David E. Graybill

Array ( [id] => 6656025 [patent_doc_number] => 20030132514 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-17 [patent_title] => 'Electronic device sealed under vacuum containing a getter and method of operation' [patent_app_type] => new [patent_app_number] => 10/328261 [patent_app_country] => US [patent_app_date] => 2002-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 4726 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0132/20030132514.pdf [firstpage_image] =>[orig_patent_app_number] => 10328261 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 500034 [patent_doc_number] => 07205170 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-04-17 [patent_title] => 'Method for the production of LED bodies' [patent_app_type] => utility [patent_app_number] => 10/497727 [patent_app_country] => US [patent_app_date] => 2002-12-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 2215 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/205/07205170.pdf [firstpage_image] =>[orig_patent_app_number] => 10497727 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1158653 [patent_doc_number] => 06765287 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-07-20 [patent_title] => 'Three-dimensional stacked semiconductor package' [patent_app_type] => B1 [patent_app_number] => 10/307134 [patent_app_country] => US [patent_app_date] => 2002-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 0 [patent_no_of_words] => 9854 [patent_no_of_claims] => 300 [patent_no_of_ind_claims] => 21 [patent_words_short_claim] => 229 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/765/06765287.pdf [firstpage_image] =>[orig_patent_app_number] => 10307134 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7607636 [patent_doc_number] => 07098078 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-08-29 [patent_title] => 'Microelectronic component and assembly having leads with offset portions' [patent_app_type] => utility [patent_app_number] => 10/301188 [patent_app_country] => US [patent_app_date] => 2002-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 38 [patent_no_of_words] => 20883 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/098/07098078.pdf [firstpage_image] =>[orig_patent_app_number] => 10301188 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7471829 [patent_doc_number] => 20040097007 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-05-20 [patent_title] => 'HIGH-POWER DOUBLE THROW LEVER ZIP SOCKET' [patent_app_type] => new [patent_app_number] => 10/300331 [patent_app_country] => US [patent_app_date] => 2002-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4792 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0097/20040097007.pdf [firstpage_image] =>[orig_patent_app_number] => 10300331 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6628188 [patent_doc_number] => 20030102571 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-05 [patent_title] => 'Semiconductor package structure with a heat-dissipation stiffener and method of fabricating the same' [patent_app_type] => new [patent_app_number] => 10/294159 [patent_app_country] => US [patent_app_date] => 2002-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2015 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 33 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0102/20030102571.pdf [firstpage_image] =>[orig_patent_app_number] => 10294159 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 472412 [patent_doc_number] => 07229861 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-06-12 [patent_title] => 'Method for producing semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/288585 [patent_app_country] => US [patent_app_date] => 2002-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 22 [patent_no_of_words] => 7825 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/229/07229861.pdf [firstpage_image] =>[orig_patent_app_number] => 10288585 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 559751 [patent_doc_number] => 07161211 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-01-09 [patent_title] => 'Aluminum-containing film derived from using hydrogen and oxygen gas in sputter deposition' [patent_app_type] => utility [patent_app_number] => 10/289550 [patent_app_country] => US [patent_app_date] => 2002-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 4170 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 33 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/161/07161211.pdf [firstpage_image] =>[orig_patent_app_number] => 10289550 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7187030 [patent_doc_number] => 20040084211 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-05-06 [patent_title] => 'Z-axis packaging for electronic device and method for making same' [patent_app_type] => new [patent_app_number] => 10/284892 [patent_app_country] => US [patent_app_date] => 2002-10-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 4469 [patent_no_of_claims] => 48 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0084/20040084211.pdf [firstpage_image] =>[orig_patent_app_number] => 10284892 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7383137 [patent_doc_number] => 20040082108 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-04-29 [patent_title] => 'Method of making an electronic package' [patent_app_type] => new [patent_app_number] => 10/282975 [patent_app_country] => US [patent_app_date] => 2002-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3151 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0082/20040082108.pdf [firstpage_image] =>[orig_patent_app_number] => 10282975 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1125277 [patent_doc_number] => 06794727 