
David E. Graybill
Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )
| Most Active Art Unit | 2894 |
| Art Unit(s) | 2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4574226
[patent_doc_number] => 07855147
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[patent_issue_date] => 2010-12-21
[patent_title] => 'Methods and apparatus for engineering an interface between a diffusion barrier layer and a seed layer'
[patent_app_type] => utility
[patent_app_number] => 11/807178
[patent_app_country] => US
[patent_app_date] => 2007-05-24
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[pdf_file] => patents/07/855/07855147.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/807178 | Methods and apparatus for engineering an interface between a diffusion barrier layer and a seed layer | May 23, 2007 | Issued |
Array
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[patent_doc_number] => 08158450
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2012-04-17
[patent_title] => 'Barrier films and high throughput manufacturing processes for photovoltaic devices'
[patent_app_type] => utility
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[patent_app_date] => 2007-05-10
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/746799 | Barrier films and high throughput manufacturing processes for photovoltaic devices | May 9, 2007 | Issued |
Array
(
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[patent_doc_number] => 20080273410
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-11-06
[patent_title] => 'Tungsten digitlines'
[patent_app_type] => utility
[patent_app_number] => 11/800199
[patent_app_country] => US
[patent_app_date] => 2007-05-04
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/800199 | Tungsten digitlines | May 3, 2007 | Abandoned |
Array
(
[id] => 4770299
[patent_doc_number] => 20080055957
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[patent_kind] => A1
[patent_issue_date] => 2008-03-06
[patent_title] => 'Three-Dimensional Memory Module (3D-MM) Excelling Contemporary Micro-Drive (CMD)'
[patent_app_type] => utility
[patent_app_number] => 11/736781
[patent_app_country] => US
[patent_app_date] => 2007-04-18
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/736781 | Three-Dimensional Memory Module (3D-MM) Excelling Contemporary Micro-Drive (CMD) | Apr 17, 2007 | Abandoned |
Array
(
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[patent_kind] => B2
[patent_issue_date] => 2014-05-27
[patent_title] => 'System in package (SIP) with dual laminate interposers'
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[patent_app_number] => 11/786610
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[patent_app_date] => 2007-04-12
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11786610
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/786610 | System in package (SIP) with dual laminate interposers | Apr 11, 2007 | Issued |
Array
(
[id] => 4629244
[patent_doc_number] => 08008130
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[patent_kind] => B2
[patent_issue_date] => 2011-08-30
[patent_title] => 'Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board'
[patent_app_type] => utility
[patent_app_number] => 11/727025
[patent_app_country] => US
[patent_app_date] => 2007-03-23
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/08/008/08008130.pdf
[firstpage_image] =>[orig_patent_app_number] => 11727025
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/727025 | Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board | Mar 22, 2007 | Issued |
Array
(
[id] => 270460
[patent_doc_number] => 07563696
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[patent_kind] => B2
[patent_issue_date] => 2009-07-21
[patent_title] => 'Semiconductor device manufacturing apparatus and semiconductor device manufacturing method'
[patent_app_type] => utility
[patent_app_number] => 11/690089
[patent_app_country] => US
[patent_app_date] => 2007-03-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] => patents/07/563/07563696.pdf
[firstpage_image] =>[orig_patent_app_number] => 11690089
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/690089 | Semiconductor device manufacturing apparatus and semiconductor device manufacturing method | Mar 21, 2007 | Issued |
Array
(
[id] => 5275566
[patent_doc_number] => 20090127698
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-21
[patent_title] => 'COMPOSITE CONTACT FOR FINE PITCH ELECTRICAL INTERCONNECT ASSEMBLY'
[patent_app_type] => utility
[patent_app_number] => 12/293499
[patent_app_country] => US
[patent_app_date] => 2007-03-19
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[firstpage_image] =>[orig_patent_app_number] => 12293499
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/293499 | Composite contact for fine pitch electrical interconnect assembly | Mar 18, 2007 | Issued |
Array
(
[id] => 4691203
[patent_doc_number] => 20080083973
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-10
[patent_title] => 'Lead frame for an optical semiconductor device, optical semiconductor device using the same, and manufacturing method for these'
[patent_app_type] => utility
[patent_app_number] => 11/714916
[patent_app_country] => US
[patent_app_date] => 2007-03-07
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/714916 | Lead frame for an optical semiconductor device, optical semiconductor device using the same, and manufacturing method for these | Mar 6, 2007 | Abandoned |
Array
(
[id] => 5256805
[patent_doc_number] => 20070210437
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-13
[patent_title] => 'Semiconductor device and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/714906
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Array
(
[id] => 4695575
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[patent_issue_date] => 2008-09-11
[patent_title] => 'Chip package substrate and structure thereof'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/715146 | Chip package substrate and structure thereof | Mar 5, 2007 | Abandoned |
Array
(
[id] => 4663724
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[patent_issue_date] => 2008-10-16
[patent_title] => 'METHOD FOR FABRICATION OF SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/680709 | Method for fabrication of semiconductor device | Feb 28, 2007 | Issued |
Array
(
[id] => 5250652
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[patent_title] => 'METHOD FOR MANUFACTURING A WAFER LEVEL CHIP SCALE PACKAGE'
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Array
(
[id] => 11239899
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[patent_issue_date] => 2016-10-11
[patent_title] => 'Semiconductor package in package'
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[patent_app_number] => 11/677506
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/677506 | Semiconductor package in package | Feb 20, 2007 | Issued |
Array
(
[id] => 8398750
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/225518 | Method for electrical discharge machining of electrically non-conductive material | Feb 15, 2007 | Issued |
Array
(
[id] => 4870759
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[patent_issue_date] => 2008-08-21
[patent_title] => 'Integrated circuit including conductive bumps'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/707427 | Integrated circuit including conductive bumps | Feb 15, 2007 | Abandoned |
Array
(
[id] => 122640
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[patent_title] => 'Packaged semiconductor light emitting devices having multiple optical elements'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/705305 | Packaged semiconductor light emitting devices having multiple optical elements | Feb 11, 2007 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/705265 | Ball grid array package | Feb 11, 2007 | Abandoned |
Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/160836 | LED lamp | Jan 9, 2007 | Issued |