
David E. Graybill
Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )
| Most Active Art Unit | 2894 |
| Art Unit(s) | 2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10583735
[patent_doc_number] => 09305861
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-04-05
[patent_title] => 'Method and system for electrically coupling a chip to chip package'
[patent_app_type] => utility
[patent_app_number] => 13/243820
[patent_app_country] => US
[patent_app_date] => 2011-09-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 3446
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 118
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13243820
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/243820 | Method and system for electrically coupling a chip to chip package | Sep 22, 2011 | Issued |
Array
(
[id] => 8042399
[patent_doc_number] => 20120070928
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-22
[patent_title] => 'THIN FILM DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/235337
[patent_app_country] => US
[patent_app_date] => 2011-09-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 10134
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0070/20120070928.pdf
[firstpage_image] =>[orig_patent_app_number] => 13235337
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/235337 | THIN FILM DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME | Sep 15, 2011 | Abandoned |
Array
(
[id] => 7815189
[patent_doc_number] => 20120061809
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-15
[patent_title] => 'METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/234630
[patent_app_country] => US
[patent_app_date] => 2011-09-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 5416
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0061/20120061809.pdf
[firstpage_image] =>[orig_patent_app_number] => 13234630
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/234630 | METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE | Sep 15, 2011 | Abandoned |
Array
(
[id] => 9978023
[patent_doc_number] => 09024335
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-05-05
[patent_title] => 'Multi-package white LED device'
[patent_app_type] => utility
[patent_app_number] => 13/818159
[patent_app_country] => US
[patent_app_date] => 2011-08-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 49
[patent_figures_cnt] => 52
[patent_no_of_words] => 11012
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 195
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13818159
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/818159 | Multi-package white LED device | Aug 21, 2011 | Issued |
Array
(
[id] => 8657100
[patent_doc_number] => 20130037929
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-02-14
[patent_title] => 'STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODS'
[patent_app_type] => utility
[patent_app_number] => 13/206346
[patent_app_country] => US
[patent_app_date] => 2011-08-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 6192
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13206346
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/206346 | STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODS | Aug 8, 2011 | Abandoned |
Array
(
[id] => 7577422
[patent_doc_number] => 20110291304
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-12-01
[patent_title] => 'METHOD OF MAKING MICROELECTRONIC PACKAGE USING INTEGRATED HEAT SPREADER STIFFENER PANEL AND MICROELECTRONIC PACKAGE FORMED ACCORDING TO THE METHOD'
[patent_app_type] => utility
[patent_app_number] => 13/206408
[patent_app_country] => US
[patent_app_date] => 2011-08-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2943
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0291/20110291304.pdf
[firstpage_image] =>[orig_patent_app_number] => 13206408
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/206408 | METHOD OF MAKING MICROELECTRONIC PACKAGE USING INTEGRATED HEAT SPREADER STIFFENER PANEL AND MICROELECTRONIC PACKAGE FORMED ACCORDING TO THE METHOD | Aug 8, 2011 | Abandoned |
Array
(
[id] => 7762651
[patent_doc_number] => 20120032224
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-02-09
[patent_title] => 'ELECTRICAL CONNECTION STRUCTURE AND LIGHT EMITTING DIODE MODULE, FABRIC CIRCUITS, AND SIGNAL TEXTILE HAVING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/205906
[patent_app_country] => US
[patent_app_date] => 2011-08-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2789
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0032/20120032224.pdf
[firstpage_image] =>[orig_patent_app_number] => 13205906
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/205906 | ELECTRICAL CONNECTION STRUCTURE AND LIGHT EMITTING DIODE MODULE, FABRIC CIRCUITS, AND SIGNAL TEXTILE HAVING THE SAME | Aug 8, 2011 | Abandoned |
Array
(
[id] => 7805226
[patent_doc_number] => 20120056178
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-08
[patent_title] => 'MULTI-CHIP PACKAGES'
[patent_app_type] => utility
[patent_app_number] => 13/205916
[patent_app_country] => US
[patent_app_date] => 2011-08-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 5284
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0056/20120056178.pdf
[firstpage_image] =>[orig_patent_app_number] => 13205916
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/205916 | MULTI-CHIP PACKAGES | Aug 8, 2011 | Abandoned |
Array
(
[id] => 8414435
[patent_doc_number] => 20120241935
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-09-27
[patent_title] => 'PACKAGE-ON-PACKAGE STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 13/205649
[patent_app_country] => US
[patent_app_date] => 2011-08-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3035
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13205649
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/205649 | PACKAGE-ON-PACKAGE STRUCTURE | Aug 8, 2011 | Abandoned |
Array
(
[id] => 8657102
[patent_doc_number] => 20130037931
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-02-14
[patent_title] => 'SEMICONDUCTOR PACKAGE WITH A HEAT SPREADER AND METHOD OF MAKING'
[patent_app_type] => utility
[patent_app_number] => 13/205228
[patent_app_country] => US
