
David E. Graybill
Examiner (ID: 12341, Phone: (571)272-1930 , Office: P/2894 )
| Most Active Art Unit | 2894 |
| Art Unit(s) | 2894, 3727, 2812, 1107, 2827, 2814, 1763, 2822 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5141863
[patent_doc_number] => 20070004079
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-01-04
[patent_title] => 'Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chips'
[patent_app_type] => utility
[patent_app_number] => 11/173367
[patent_app_country] => US
[patent_app_date] => 2005-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0004/20070004079.pdf
[firstpage_image] =>[orig_patent_app_number] => 11173367
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/173367 | Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chips | Jun 29, 2005 | Abandoned |
Array
(
[id] => 5141937
[patent_doc_number] => 20070004153
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[patent_kind] => A1
[patent_issue_date] => 2007-01-04
[patent_title] => 'Method for producing charge-trapping memory cell arrays'
[patent_app_type] => utility
[patent_app_number] => 11/170187
[patent_app_country] => US
[patent_app_date] => 2005-06-29
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0004/20070004153.pdf
[firstpage_image] =>[orig_patent_app_number] => 11170187
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/170187 | Method for producing charge-trapping memory cell arrays | Jun 28, 2005 | Issued |
Array
(
[id] => 4464209
[patent_doc_number] => 07935616
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[patent_kind] => B2
[patent_issue_date] => 2011-05-03
[patent_title] => 'Dynamic p-n junction growth'
[patent_app_type] => utility
[patent_app_number] => 11/165847
[patent_app_country] => US
[patent_app_date] => 2005-06-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/165847 | Dynamic p-n junction growth | Jun 16, 2005 | Issued |
Array
(
[id] => 5688482
[patent_doc_number] => 20060286797
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-12-21
[patent_title] => 'Grain boundary blocking for stress migration and electromigration improvement in CU interconnects'
[patent_app_type] => utility
[patent_app_number] => 11/153747
[patent_app_country] => US
[patent_app_date] => 2005-06-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/153747 | Grain boundary blocking for stress migration and electromigration improvement in CU interconnects | Jun 14, 2005 | Issued |
Array
(
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[patent_doc_number] => 20060113683
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[patent_title] => 'Doped alloys for electrical interconnects, methods of production and uses thereof'
[patent_app_type] => utility
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[patent_app_date] => 2005-06-08
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/147958 | Doped alloys for electrical interconnects, methods of production and uses thereof | Jun 7, 2005 | Abandoned |
Array
(
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[patent_issue_date] => 2007-11-20
[patent_title] => 'Electronic device and method for manufacturing the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/142300 | Electronic device and method for manufacturing the same | Jun 1, 2005 | Issued |
Array
(
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[patent_title] => 'Microelectronic assembly having encapsulated wire bonding leads'
[patent_app_type] => utility
[patent_app_number] => 11/142761
[patent_app_country] => US
[patent_app_date] => 2005-06-01
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[patent_drawing_sheets_cnt] => 21
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/142761 | Microelectronic assembly having encapsulated wire bonding leads | May 31, 2005 | Abandoned |
Array
(
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[patent_doc_number] => 20060270106
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[patent_kind] => A1
[patent_issue_date] => 2006-11-30
[patent_title] => 'System and method for polymer encapsulated solder lid attach'
[patent_app_type] => utility
[patent_app_number] => 11/140767
[patent_app_country] => US
[patent_app_date] => 2005-05-31
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[patent_drawing_sheets_cnt] => 3
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/140767 | System and method for polymer encapsulated solder lid attach | May 30, 2005 | Abandoned |
Array
(
[id] => 7111304
[patent_doc_number] => 20050208760
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-09-22
[patent_title] => 'Interconnects with a dielectric sealant layer'
[patent_app_type] => utility
[patent_app_number] => 11/138339
[patent_app_country] => US
[patent_app_date] => 2005-05-27
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/138339 | Interconnects with a dielectric sealant layer | May 26, 2005 | Issued |
Array
(
[id] => 5768052
[patent_doc_number] => 20060019454
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[patent_kind] => A1
[patent_issue_date] => 2006-01-26
[patent_title] => 'Method for making a semiconductor device comprising a superlattice dielectric interface layer'
[patent_app_type] => utility
[patent_app_number] => 11/136747
[patent_app_country] => US
[patent_app_date] => 2005-05-25
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/136747 | Method for making a semiconductor device comprising a superlattice dielectric interface layer | May 24, 2005 | Issued |
Array
(
[id] => 7185446
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[patent_title] => 'Low cost magnetic brakes and motion control devices manufactured from conductive loaded resin-based materials'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/121667 | Low cost magnetic brakes and motion control devices manufactured from conductive loaded resin-based materials | May 3, 2005 | Abandoned |
Array
(
[id] => 5422521
[patent_doc_number] => 20090148976
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[patent_issue_date] => 2009-06-11
[patent_title] => 'Method for fabricating semiconductor epitaxial layers using metal islands'
[patent_app_type] => utility
[patent_app_number] => 11/587500
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Array
(
[id] => 5854496
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[patent_title] => 'Method and apparatus for directional organic light emitting diodes'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/102076 | Method and apparatus for directional organic light emitting diodes | Apr 7, 2005 | Abandoned |
Array
(
[id] => 499842
[patent_doc_number] => 07208828
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[patent_issue_date] => 2007-04-24
[patent_title] => 'Semiconductor package with wire bonded stacked dice and multi-layer metal bumps'
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Array
(
[id] => 6941489
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[patent_title] => 'Modular semiconductor workpiece processing tool'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/101834 | Modular semiconductor workpiece processing tool | Apr 6, 2005 | Abandoned |
Array
(
[id] => 899924
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[patent_title] => 'Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/084033 | Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same | Mar 20, 2005 | Issued |
Array
(
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Array
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Array
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/067082 | Storage medium and manufacture thereof | Feb 24, 2005 | Abandoned |