
David E. Graybill
Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )
| Most Active Art Unit | 2894 |
| Art Unit(s) | 2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6389601
[patent_doc_number] => 20020180605
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-05
[patent_title] => 'Wearable biomonitor with flexible thinned integrated circuit'
[patent_app_type] => new
[patent_app_number] => 10/197006
[patent_app_country] => US
[patent_app_date] => 2002-07-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 5255
[patent_no_of_claims] => 40
[patent_no_of_ind_claims] => 9
[patent_words_short_claim] => 27
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0180/20020180605.pdf
[firstpage_image] =>[orig_patent_app_number] => 10197006
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/197006 | Wearable biomonitor with flexible thinned integrated circuit | Jul 15, 2002 | Abandoned |
Array
(
[id] => 6176891
[patent_doc_number] => 20020155728
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-24
[patent_title] => 'Semiconductor chip assemblies, methods of making same and components for same'
[patent_app_type] => new
[patent_app_number] => 10/164116
[patent_app_country] => US
[patent_app_date] => 2002-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 21
[patent_no_of_words] => 20655
[patent_no_of_claims] => 58
[patent_no_of_ind_claims] => 13
[patent_words_short_claim] => 114
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0155/20020155728.pdf
[firstpage_image] =>[orig_patent_app_number] => 10164116
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/164116 | Semiconductor chip assemblies, methods of making same and components for same | Jun 4, 2002 | Issued |
Array
(
[id] => 6469200
[patent_doc_number] => 20020151111
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-17
[patent_title] => 'P-connection components with frangible leads and bus'
[patent_app_type] => new
[patent_app_number] => 10/162957
[patent_app_country] => US
[patent_app_date] => 2002-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 15210
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 154
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0151/20020151111.pdf
[firstpage_image] =>[orig_patent_app_number] => 10162957
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/162957 | P-connection components with frangible leads and bus | Jun 4, 2002 | Abandoned |
Array
(
[id] => 1040980
[patent_doc_number] => 06870251
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-03-22
[patent_title] => 'High-power LGA socket'
[patent_app_type] => utility
[patent_app_number] => 10/159084
[patent_app_country] => US
[patent_app_date] => 2002-05-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 4582
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 159
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/870/06870251.pdf
[firstpage_image] =>[orig_patent_app_number] => 10159084
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/159084 | High-power LGA socket | May 28, 2002 | Issued |
Array
(
[id] => 689601
[patent_doc_number] => 07074246
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-07-11
[patent_title] => 'Modular semiconductor workpiece processing tool'
[patent_app_type] => utility
[patent_app_number] => 10/157762
[patent_app_country] => US
[patent_app_date] => 2002-05-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 46
[patent_figures_cnt] => 51
[patent_no_of_words] => 24813
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 218
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/074/07074246.pdf
[firstpage_image] =>[orig_patent_app_number] => 10157762
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/157762 | Modular semiconductor workpiece processing tool | May 27, 2002 | Issued |
Array
(
[id] => 6700301
[patent_doc_number] => 20030223181
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-12-04
[patent_title] => 'Electronic device package'
[patent_app_type] => new
[patent_app_number] => 10/156543
[patent_app_country] => US
[patent_app_date] => 2002-05-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3340
[patent_no_of_claims] => 56
[patent_no_of_ind_claims] => 8
[patent_words_short_claim] => 44
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0223/20030223181.pdf
[firstpage_image] =>[orig_patent_app_number] => 10156543
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/156543 | Electronic device package | May 27, 2002 | Abandoned |
Array
(
[id] => 968818
[patent_doc_number] => 06940094
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-09-06
[patent_title] => 'Electronic device and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 10/155326
[patent_app_country] => US
[patent_app_date] => 2002-05-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 26
[patent_no_of_words] => 5152
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 13
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/940/06940094.pdf
[firstpage_image] =>[orig_patent_app_number] => 10155326
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/155326 | Electronic device and method for manufacturing the same | May 22, 2002 | Issued |
Array
(
[id] => 968818
[patent_doc_number] => 06940094
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-09-06
[patent_title] => 'Electronic device and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 10/155326
[patent_app_country] => US
[patent_app_date] => 2002-05-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 26
[patent_no_of_words] => 5152
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 13
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/940/06940094.pdf
