
David A Zarneke
Examiner (ID: 17793, Phone: (571)272-1937 , Office: P/2891 )
| Most Active Art Unit | 2891 |
| Art Unit(s) | 2829, 2812, 2827, 2891 |
| Total Applications | 2255 |
| Issued Applications | 1829 |
| Pending Applications | 145 |
| Abandoned Applications | 326 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5705376
[patent_doc_number] => 20060194424
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-31
[patent_title] => 'Microfeature devices and methods for manufacturing microfeature devices'
[patent_app_type] => utility
[patent_app_number] => 11/413682
[patent_app_country] => US
[patent_app_date] => 2006-04-27
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0194/20060194424.pdf
[firstpage_image] =>[orig_patent_app_number] => 11413682
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/413682 | Microfeature devices and methods for manufacturing microfeature devices | Apr 26, 2006 | Issued |
Array
(
[id] => 5354556
[patent_doc_number] => 20090185900
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-07-23
[patent_title] => 'WIND-DRIVEN ELECTRICITY GENERATION DEVICE, METHOD OF CONTROLLING WIND-DRIVEN ELECTRICITY GENERATION DEVICE, AND COMPUTER PROGRAM'
[patent_app_type] => utility
[patent_app_number] => 12/298569
[patent_app_country] => US
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[pdf_file] => publications/A1/0185/20090185900.pdf
[firstpage_image] =>[orig_patent_app_number] => 12298569
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/298569 | WIND-DRIVEN ELECTRICITY GENERATION DEVICE, METHOD OF CONTROLLING WIND-DRIVEN ELECTRICITY GENERATION DEVICE, AND COMPUTER PROGRAM | Apr 26, 2006 | Abandoned |
Array
(
[id] => 817489
[patent_doc_number] => 07411297
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-08-12
[patent_title] => 'Microfeature devices and methods for manufacturing microfeature devices'
[patent_app_type] => utility
[patent_app_number] => 11/407435
[patent_app_country] => US
[patent_app_date] => 2006-04-20
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[patent_drawing_sheets_cnt] => 8
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/407435 | Microfeature devices and methods for manufacturing microfeature devices | Apr 19, 2006 | Issued |
Array
(
[id] => 5703234
[patent_doc_number] => 20060192281
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-31
[patent_title] => 'Methods for sealing chambers of microelectronic packages'
[patent_app_type] => utility
[patent_app_number] => 11/406858
[patent_app_country] => US
[patent_app_date] => 2006-04-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/406858 | Methods for sealing chambers of microelectronic packages | Apr 18, 2006 | Abandoned |
Array
(
[id] => 574009
[patent_doc_number] => 07459404
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[patent_kind] => B2
[patent_issue_date] => 2008-12-02
[patent_title] => 'Adhesion improvement for low k dielectrics'
[patent_app_type] => utility
[patent_app_number] => 11/405852
[patent_app_country] => US
[patent_app_date] => 2006-04-18
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/405852 | Adhesion improvement for low k dielectrics | Apr 17, 2006 | Issued |
Array
(
[id] => 5245207
[patent_doc_number] => 20070241441
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-18
[patent_title] => 'MULTICHIP PACKAGE SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 11/379018
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11379018
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/379018 | MULTICHIP PACKAGE SYSTEM | Apr 16, 2006 | Abandoned |
Array
(
[id] => 5848733
[patent_doc_number] => 20060231935
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-10-19
[patent_title] => 'BGA type semiconductor package featuring additional flat electrode teminals, and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/402008
[patent_app_country] => US
[patent_app_date] => 2006-04-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[patent_no_of_words] => 6160
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[firstpage_image] =>[orig_patent_app_number] => 11402008
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/402008 | BGA type semiconductor package featuring additional flat electrode teminals, and method for manufacturing the same | Apr 11, 2006 | Abandoned |
Array
(
[id] => 360085
[patent_doc_number] => 07485964
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-02-03
[patent_title] => 'Dielectric material'
[patent_app_type] => utility
[patent_app_number] => 11/399579
[patent_app_country] => US
[patent_app_date] => 2006-04-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[firstpage_image] =>[orig_patent_app_number] => 11399579
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/399579 | Dielectric material | Apr 5, 2006 | Issued |
Array
(
[id] => 5123583
[patent_doc_number] => 20070235853
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[patent_kind] => A1
[patent_issue_date] => 2007-10-11
[patent_title] => 'Chip package structure'
[patent_app_type] => utility
[patent_app_number] => 11/399129
[patent_app_country] => US
[patent_app_date] => 2006-04-05
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[firstpage_image] =>[orig_patent_app_number] => 11399129
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/399129 | Chip package structure | Apr 4, 2006 | Issued |
Array
(
[id] => 4506717
[patent_doc_number] => 07915081
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[patent_kind] => B2
[patent_issue_date] => 2011-03-29
[patent_title] => 'Flexible interconnect pattern on semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 11/395549
[patent_app_country] => US
[patent_app_date] => 2006-03-31
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[firstpage_image] =>[orig_patent_app_number] => 11395549
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/395549 | Flexible interconnect pattern on semiconductor package | Mar 30, 2006 | Issued |
Array
(
[id] => 5253444
[patent_doc_number] => 20070134900
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[patent_issue_date] => 2007-06-14
[patent_title] => 'Method of improving adhesion strength of low dielectric constant layers'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/394529 | Method of improving adhesion strength of low dielectric constant layers | Mar 29, 2006 | Issued |
Array
(
[id] => 5754087
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[patent_title] => 'Method of manufacturing flexible circuit substrate'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/392308 | Method of manufacturing flexible circuit substrate | Mar 28, 2006 | Abandoned |
Array
(
[id] => 5750794
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[patent_title] => 'System and method for identification of a reference integrated circuit for a pick-and-place equipment'
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Array
(
[id] => 555567
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[patent_title] => 'Semiconductor wafer treatment method'
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Array
(
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Array
(
[id] => 5869112
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Array
(
[id] => 5677950
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Array
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Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/277149 | Semiconductor wafer and method for making the same | Mar 21, 2006 | Issued |