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-09-21 [patent_title] => 'Single receiving side contactless electronic module continuous manufacturing process' [patent_app_type] => B2 [patent_app_number] => 10/254736 [patent_app_country] => US [patent_app_date] => 2002-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 17 [patent_no_of_words] => 6063 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/794/06794727.pdf [firstpage_image] =>[orig_patent_app_number] => 10254736 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 946549 [patent_doc_number] => 06964881 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-11-15 [patent_title] => 'Multi-chip wafer level system packages and methods of forming same' [patent_app_type] => utility [patent_app_number] => 10/229914 [patent_app_country] => US [patent_app_date] => 2002-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 19 [patent_no_of_words] => 4996 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/964/06964881.pdf [firstpage_image] =>[orig_patent_app_number] => 10229914 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 485467 [patent_doc_number] => 07217606 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-05-15 [patent_title] => 'Method of forming vertical sub-micron CMOS transistors on (110), (111), (311), (511), and higher order surfaces of bulk, soi and thin film structures' [patent_app_type] => utility [patent_app_number] => 10/222997 [patent_app_country] => US [patent_app_date] => 2002-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 2338 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/217/07217606.pdf [firstpage_image] =>[orig_patent_app_number] => 10222997 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1102787 [patent_doc_number] => 06815817 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-11-09 [patent_title] => 'Underfill of a bumped or raised die utilizing barrier adjacent to the side wall of a flip-chip' [patent_app_type] => B2 [patent_app_number] => 10/200853 [patent_app_country] => US [patent_app_date] => 2002-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 4218 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 245 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/815/06815817.pdf [firstpage_image] =>[orig_patent_app_number] => 10200853 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6395242 [patent_doc_number] => 20020181212 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-05 [patent_title] => 'Mounting system for circuit board' [patent_app_type] => new [patent_app_number] => 10/200839 [patent_app_country] => US [patent_app_date] => 2002-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2565 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0181/20020181212.pdf [firstpage_image] =>[orig_patent_app_number] => 10200839 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6389601 [patent_doc_number] => 20020180605 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-05 [patent_title] => 'Wearable biomonitor with flexible thinned integrated circuit' [patent_app_type] => new [patent_app_number] => 10/197006 [patent_app_country] => US [patent_app_date] => 2002-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5255 [patent_no_of_claims] => 40 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 27 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0180/20020180605.pdf [firstpage_image] =>[orig_patent_app_number] => 10197006 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6176891 [patent_doc_number] => 20020155728 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-24 [patent_title] => 'Semiconductor chip assemblies, methods of making same and components for same' [patent_app_type] => new [patent_app_number] => 10/164116 [patent_app_country] => US [patent_app_date] => 2002-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 20655 [patent_no_of_claims] => 58 [patent_no_of_ind_claims] => 13 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0155/20020155728.pdf [firstpage_image] =>[orig_patent_app_number] => 10164116 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6469200 [patent_doc_number] => 20020151111 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-17 [patent_title] => 'P-connection components with frangible leads and bus' [patent_app_type] => new [patent_app_number] => 10/162957 [patent_app_country] => US [patent_app_date] => 2002-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 15210 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0151/20020151111.pdf [firstpage_image] =>[orig_patent_app_number] => 10162957 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1040980 [patent_doc_number] => 06870251 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-03-22 [patent_title] => 'High-power LGA socket' [patent_app_type] => utility [patent_app_number] => 10/159084 [patent_app_country] => US [patent_app_date] => 2002-05-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 4582 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/870/06870251.pdf [firstpage_image] =>[orig_patent_app_number] => 10159084 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 689601 [patent_doc_number] => 07074246 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-07-11 [patent_title] => 'Modular semiconductor workpiece processing tool' [patent_app_type] => utility [patent_app_number] => 10/157762 [patent_app_country] => US [patent_app_date] => 2002-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 46 [patent_figures_cnt] => 51 [patent_no_of_words] => 24813 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 218 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/074/07074246.pdf [firstpage_image] =>[orig_patent_app_number] => 10157762 [rel_patent_id] =>[rel_patent_doc_number] =>)