Search

David E. Graybill

Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )

Most Active Art Unit
2894
Art Unit(s)
2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 7283654 [patent_doc_number] => 20040145045 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-07-29 [patent_title] => 'Bonding pad and via structure design' [patent_app_type] => new [patent_app_number] => 10/353554 [patent_app_country] => US [patent_app_date] => 2003-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3731 [patent_no_of_claims] => 40 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 31 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20040145045.pdf [firstpage_image] =>[orig_patent_app_number] => 10353554 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/353554
Bonding pad and via structure design Jan 28, 2003 Issued
Array ( [id] => 6627915 [patent_doc_number] => 20030102551 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-05 [patent_title] => 'Semiconductor device and method for manufacturing' [patent_app_type] => new [patent_app_number] => 10/331480 [patent_app_country] => US [patent_app_date] => 2002-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 6653 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0102/20030102551.pdf [firstpage_image] =>[orig_patent_app_number] => 10331480 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/331480
Semiconductor device and method for manufacturing Dec 30, 2002 Issued
Array ( [id] => 1107542 [patent_doc_number] => 06808953 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-10-26 [patent_title] => 'Gap tuning for surface micromachined structures in an epitaxial reactor' [patent_app_type] => B2 [patent_app_number] => 10/334463 [patent_app_country] => US [patent_app_date] => 2002-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 2939 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/808/06808953.pdf [firstpage_image] =>[orig_patent_app_number] => 10334463 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/334463
Gap tuning for surface micromachined structures in an epitaxial reactor Dec 30, 2002 Issued
Array ( [id] => 693980 [patent_doc_number] => 07070831 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-07-04 [patent_title] => 'Member for semiconductor package and semiconductor package using the same, and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 10/330202 [patent_app_country] => US [patent_app_date] => 2002-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 14 [patent_no_of_words] => 2459 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/070/07070831.pdf [firstpage_image] =>[orig_patent_app_number] => 10330202 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/330202
Member for semiconductor package and semiconductor package using the same, and fabrication method thereof Dec 29, 2002 Issued
Array ( [id] => 5843605 [patent_doc_number] => 20060121690 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-08 [patent_title] => 'Three-dimensional device fabrication method' [patent_app_type] => utility [patent_app_number] => 10/538905 [patent_app_country] => US [patent_app_date] => 2002-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 4638 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0121/20060121690.pdf [firstpage_image] =>[orig_patent_app_number] => 10538905 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/538905
Three-dimensional device fabrication method Dec 19, 2002 Issued
Array ( [id] => 6656025 [patent_doc_number] => 20030132514 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-17 [patent_title] => 'Electronic device sealed under vacuum containing a getter and method of operation' [patent_app_type] => new [patent_app_number] => 10/328261 [patent_app_country] => US [patent_app_date] => 2002-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 4726 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0132/20030132514.pdf [firstpage_image] =>[orig_patent_app_number] => 10328261 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/328261
Electronic device sealed under vacuum containing a getter and method of operation Dec 18, 2002 Issued
Array ( [id] => 500034 [patent_doc_number] => 07205170 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-04-17 [patent_title] => 'Method for the production of LED bodies' [patent_app_type] => utility [patent_app_number] => 10/497727 [patent_app_country] => US [patent_app_date] => 2002-12-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 2215 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/205/07205170.pdf [firstpage_image] =>[orig_patent_app_number] => 10497727 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/497727
Method for the production of LED bodies Dec 3, 2002 Issued
Array ( [id] => 1158653 [patent_doc_number] => 06765287 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-07-20 [patent_title] => 'Three-dimensional stacked semiconductor package' [patent_app_type] => B1 [patent_app_number] => 10/307134 [patent_app_country] => US [patent_app_date] => 2002-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 0 [patent_no_of_words] => 9854 [patent_no_of_claims] => 300 [patent_no_of_ind_claims] => 21 [patent_words_short_claim] => 229 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/765/06765287.pdf [firstpage_image] =>[orig_patent_app_number] => 10307134 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/307134
Three-dimensional stacked semiconductor package Nov 28, 2002 Issued
Array ( [id] => 7607636 [patent_doc_number] => 07098078 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-08-29 [patent_title] => 'Microelectronic component and assembly having leads with offset portions' [patent_app_type] => utility [patent_app_number] => 10/301188 [patent_app_country] => US [patent_app_date] => 2002-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 38 [patent_no_of_words] => 20883 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/098/07098078.pdf [firstpage_image] =>[orig_patent_app_number] => 10301188 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/301188
Microelectronic component and assembly having leads with offset portions Nov 20, 2002 Issued
Array ( [id] => 7471829 [patent_doc_number] => 20040097007 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-05-20 [patent_title] => 'HIGH-POWER DOUBLE THROW LEVER ZIP SOCKET' [patent_app_type] => new [patent_app_number] => 10/300331 [patent_app_country] => US [patent_app_date] => 2002-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4792 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0097/20040097007.pdf [firstpage_image] =>[orig_patent_app_number] => 10300331 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/300331
High-power double throw lever zip socket Nov 19, 2002 Issued
