Search

David E. Graybill

Examiner (ID: 10415, Phone: (571)272-1930 , Office: P/2894 )

Most Active Art Unit
2894
Art Unit(s)
2894, 2822, 2814, 2812, 1763, 2827, 3727, 1107
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 8070633 [patent_doc_number] => 20110241708 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-10-06 [patent_title] => 'APPARATUS FOR PREDETERMINED COMPONENT PLACEMENT TO A TARGET PLATFORM' [patent_app_type] => utility [patent_app_number] => 13/157543 [patent_app_country] => US [patent_app_date] => 2011-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 12881 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0241/20110241708.pdf [firstpage_image] =>[orig_patent_app_number] => 13157543 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/157543
APPARATUS FOR PREDETERMINED COMPONENT PLACEMENT TO A TARGET PLATFORM Jun 9, 2011 Abandoned
Array ( [id] => 8435984 [patent_doc_number] => 08283755 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-10-09 [patent_title] => 'Multichip semiconductor device, chip therefor and method of formation thereof' [patent_app_type] => utility [patent_app_number] => 13/067180 [patent_app_country] => US [patent_app_date] => 2011-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 76 [patent_no_of_words] => 16390 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13067180 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/067180
Multichip semiconductor device, chip therefor and method of formation thereof May 12, 2011 Issued
Array ( [id] => 5932414 [patent_doc_number] => 20110210395 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-09-01 [patent_title] => 'TRANSISTORS WITH IMMERSED CONTACTS' [patent_app_type] => utility [patent_app_number] => 13/105484 [patent_app_country] => US [patent_app_date] => 2011-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 2824 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0210/20110210395.pdf [firstpage_image] =>[orig_patent_app_number] => 13105484 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/105484
Transistors with immersed contacts May 10, 2011 Issued
Array ( [id] => 7698901 [patent_doc_number] => 20110227689 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-09-22 [patent_title] => 'Method of Creating Spiral Inductor having High Q Value' [patent_app_type] => utility [patent_app_number] => 13/102531 [patent_app_country] => US [patent_app_date] => 2011-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2268 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0227/20110227689.pdf [firstpage_image] =>[orig_patent_app_number] => 13102531 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/102531
Method of creating spiral inductor having high Q value May 5, 2011 Issued
Array ( [id] => 9324104 [patent_doc_number] => 08659130 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-02-25 [patent_title] => 'Power module and power module manufacturing method' [patent_app_type] => utility [patent_app_number] => 13/640512 [patent_app_country] => US [patent_app_date] => 2011-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 30 [patent_figures_cnt] => 30 [patent_no_of_words] => 21967 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13640512 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/640512
Power module and power module manufacturing method Apr 25, 2011 Issued
Array ( [id] => 8920872 [patent_doc_number] => 08486805 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-07-16 [patent_title] => 'Through-silicon via and method for forming the same' [patent_app_type] => utility [patent_app_number] => 13/142757 [patent_app_country] => US [patent_app_date] => 2011-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 19 [patent_no_of_words] => 3937 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13142757 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/142757
Through-silicon via and method for forming the same Apr 10, 2011 Issued
Array ( [id] => 8426746 [patent_doc_number] => 20120248621 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-10-04 [patent_title] => 'METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS' [patent_app_type] => utility [patent_app_number] => 13/077292 [patent_app_country] => US [patent_app_date] => 2011-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 10833 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13077292 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/077292
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS Mar 30, 2011 Abandoned
Array ( [id] => 6047770 [patent_doc_number] => 20110207300 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-08-25 [patent_title] => 'ELECTRONIC DEVICES' [patent_app_type] => utility [patent_app_number] => 13/072593 [patent_app_country] => US [patent_app_date] => 2011-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 10628 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0207/20110207300.pdf [firstpage_image] =>[orig_patent_app_number] => 13072593 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/072593
ELECTRONIC DEVICES Mar 24, 2011 Abandoned
Array ( [id] => 9691645 [patent_doc_number] => 08822238 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-09-02 [patent_title] => 'Apparatus and method for predetermined component placement to a target platform' [patent_app_type] => utility [patent_app_number] => 13/049302 [patent_app_country] => US [patent_app_date] => 2011-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 23 [patent_no_of_words] => 12853 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 190 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13049302 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/049302
Apparatus and method for predetermined component placement to a target platform Mar 15, 2011 Issued
Array ( [id] => 6153090 [patent_doc_number] => 20110156001 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-06-30 [patent_title] => 'NITRIDE-BASED LIGHT-EMITTING DEVICE' [patent_app_type] => utility [patent_app_number] => 13/046490 [patent_app_country] => US [patent_app_date] => 2011-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4411 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0156/20110156001.pdf [firstpage_image] =>[orig_patent_app_number] => 13046490 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/046490
Nitride-based light-emitting device Mar 10, 2011 Issued
