi-chip electronic module Jun 20, 2006 Issued
Array ( [id] => 259996 [patent_doc_number] => 07572721 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-08-11 [patent_title] => 'Method of forming a semiconductor device having an etch stop layer and related device' [patent_app_type] => utility [patent_app_number] => 11/424518 [patent_app_country] => US [patent_app_date] => 2006-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 12 [patent_no_of_words] => 6557 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 158 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/572/07572721.pdf [firstpage_image] =>[orig_patent_app_number] => 11424518 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/424518
Method of forming a semiconductor device having an etch stop layer and related device Jun 14, 2006 Issued
Array ( [id] => 4648843 [patent_doc_number] => 20080036098 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-14 [patent_title] => 'CONFIGURABLE UNIVERSAL INTERCONNECT DEVICE' [patent_app_type] => utility [patent_app_number] => 11/424159 [patent_app_country] => US [patent_app_date] => 2006-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2233 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20080036098.pdf [firstpage_image] =>[orig_patent_app_number] => 11424159 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/424159
CONFIGURABLE UNIVERSAL INTERCONNECT DEVICE Jun 13, 2006 Abandoned
Array ( [id] => 13513 [patent_doc_number] => 07807550 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-10-05 [patent_title] => 'Method of making MEMS wafers' [patent_app_type] => utility [patent_app_number] => 11/424059 [patent_app_country] => US [patent_app_date] => 2006-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 21 [patent_no_of_words] => 2566 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 325 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/807/07807550.pdf [firstpage_image] =>[orig_patent_app_number] => 11424059 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/424059
Method of making MEMS wafers Jun 13, 2006 Issued
Array ( [id] => 8256641 [patent_doc_number] => 08206113 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-06-26 [patent_title] => 'Method and apparatus for converting marine wave energy by means of a difference in flow resistance form factors into electricity' [patent_app_type] => utility [patent_app_number] => 12/303186 [patent_app_country] => US [patent_app_date] => 2006-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 7505 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12303186 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/303186
Method and apparatus for converting marine wave energy by means of a difference in flow resistance form factors into electricity Jun 1, 2006 Issued
Array ( [id] => 5751062 [patent_doc_number] => 20060220211 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-10-05 [patent_title] => 'Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance' [patent_app_type] => utility [patent_app_number] => 11/440116 [patent_app_country] => US [patent_app_date] => 2006-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 15384 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0220/20060220211.pdf [firstpage_image] =>[orig_patent_app_number] => 11440116 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/440116
Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance May 24, 2006 Issued
Array ( [id] => 243679 [patent_doc_number] => 07589416 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-09-15 [patent_title] => 'Substrate, electronic component, and manufacturing method of these' [patent_app_type] => utility [patent_app_number] => 11/420219 [patent_app_country] => US [patent_app_date] => 2006-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 61 [patent_no_of_words] => 9680 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/589/07589416.pdf [firstpage_image] =>[orig_patent_app_number] => 11420219 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/420219
Substrate, electronic component, and manufacturing method of these May 23, 2006 Issued
Array ( [id] => 586219 [patent_doc_number] => 07449775 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2008-11-11 [patent_title] => 'Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion' [patent_app_type] => utility [patent_app_number] => 11/439039 [patent_app_country] => US [patent_app_date] => 2006-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 3934 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/449/07449775.pdf [firstpage_image] =>[orig_patent_app_number] => 11439039 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/439039
Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion May 21, 2006 Issued
Array ( [id] => 5028487 [patent_doc_number] => 20070269934 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-11-22 [patent_title] => 'System and method for providing access to an encapsulated device' [patent_app_type] => utility [patent_app_number] => 11/434768 [patent_app_country] => US [patent_app_date] => 2006-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6431 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0269/20070269934.pdf [firstpage_image] =>[orig_patent_app_number] => 11434768 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/434768
System and method for providing access to an encapsulated device May 16, 2006 Issued
Array ( [id] => 202453 [patent_doc_number] => 07632698 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-12-15 [patent_title] => 'Integrated circuit encapsulation and method therefor' [patent_app_type] => utility [patent_app_number] => 11/383649 [patent_app_country] => US [patent_app_date] => 2006-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 1722 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/632/07632698.pdf [firstpage_image] =>[orig_patent_app_number] => 11383649 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/383649
Integrated circuit encapsulation and method therefor May 15, 2006 Issued
