
David E. Graybill
Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )
| Most Active Art Unit | 2894 |
| Art Unit(s) | 2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7283654
[patent_doc_number] => 20040145045
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[patent_kind] => A1
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[patent_title] => 'Bonding pad and via structure design'
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[patent_app_country] => US
[patent_app_date] => 2003-01-29
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[pdf_file] => publications/A1/0145/20040145045.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/353554 | Bonding pad and via structure design | Jan 28, 2003 | Issued |
Array
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[patent_issue_date] => 2003-06-05
[patent_title] => 'Semiconductor device and method for manufacturing'
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Array
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[patent_issue_date] => 2004-10-26
[patent_title] => 'Gap tuning for surface micromachined structures in an epitaxial reactor'
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Array
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[patent_title] => 'Member for semiconductor package and semiconductor package using the same, and fabrication method thereof'
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Array
(
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Array
(
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[patent_title] => 'Electronic device sealed under vacuum containing a getter and method of operation'
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Array
(
[id] => 500034
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[patent_issue_date] => 2007-04-17
[patent_title] => 'Method for the production of LED bodies'
[patent_app_type] => utility
[patent_app_number] => 10/497727
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 10497727
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/497727 | Method for the production of LED bodies | Dec 3, 2002 | Issued |
Array
(
[id] => 1158653
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[patent_issue_date] => 2004-07-20
[patent_title] => 'Three-dimensional stacked semiconductor package'
[patent_app_type] => B1
[patent_app_number] => 10/307134
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[firstpage_image] =>[orig_patent_app_number] => 10307134
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/307134 | Three-dimensional stacked semiconductor package | Nov 28, 2002 | Issued |
Array
(
[id] => 7607636
[patent_doc_number] => 07098078
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-08-29
[patent_title] => 'Microelectronic component and assembly having leads with offset portions'
[patent_app_type] => utility
[patent_app_number] => 10/301188
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/301188 | Microelectronic component and assembly having leads with offset portions | Nov 20, 2002 | Issued |
Array
(
[id] => 7471829
[patent_doc_number] => 20040097007
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[patent_issue_date] => 2004-05-20
[patent_title] => 'HIGH-POWER DOUBLE THROW LEVER ZIP SOCKET'
[patent_app_type] => new
[patent_app_number] => 10/300331
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[pdf_file] => publications/A1/0097/20040097007.pdf
[firstpage_image] =>[orig_patent_app_number] => 10300331
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/300331 | High-power double throw lever zip socket | Nov 19, 2002 | Issued |
Array
(
[id] => 6628188
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[patent_issue_date] => 2003-06-05
[patent_title] => 'Semiconductor package structure with a heat-dissipation stiffener and method of fabricating the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/294159 | Semiconductor package structure with a heat-dissipation stiffener and method of fabricating the same | Nov 13, 2002 | Abandoned |
Array
(
[id] => 472412
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Array
(
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[patent_title] => 'Aluminum-containing film derived from using hydrogen and oxygen gas in sputter deposition'
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Array
(
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Array
(
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Array
(
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[patent_title] => 'Single receiving side contactless electronic module continuous manufacturing process'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/254736 | Single receiving side contactless electronic module continuous manufacturing process | Sep 24, 2002 | Issued |
Array
(
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Array
(
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Array
(
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[patent_title] => 'Underfill of a bumped or raised die utilizing barrier adjacent to the side wall of a flip-chip'
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/200839 | Mounting system for circuit board | Jul 21, 2002 | Abandoned |