Array ( [id] => 6015838 [patent_doc_number] => 20110223699 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-09-15 [patent_title] => 'Wiring Material, Semiconductor Device Provided with a Wiring Using the Wiring Material and Method of Manufacturing Thereof' [patent_app_type] => utility [patent_app_number] => 13/042751 [patent_app_country] => US [patent_app_date] => 2011-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 27 [patent_no_of_words] => 14097 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0223/20110223699.pdf [firstpage_image] =>[orig_patent_app_number] => 13042751 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/042751
Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof Mar 7, 2011 Issued
Array ( [id] => 8680900 [patent_doc_number] => 20130049184 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-28 [patent_title] => 'ELECTRIC DEVICE AND PRODUCTION METHOD THEREFOR' [patent_app_type] => utility [patent_app_number] => 13/583044 [patent_app_country] => US [patent_app_date] => 2011-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 9006 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13583044 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/583044
ELECTRIC DEVICE AND PRODUCTION METHOD THEREFOR Mar 3, 2011 Abandoned
Array ( [id] => 10876111 [patent_doc_number] => 08900896 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2014-12-02 [patent_title] => 'Implantation before epitaxial growth for photonic integrated circuits' [patent_app_type] => utility [patent_app_number] => 13/030094 [patent_app_country] => US [patent_app_date] => 2011-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 5760 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13030094 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/030094
Implantation before epitaxial growth for photonic integrated circuits Feb 16, 2011 Issued
Array ( [id] => 6143700 [patent_doc_number] => 20110130005 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-06-02 [patent_title] => 'PROCESSING FOR OVERCOMING EXTREME TOPOGRAPHY' [patent_app_type] => utility [patent_app_number] => 13/024711 [patent_app_country] => US [patent_app_date] => 2011-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3563 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0130/20110130005.pdf [firstpage_image] =>[orig_patent_app_number] => 13024711 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/024711
Processing for overcoming extreme topography Feb 9, 2011 Issued
Array ( [id] => 6208404 [patent_doc_number] => 20110133322 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-06-09 [patent_title] => 'LEADFRAME FOR LEADLESS PACKAGE, STRUCTURE AND MANUFACTURING METHOD USING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/016341 [patent_app_country] => US [patent_app_date] => 2011-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2073 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0133/20110133322.pdf [firstpage_image] =>[orig_patent_app_number] => 13016341 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/016341
Leadframe for leadless package, structure and manufacturing method using the same Jan 27, 2011 Issued
Array ( [id] => 6212999 [patent_doc_number] => 20110136299 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-06-09 [patent_title] => 'LEADFRAME FOR LEADLESS PACKAGE, STRUCTURE AND MANUFACTURING METHOD USING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/016453 [patent_app_country] => US [patent_app_date] => 2011-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2073 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0136/20110136299.pdf [firstpage_image] =>[orig_patent_app_number] => 13016453 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/016453
Leadframe for leadless package, structure and manufacturing method using the same Jan 27, 2011 Issued
Array ( [id] => 8166463 [patent_doc_number] => 20120104609 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-05-03 [patent_title] => 'DISCRETE CIRCUIT COMPONENT HAVING COPPER BLOCK ELECTRODES AND METHOD OF FABRICATION' [patent_app_type] => utility [patent_app_number] => 12/985547 [patent_app_country] => US [patent_app_date] => 2011-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2773 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0104/20120104609.pdf [firstpage_image] =>[orig_patent_app_number] => 12985547 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/985547
DISCRETE CIRCUIT COMPONENT HAVING COPPER BLOCK ELECTRODES AND METHOD OF FABRICATION Jan 5, 2011 Abandoned
Array ( [id] => 6058991 [patent_doc_number] => 20110198762 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-08-18 [patent_title] => 'PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC' [patent_app_type] => utility [patent_app_number] => 12/985212 [patent_app_country] => US [patent_app_date] => 2011-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4228 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0198/20110198762.pdf [firstpage_image] =>[orig_patent_app_number] => 12985212 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/985212
PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC Jan 4, 2011 Abandoned
Array ( [id] => 6189125 [patent_doc_number] => 20110171812 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-07-14 [patent_title] => 'FABRICATION OF SUBSTRATES WITH A USEFUL LAYER OF MONOCRYSTALLINE SEMICONDUCTOR MATERIAL' [patent_app_type] => utility [patent_app_number] => 12/984895 [patent_app_country] => US [patent_app_date] => 2011-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 7932 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0171/20110171812.pdf [firstpage_image] =>[orig_patent_app_number] => 12984895 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/984895
Fabrication of substrates with a useful layer of monocrystalline semiconductor material Jan 4, 2011 Issued
Array ( [id] => 5940902 [patent_doc_number] => 20110101522 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-05-05 [patent_title] => 'Multichip semiconductor device, chip therefor and method of formation thereof' [patent_app_type] => utility [patent_app_number] => 12/926104 [patent_app_country] => US [patent_app_date] => 2010-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 16262 [patent_no_of_claims] => 60 [patent_no_of_ind_claims] => 22 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0101/20110101522.pdf [firstpage_image] =>[orig_patent_app_number] => 12926104 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/926104
Multichip semiconductor device, chip therefor and method of formation thereof Oct 25, 2010 Issued
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