Search

David E. Graybill

Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )

Most Active Art Unit
2894
Art Unit(s)
2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 10583735 [patent_doc_number] => 09305861 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-04-05 [patent_title] => 'Method and system for electrically coupling a chip to chip package' [patent_app_type] => utility [patent_app_number] => 13/243820 [patent_app_country] => US [patent_app_date] => 2011-09-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3446 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13243820 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/243820
Method and system for electrically coupling a chip to chip package Sep 22, 2011 Issued
Array ( [id] => 8042399 [patent_doc_number] => 20120070928 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-22 [patent_title] => 'THIN FILM DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/235337 [patent_app_country] => US [patent_app_date] => 2011-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 10134 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0070/20120070928.pdf [firstpage_image] =>[orig_patent_app_number] => 13235337 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/235337
THIN FILM DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME Sep 15, 2011 Abandoned
Array ( [id] => 7815189 [patent_doc_number] => 20120061809 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-15 [patent_title] => 'METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/234630 [patent_app_country] => US [patent_app_date] => 2011-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5416 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0061/20120061809.pdf [firstpage_image] =>[orig_patent_app_number] => 13234630 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/234630
METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE Sep 15, 2011 Abandoned
Array ( [id] => 9978023 [patent_doc_number] => 09024335 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-05-05 [patent_title] => 'Multi-package white LED device' [patent_app_type] => utility [patent_app_number] => 13/818159 [patent_app_country] => US [patent_app_date] => 2011-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 49 [patent_figures_cnt] => 52 [patent_no_of_words] => 11012 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13818159 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/818159
Multi-package white LED device Aug 21, 2011 Issued
Array ( [id] => 8657100 [patent_doc_number] => 20130037929 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-14 [patent_title] => 'STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODS' [patent_app_type] => utility [patent_app_number] => 13/206346 [patent_app_country] => US [patent_app_date] => 2011-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 6192 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13206346 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/206346
STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODS Aug 8, 2011 Abandoned
Array ( [id] => 7577422 [patent_doc_number] => 20110291304 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-12-01 [patent_title] => 'METHOD OF MAKING MICROELECTRONIC PACKAGE USING INTEGRATED HEAT SPREADER STIFFENER PANEL AND MICROELECTRONIC PACKAGE FORMED ACCORDING TO THE METHOD' [patent_app_type] => utility [patent_app_number] => 13/206408 [patent_app_country] => US [patent_app_date] => 2011-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2943 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0291/20110291304.pdf [firstpage_image] =>[orig_patent_app_number] => 13206408 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/206408
METHOD OF MAKING MICROELECTRONIC PACKAGE USING INTEGRATED HEAT SPREADER STIFFENER PANEL AND MICROELECTRONIC PACKAGE FORMED ACCORDING TO THE METHOD Aug 8, 2011 Abandoned
Array ( [id] => 7762651 [patent_doc_number] => 20120032224 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-02-09 [patent_title] => 'ELECTRICAL CONNECTION STRUCTURE AND LIGHT EMITTING DIODE MODULE, FABRIC CIRCUITS, AND SIGNAL TEXTILE HAVING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/205906 [patent_app_country] => US [patent_app_date] => 2011-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2789 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0032/20120032224.pdf [firstpage_image] =>[orig_patent_app_number] => 13205906 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/205906
ELECTRICAL CONNECTION STRUCTURE AND LIGHT EMITTING DIODE MODULE, FABRIC CIRCUITS, AND SIGNAL TEXTILE HAVING THE SAME Aug 8, 2011 Abandoned
Array ( [id] => 7805226 [patent_doc_number] => 20120056178 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-08 [patent_title] => 'MULTI-CHIP PACKAGES' [patent_app_type] => utility [patent_app_number] => 13/205916 [patent_app_country] => US [patent_app_date] => 2011-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5284 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0056/20120056178.pdf [firstpage_image] =>[orig_patent_app_number] => 13205916 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/205916
MULTI-CHIP PACKAGES Aug 8, 2011 Abandoned
Array ( [id] => 8414435 [patent_doc_number] => 20120241935 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-09-27 [patent_title] => 'PACKAGE-ON-PACKAGE STRUCTURE' [patent_app_type] => utility [patent_app_number] => 13/205649 [patent_app_country] => US [patent_app_date] => 2011-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3035 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13205649 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/205649
PACKAGE-ON-PACKAGE STRUCTURE Aug 8, 2011 Abandoned
Array ( [id] => 8657102 [patent_doc_number] => 20130037931 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-14 [patent_title] => 'SEMICONDUCTOR PACKAGE WITH A HEAT SPREADER AND METHOD OF MAKING' [patent_app_type] => utility [patent_app_number] => 13/205228 [patent_app_country] => US [patent_app_date] => 2011-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3581 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13205228 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/205228
