
David E. Graybill
Examiner (ID: 8531)
| Most Active Art Unit | 2894 |
| Art Unit(s) | 1763, 3727, 2894, 1107, 2822, 2812, 2814, 2827 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5149095
[patent_doc_number] => 20070049155
[patent_country] => US
[patent_kind] => A1
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[patent_title] => 'Encapsulated devices and method of making'
[patent_app_type] => utility
[patent_app_number] => 11/509837
[patent_app_country] => US
[patent_app_date] => 2006-08-24
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/509837 | Encapsulated devices and method of making | Aug 23, 2006 | Issued |
Array
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[patent_issue_date] => 2006-12-21
[patent_title] => 'Layer transfer technique'
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Array
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[patent_issue_date] => 2012-09-18
[patent_title] => 'Controlled decoration of carbon nanotubes with aerosol nanoparticles'
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[patent_app_date] => 2006-08-23
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Array
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[patent_doc_number] => 07790486
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[patent_issue_date] => 2010-09-07
[patent_title] => 'Light emitting device and method of manufacturing the same'
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[patent_app_date] => 2006-08-21
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/506837 | Light emitting device and method of manufacturing the same | Aug 20, 2006 | Issued |
Array
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[patent_title] => 'Semiconductor including STI and method for manufacturing the same'
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Array
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[patent_title] => 'Strained silicon CMOS on hybrid crystal orientations'
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Array
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[firstpage_image] =>[orig_patent_app_number] => 11487027
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/487027 | Inter-metal dielectric fill | Jul 13, 2006 | Abandoned |
Array
(
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[patent_doc_number] => 20060246719
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[patent_issue_date] => 2006-11-02
[patent_title] => 'INTER-METAL DIELECTRIC FILL'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/457723 | INTER-METAL DIELECTRIC FILL | Jul 13, 2006 | Abandoned |
Array
(
[id] => 5605678
[patent_doc_number] => 20060267194
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-30
[patent_title] => 'Integrated circuit package with air gap'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/486557 | Integrated circuit package with air gap | Jul 13, 2006 | Abandoned |
Array
(
[id] => 5917714
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[patent_title] => 'PACKAGING OF ELECTRONIC CHIPS WITH AIR-BRIDGE STRUCTURES'
[patent_app_type] => utility
[patent_app_number] => 11/457105
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Array
(
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[patent_title] => 'Varied-thickness heat sink for integrated circuit (IC) package'
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Array
(
[id] => 4797524
[patent_doc_number] => 20080009110
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[patent_title] => 'METAL-OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/309167 | Metal-oxide semiconductor field effect transistor | Jul 4, 2006 | Issued |
Array
(
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Array
(
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/278771 | Method of fabricating isolated semiconductor devices in epi-less substrate | Apr 4, 2006 | Issued |