Array ( [id] => 6628188 [patent_doc_number] => 20030102571 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-05 [patent_title] => 'Semiconductor package structure with a heat-dissipation stiffener and method of fabricating the same' [patent_app_type] => new [patent_app_number] => 10/294159 [patent_app_country] => US [patent_app_date] => 2002-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2015 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 33 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0102/20030102571.pdf [firstpage_image] =>[orig_patent_app_number] => 10294159 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/294159
Semiconductor package structure with a heat-dissipation stiffener and method of fabricating the same Nov 13, 2002 Abandoned
Array ( [id] => 472412 [patent_doc_number] => 07229861 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-06-12 [patent_title] => 'Method for producing semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/288585 [patent_app_country] => US [patent_app_date] => 2002-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 22 [patent_no_of_words] => 7825 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/229/07229861.pdf [firstpage_image] =>[orig_patent_app_number] => 10288585 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/288585
Method for producing semiconductor device Nov 5, 2002 Issued
Array ( [id] => 559751 [patent_doc_number] => 07161211 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-01-09 [patent_title] => 'Aluminum-containing film derived from using hydrogen and oxygen gas in sputter deposition' [patent_app_type] => utility [patent_app_number] => 10/289550 [patent_app_country] => US [patent_app_date] => 2002-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 4170 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 33 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/161/07161211.pdf [firstpage_image] =>[orig_patent_app_number] => 10289550 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/289550
Aluminum-containing film derived from using hydrogen and oxygen gas in sputter deposition Nov 5, 2002 Issued
Array ( [id] => 7187030 [patent_doc_number] => 20040084211 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-05-06 [patent_title] => 'Z-axis packaging for electronic device and method for making same' [patent_app_type] => new [patent_app_number] => 10/284892 [patent_app_country] => US [patent_app_date] => 2002-10-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 4469 [patent_no_of_claims] => 48 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0084/20040084211.pdf [firstpage_image] =>[orig_patent_app_number] => 10284892 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/284892
Z-axis packaging for electronic device and method for making same Oct 29, 2002 Abandoned
Array ( [id] => 7383137 [patent_doc_number] => 20040082108 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-04-29 [patent_title] => 'Method of making an electronic package' [patent_app_type] => new [patent_app_number] => 10/282975 [patent_app_country] => US [patent_app_date] => 2002-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3151 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0082/20040082108.pdf [firstpage_image] =>[orig_patent_app_number] => 10282975 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/282975
Method of making an electronic package Oct 28, 2002 Issued
Array ( [id] => 1125277 [patent_doc_number] => 06794727 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-09-21 [patent_title] => 'Single receiving side contactless electronic module continuous manufacturing process' [patent_app_type] => B2 [patent_app_number] => 10/254736 [patent_app_country] => US [patent_app_date] => 2002-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 17 [patent_no_of_words] => 6063 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/794/06794727.pdf [firstpage_image] =>[orig_patent_app_number] => 10254736 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/254736
Single receiving side contactless electronic module continuous manufacturing process Sep 24, 2002 Issued
Array ( [id] => 946549 [patent_doc_number] => 06964881 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-11-15 [patent_title] => 'Multi-chip wafer level system packages and methods of forming same' [patent_app_type] => utility [patent_app_number] => 10/229914 [patent_app_country] => US [patent_app_date] => 2002-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 19 [patent_no_of_words] => 4996 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/964/06964881.pdf [firstpage_image] =>[orig_patent_app_number] => 10229914 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/229914
Multi-chip wafer level system packages and methods of forming same Aug 26, 2002 Issued
Array ( [id] => 485467 [patent_doc_number] => 07217606 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-05-15 [patent_title] => 'Method of forming vertical sub-micron CMOS transistors on (110), (111), (311), (511), and higher order surfaces of bulk, soi and thin film structures' [patent_app_type] => utility [patent_app_number] => 10/222997 [patent_app_country] => US [patent_app_date] => 2002-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 2338 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/217/07217606.pdf [firstpage_image] =>[orig_patent_app_number] => 10222997 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/222997
Method of forming vertical sub-micron CMOS transistors on (110), (111), (311), (511), and higher order surfaces of bulk, soi and thin film structures Aug 18, 2002 Issued
Array ( [id] => 1102787 [patent_doc_number] => 06815817 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-11-09 [patent_title] => 'Underfill of a bumped or raised die utilizing barrier adjacent to the side wall of a flip-chip' [patent_app_type] => B2 [patent_app_number] => 10/200853 [patent_app_country] => US [patent_app_date] => 2002-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 4218 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 245 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/815/06815817.pdf [firstpage_image] =>[orig_patent_app_number] => 10200853 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/200853
Underfill of a bumped or raised die utilizing barrier adjacent to the side wall of a flip-chip Jul 21, 2002 Issued
Array ( [id] => 6395242 [patent_doc_number] => 20020181212 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-05 [patent_title] => 'Mounting system for circuit board' [patent_app_type] => new [patent_app_number] => 10/200839 [patent_app_country] => US [patent_app_date] => 2002-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2565 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0181/20020181212.pdf [firstpage_image] =>[orig_patent_app_number] => 10200839 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/200839
Mounting system for circuit board Jul 21, 2002 Abandoned
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