SEMICONDUCTOR PACKAGE WITH A HEAT SPREADER AND METHOD OF MAKING Aug 7, 2011 Abandoned
Array ( [id] => 7567521 [patent_doc_number] => 20110287584 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-11-24 [patent_title] => 'SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/197249 [patent_app_country] => US [patent_app_date] => 2011-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 9675 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0287/20110287584.pdf [firstpage_image] =>[orig_patent_app_number] => 13197249 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/197249
SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURING THE SAME Aug 2, 2011 Abandoned
Array ( [id] => 8647222 [patent_doc_number] => 20130032952 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-07 [patent_title] => 'Semiconductor Device and Method of Forming POP With Stacked Semiconductor Die and Bumps Formed Directly on the Lower Die' [patent_app_type] => utility [patent_app_number] => 13/195636 [patent_app_country] => US [patent_app_date] => 2011-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 6443 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13195636 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/195636
Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die Jul 31, 2011 Issued
Array ( [id] => 8647205 [patent_doc_number] => 20130032934 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-07 [patent_title] => 'PACKAGED MICROELECTRONIC ELEMENTS HAVING BLIND VIAS FOR HEAT DISSIPATION' [patent_app_type] => utility [patent_app_number] => 13/195786 [patent_app_country] => US [patent_app_date] => 2011-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 10917 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13195786 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/195786
Packaged microelectronic elements having blind vias for heat dissipation Jul 31, 2011 Issued
Array ( [id] => 8368238 [patent_doc_number] => 20120217627 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-08-30 [patent_title] => 'PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/191793 [patent_app_country] => US [patent_app_date] => 2011-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2982 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13191793 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/191793
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME Jul 26, 2011 Abandoned
Array ( [id] => 8192994 [patent_doc_number] => 20120119350 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-05-17 [patent_title] => 'Heat Sink Module' [patent_app_type] => utility [patent_app_number] => 13/189682 [patent_app_country] => US [patent_app_date] => 2011-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 2336 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0119/20120119350.pdf [firstpage_image] =>[orig_patent_app_number] => 13189682 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/189682
Heat Sink Module Jul 24, 2011 Abandoned
Array ( [id] => 7586891 [patent_doc_number] => 20110281401 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-11-17 [patent_title] => 'SEMICONDUCTOR DEVICE MANUFACTURING METHOD' [patent_app_type] => utility [patent_app_number] => 13/190052 [patent_app_country] => US [patent_app_date] => 2011-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 7988 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0281/20110281401.pdf [firstpage_image] =>[orig_patent_app_number] => 13190052 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/190052
Semiconductor device manufacturing method Jul 24, 2011 Issued
Array ( [id] => 8304455 [patent_doc_number] => 08225982 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-07-24 [patent_title] => 'Dual capillary IC wirebonding' [patent_app_type] => utility [patent_app_number] => 13/187223 [patent_app_country] => US [patent_app_date] => 2011-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 11 [patent_no_of_words] => 4766 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13187223 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/187223
Dual capillary IC wirebonding Jul 19, 2011 Issued
Array ( [id] => 11510251 [patent_doc_number] => 09601417 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-03-21 [patent_title] => '“L” shaped lead integrated circuit package' [patent_app_type] => utility [patent_app_number] => 13/187380 [patent_app_country] => US [patent_app_date] => 2011-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 3365 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13187380 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/187380
“L” shaped lead integrated circuit package Jul 19, 2011 Issued
Array ( [id] => 10645322 [patent_doc_number] => 09362196 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-06-07 [patent_title] => 'Semiconductor package and mobile device using the same' [patent_app_type] => utility [patent_app_number] => 13/181737 [patent_app_country] => US [patent_app_date] => 2011-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 22 [patent_no_of_words] => 6598 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 172 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13181737 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/181737
Semiconductor package and mobile device using the same Jul 12, 2011 Issued
Array ( [id] => 8261880 [patent_doc_number] => 20120161309 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-06-28 [patent_title] => 'SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 13/179665 [patent_app_country] => US [patent_app_date] => 2011-07-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1693 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13179665 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/179665
SEMICONDUCTOR PACKAGE Jul 10, 2011 Abandoned
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