[patent_app_date] => 2011-08-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 3581
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13205228
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/205228 | SEMICONDUCTOR PACKAGE WITH A HEAT SPREADER AND METHOD OF MAKING | Aug 7, 2011 | Abandoned |
Array
(
[id] => 7567521
[patent_doc_number] => 20110287584
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-11-24
[patent_title] => 'SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/197249
[patent_app_country] => US
[patent_app_date] => 2011-08-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 9675
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0287/20110287584.pdf
[firstpage_image] =>[orig_patent_app_number] => 13197249
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/197249 | SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURING THE SAME | Aug 2, 2011 | Abandoned |
Array
(
[id] => 8647222
[patent_doc_number] => 20130032952
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-02-07
[patent_title] => 'Semiconductor Device and Method of Forming POP With Stacked Semiconductor Die and Bumps Formed Directly on the Lower Die'
[patent_app_type] => utility
[patent_app_number] => 13/195636
[patent_app_country] => US
[patent_app_date] => 2011-08-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 6443
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13195636
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/195636 | Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die | Jul 31, 2011 | Issued |
Array
(
[id] => 8647205
[patent_doc_number] => 20130032934
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-02-07
[patent_title] => 'PACKAGED MICROELECTRONIC ELEMENTS HAVING BLIND VIAS FOR HEAT DISSIPATION'
[patent_app_type] => utility
[patent_app_number] => 13/195786
[patent_app_country] => US
[patent_app_date] => 2011-08-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 10917
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13195786
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/195786 | Packaged microelectronic elements having blind vias for heat dissipation | Jul 31, 2011 | Issued |
Array
(
[id] => 8368238
[patent_doc_number] => 20120217627
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-08-30
[patent_title] => 'PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/191793
[patent_app_country] => US
[patent_app_date] => 2011-07-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2982
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13191793
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/191793 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | Jul 26, 2011 | Abandoned |
Array
(
[id] => 8192994
[patent_doc_number] => 20120119350
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-05-17
[patent_title] => 'Heat Sink Module'
[patent_app_type] => utility
[patent_app_number] => 13/189682
[patent_app_country] => US
[patent_app_date] => 2011-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 2336
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0119/20120119350.pdf
[firstpage_image] =>[orig_patent_app_number] => 13189682
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/189682 | Heat Sink Module | Jul 24, 2011 | Abandoned |
Array
(
[id] => 7586891
[patent_doc_number] => 20110281401
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-11-17
[patent_title] => 'SEMICONDUCTOR DEVICE MANUFACTURING METHOD'
[patent_app_type] => utility
[patent_app_number] => 13/190052
[patent_app_country] => US
[patent_app_date] => 2011-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 7988
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0281/20110281401.pdf
[firstpage_image] =>[orig_patent_app_number] => 13190052
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/190052 | Semiconductor device manufacturing method | Jul 24, 2011 | Issued |
Array
(
[id] => 8304455
[patent_doc_number] => 08225982
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-07-24
[patent_title] => 'Dual capillary IC wirebonding'
[patent_app_type] => utility
[patent_app_number] => 13/187223
[patent_app_country] => US
[patent_app_date] => 2011-07-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 11
[patent_no_of_words] => 4766
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 81
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13187223
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/187223 | Dual capillary IC wirebonding | Jul 19, 2011 | Issued |
Array
(
[id] => 11510251
[patent_doc_number] => 09601417
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-03-21
[patent_title] => '“L” shaped lead integrated circuit package'
[patent_app_type] => utility
[patent_app_number] => 13/187380
[patent_app_country] => US
[patent_app_date] => 2011-07-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 15
[patent_no_of_words] => 3365
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 80
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13187380
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/187380 | “L†shaped lead integrated circuit package | Jul 19, 2011 | Issued |
Array
(
[id] => 10645322
[patent_doc_number] => 09362196
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-06-07
[patent_title] => 'Semiconductor package and mobile device using the same'
[patent_app_type] => utility
[patent_app_number] => 13/181737
[patent_app_country] => US
[patent_app_date] => 2011-07-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 22
[patent_no_of_words] => 6598
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 172
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13181737
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/181737 | Semiconductor package and mobile device using the same | Jul 12, 2011 | Issued |
Array
(
[id] => 8261880
[patent_doc_number] => 20120161309
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-06-28
[patent_title] => 'SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 13/179665
[patent_app_country] => US
[patent_app_date] => 2011-07-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 1693
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13179665
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/179665 | SEMICONDUCTOR PACKAGE | Jul 10, 2011 | Abandoned |