Array ( [id] => 5785530 [patent_doc_number] => 20060205117 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-14 [patent_title] => 'Solder masks used in encapsulation, assemblies including the solar mask, and methods' [patent_app_type] => utility [patent_app_number] => 11/434620 [patent_app_country] => US [patent_app_date] => 2006-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4442 [patent_no_of_claims] => 53 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0205/20060205117.pdf [firstpage_image] =>[orig_patent_app_number] => 11434620 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/434620
Solder masks used in encapsulation, assemblies including the solar mask, and methods May 14, 2006 Abandoned
Array ( [id] => 204473 [patent_doc_number] => 07629204 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-12-08 [patent_title] => 'Surface roughening method for embedded semiconductor chip structure' [patent_app_type] => utility [patent_app_number] => 11/432369 [patent_app_country] => US [patent_app_date] => 2006-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 2287 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/629/07629204.pdf [firstpage_image] =>[orig_patent_app_number] => 11432369 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/432369
Surface roughening method for embedded semiconductor chip structure May 11, 2006 Issued
Array ( [id] => 5785574 [patent_doc_number] => 20060205135 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-14 [patent_title] => 'Silicon rich barrier layers for integrated circuit devices' [patent_app_type] => utility [patent_app_number] => 11/430792 [patent_app_country] => US [patent_app_date] => 2006-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3333 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0205/20060205135.pdf [firstpage_image] =>[orig_patent_app_number] => 11430792 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/430792
Silicon rich barrier layers for integrated circuit devices May 8, 2006 Issued
Array ( [id] => 7599488 [patent_doc_number] => 07582960 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-09-01 [patent_title] => 'Multiple chip package module including die stacked over encapsulated package' [patent_app_type] => utility [patent_app_number] => 11/381901 [patent_app_country] => US [patent_app_date] => 2006-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 3770 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/582/07582960.pdf [firstpage_image] =>[orig_patent_app_number] => 11381901 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/381901
Multiple chip package module including die stacked over encapsulated package May 4, 2006 Issued
Array ( [id] => 5659256 [patent_doc_number] => 20060249852 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-09 [patent_title] => 'Flip-chip semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/417548 [patent_app_country] => US [patent_app_date] => 2006-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2935 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0249/20060249852.pdf [firstpage_image] =>[orig_patent_app_number] => 11417548 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/417548
Flip-chip semiconductor device May 2, 2006 Abandoned
Array ( [id] => 425055 [patent_doc_number] => 07271037 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-09-18 [patent_title] => 'Leadframe alteration to direct compound flow into package' [patent_app_type] => utility [patent_app_number] => 11/417620 [patent_app_country] => US [patent_app_date] => 2006-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4462 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/271/07271037.pdf [firstpage_image] =>[orig_patent_app_number] => 11417620 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/417620
Leadframe alteration to direct compound flow into package May 2, 2006 Issued
Array ( [id] => 5683093 [patent_doc_number] => 20060199363 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-07 [patent_title] => 'Microelectronic devices and methods for forming interconnects in microelectronic devices' [patent_app_type] => utility [patent_app_number] => 11/416824 [patent_app_country] => US [patent_app_date] => 2006-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4056 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0199/20060199363.pdf [firstpage_image] =>[orig_patent_app_number] => 11416824 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/416824
Microelectronic devices and methods for forming interconnects in microelectronic devices May 2, 2006 Issued
Array ( [id] => 5889191 [patent_doc_number] => 20060276009 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-12-07 [patent_title] => 'Method for cutting junction Board, and chip' [patent_app_type] => utility [patent_app_number] => 11/415148 [patent_app_country] => US [patent_app_date] => 2006-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 9779 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0276/20060276009.pdf [firstpage_image] =>[orig_patent_app_number] => 11415148 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/415148
Method for cutting junction board, and chip May 1, 2006 Issued
Array ( [id] => 5730317 [patent_doc_number] => 20060255431 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-16 [patent_title] => 'Semiconductor wafer' [patent_app_type] => utility [patent_app_number] => 11/413149 [patent_app_country] => US [patent_app_date] => 2006-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2520 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0255/20060255431.pdf [firstpage_image] =>[orig_patent_app_number] => 11413149 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/413149
Semiconductor wafer Apr 27, 2006 Abandoned
Array ( [id] => 573205 [patent_doc_number] => 07459341 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-12-02 [patent_title] => 'Method of manufacturing an electronic device' [patent_app_type] => utility [patent_app_number] => 11/411884 [patent_app_country] => US [patent_app_date] => 2006-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 44 [patent_no_of_words] => 5458 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/459/07459341.pdf [firstpage_image] =>[orig_patent_app_number] => 11411884 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/411884
Method of manufacturing an electronic device Apr 26, 2006 Issued
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