David E. Graybill

Array ( [id] => 8657100 [patent_doc_number] => 20130037929 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-14 [patent_title] => 'STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODS' [patent_app_type] => utility [patent_app_number] => 13/206346 [patent_app_country] => US [patent_app_date] => 2011-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 6192 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13206346 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7762651 [patent_doc_number] => 20120032224 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-02-09 [patent_title] => 'ELECTRICAL CONNECTION STRUCTURE AND LIGHT EMITTING DIODE MODULE, FABRIC CIRCUITS, AND SIGNAL TEXTILE HAVING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/205906 [patent_app_country] => US [patent_app_date] => 2011-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2789 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0032/20120032224.pdf [firstpage_image] =>[orig_patent_app_number] => 13205906 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7577422 [patent_doc_number] => 20110291304 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-12-01 [patent_title] => 'METHOD OF MAKING MICROELECTRONIC PACKAGE USING INTEGRATED HEAT SPREADER STIFFENER PANEL AND MICROELECTRONIC PACKAGE FORMED ACCORDING TO THE METHOD' [patent_app_type] => utility [patent_app_number] => 13/206408 [patent_app_country] => US [patent_app_date] => 2011-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2943 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0291/20110291304.pdf [firstpage_image] =>[orig_patent_app_number] => 13206408 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7805226 [patent_doc_number] => 20120056178 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-08 [patent_title] => 'MULTI-CHIP PACKAGES' [patent_app_type] => utility [patent_app_number] => 13/205916 [patent_app_country] => US [patent_app_date] => 2011-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5284 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0056/20120056178.pdf [firstpage_image] =>[orig_patent_app_number] => 13205916 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8414435 [patent_doc_number] => 20120241935 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-09-27 [patent_title] => 'PACKAGE-ON-PACKAGE STRUCTURE' [patent_app_type] => utility [patent_app_number] => 13/205649 [patent_app_country] => US [patent_app_date] => 2011-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3035 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13205649 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8657102 [patent_doc_number] => 20130037931 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-14 [patent_title] => 'SEMICONDUCTOR PACKAGE WITH A HEAT SPREADER AND METHOD OF MAKING' [patent_app_type] => utility [patent_app_number] => 13/205228 [patent_app_country] => US [patent_app_date] => 2011-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3581 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13205228 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7567521 [patent_doc_number] => 20110287584 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-11-24 [patent_title] => 'SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/197249 [patent_app_country] => US [patent_app_date] => 2011-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 9675 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0287/20110287584.pdf [firstpage_image] =>[orig_patent_app_number] => 13197249 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8647222 [patent_doc_number] => 20130032952 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-07 [patent_title] => 'Semiconductor Device and Method of Forming POP With Stacked Semiconductor Die and Bumps Formed Directly on the Lower Die' [patent_app_type] => utility [patent_app_number] => 13/195636 [patent_app_country] => US [patent_app_date] => 2011-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 6443 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13195636 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8647205 [patent_doc_number] => 20130032934 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-07 [patent_title] => 'PACKAGED MICROELECTRONIC ELEMENTS HAVING BLIND VIAS FOR HEAT DISSIPATION' [patent_app_type] => utility [patent_app_number] => 13/195786 [patent_app_country] => US [patent_app_date] => 2011-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 10917 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13195786 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8368238 [patent_doc_number] => 20120217627 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-08-30 [patent_title] => 'PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/191793 [patent_app_country] => US [patent_app_date] => 2011-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2982 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13191793 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7586891 [patent_doc_number] => 20110281401 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-11-17 [patent_title] => 'SEMICONDUCTOR DEVICE MANUFACTURING METHOD' [patent_app_type] => utility [patent_app_number] => 13/190052 [patent_app_country] => US [patent_app_date] => 2011-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 7988 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0281/20110281401.pdf [firstpage_image] =>[orig_patent_app_number] => 13190052 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8192994 [patent_doc_number] => 20120119350 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-05-17 [patent_title] => 'Heat Sink Module' [patent_app_type] => utility [patent_app_number] => 13/189682 [patent_app_country] => US [patent_app_date] => 2011-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 2336 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0119/20120119350.pdf [firstpage_image] =>[orig_patent_app_number] => 13189682 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11510251 [patent_doc_number] => 09601417 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-03-21 [patent_title] => '“L” shaped lead integrated circuit package' [patent_app_type] => utility [patent_app_number] => 13/187380 [patent_app_country] => US [patent_app_date] => 2011-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 3365 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13187380 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8304455 [patent_doc_number] => 08225982 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-07-24 [patent_title] => 'Dual capillary IC wirebonding' [patent_app_type] => utility [patent_app_number] => 13/187223 [patent_app_country] => US [patent_app_date] => 2011-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 11 [patent_no_of_words] => 4766 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13187223 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10645322 [patent_doc_number] => 09362196 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-06-07 [patent_title] => 'Semiconductor package and mobile device using the same' [patent_app_type] => utility [patent_app_number] => 13/181737 [patent_app_country] => US [patent_app_date] => 2011-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 22 [patent_no_of_words] => 6598 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 172 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13181737 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8261880 [patent_doc_number] => 20120161309 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-06-28 [patent_title] => 'SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 13/179665 [patent_app_country] => US [patent_app_date] => 2011-07-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1693 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13179665 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8249127 [patent_doc_number] => 20120153451 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-06-21 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/178952 [patent_app_country] => US [patent_app_date] => 2011-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4830 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0153/20120153451.pdf [firstpage_image] =>[orig_patent_app_number] => 13178952 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8676089 [patent_doc_number] => 08384205 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-02-26 [patent_title] => 'Electronic device package and method of manufacture' [patent_app_type] => utility [patent_app_number] => 13/174970 [patent_app_country] => US [patent_app_date] => 2011-07-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 14 [patent_no_of_words] => 4788 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13174970 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7506810 [patent_doc_number] => 20110254147 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-10-20 [patent_title] => 'SEMICONDUCTOR EQUIPMENT AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/173647 [patent_app_country] => US [patent_app_date] => 2011-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 14767 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0254/20110254147.pdf [firstpage_image] =>[orig_patent_app_number] => 13173647 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8147161 [patent_doc_number] => 08164172 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-04-24 [patent_title] => 'Integrated circuit package in package system' [patent_app_type] => utility [patent_app_number] => 13/166417 [patent_app_country] => US [patent_app_date] => 2011-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 5862 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/164/08164172.pdf [firstpage_image] =>[orig_patent_app_number] => 13166417 [rel_patent_id] =>[rel_patent_doc_number] =>)