[firstpage_image] =>[orig_patent_app_number] => 10155326
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/155326 | Electronic device and method for manufacturing the same | May 22, 2002 | Issued |
Array
(
[id] => 6735693
[patent_doc_number] => 20030013328
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-01-16
[patent_title] => 'Connection assembly for integrated circuit sensors'
[patent_app_type] => new
[patent_app_number] => 10/155834
[patent_app_country] => US
[patent_app_date] => 2002-05-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 2439
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 19
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0013/20030013328.pdf
[firstpage_image] =>[orig_patent_app_number] => 10155834
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/155834 | Connection assembly for integrated circuit sensors | May 21, 2002 | Abandoned |
Array
(
[id] => 439196
[patent_doc_number] => 07259043
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-08-21
[patent_title] => 'Circular test pads on scribe street area'
[patent_app_type] => utility
[patent_app_number] => 10/145442
[patent_app_country] => US
[patent_app_date] => 2002-05-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 1619
[patent_no_of_claims] => 1
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 65
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/259/07259043.pdf
[firstpage_image] =>[orig_patent_app_number] => 10145442
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/145442 | Circular test pads on scribe street area | May 13, 2002 | Issued |
Array
(
[id] => 899804
[patent_doc_number] => 07338843
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-03-04
[patent_title] => 'Method for producing an electronic component, especially a memory chip'
[patent_app_type] => utility
[patent_app_number] => 10/477967
[patent_app_country] => US
[patent_app_date] => 2002-05-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 17
[patent_no_of_words] => 4063
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 102
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/338/07338843.pdf
[firstpage_image] =>[orig_patent_app_number] => 10477967
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/477967 | Method for producing an electronic component, especially a memory chip | May 12, 2002 | Issued |
Array
(
[id] => 701443
[patent_doc_number] => 07064005
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-06-20
[patent_title] => 'Semiconductor apparatus and method of manufacturing same'
[patent_app_type] => utility
[patent_app_number] => 10/474863
[patent_app_country] => US
[patent_app_date] => 2002-05-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 9
[patent_no_of_words] => 1482
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/064/07064005.pdf
[firstpage_image] =>[orig_patent_app_number] => 10474863
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/474863 | Semiconductor apparatus and method of manufacturing same | May 9, 2002 | Issued |
| 10/135424 | Semiconductor device and assembly board having through-holes filled with filling core | Apr 30, 2002 | Abandoned |
Array
(
[id] => 1125313
[patent_doc_number] => 06794741
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-09-21
[patent_title] => 'Three-dimensional stacked semiconductor package with pillars in pillar cavities'
[patent_app_type] => B1
[patent_app_number] => 10/137012
[patent_app_country] => US
[patent_app_date] => 2002-04-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 42
[patent_no_of_words] => 10507
[patent_no_of_claims] => 180
[patent_no_of_ind_claims] => 12
[patent_words_short_claim] => 239
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/794/06794741.pdf
[firstpage_image] =>[orig_patent_app_number] => 10137012
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/137012 | Three-dimensional stacked semiconductor package with pillars in pillar cavities | Apr 29, 2002 | Issued |
Array
(
[id] => 1421653
[patent_doc_number] => 06509639
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-01-21
[patent_title] => 'Three-dimensional stacked semiconductor package'
[patent_app_type] => B1
[patent_app_number] => 10/137071
[patent_app_country] => US
[patent_app_date] => 2002-04-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 39
[patent_no_of_words] => 9801
[patent_no_of_claims] => 300
[patent_no_of_ind_claims] => 21
[patent_words_short_claim] => 192
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/509/06509639.pdf
[firstpage_image] =>[orig_patent_app_number] => 10137071
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/137071 | Three-dimensional stacked semiconductor package | Apr 29, 2002 | Issued |
Array
(
[id] => 7258461
[patent_doc_number] => 20040149679
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-08-05
[patent_title] => 'Nanoelectronic devices and circuits'
[patent_app_type] => new
[patent_app_number] => 10/475347
[patent_app_country] => US
[patent_app_date] => 2004-03-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 5515
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 22
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0149/20040149679.pdf
[firstpage_image] =>[orig_patent_app_number] => 10475347
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/475347 | Nanoelectronic devices and circuits | Apr 17, 2002 | Issued |
Array
(
[id] => 6523236
[patent_doc_number] => 20020109238
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-08-15
[patent_title] => 'Pitch compensation in flip-chip packaging'
[patent_app_type] => new
[patent_app_number] => 10/063383
[patent_app_country] => US
[patent_app_date] => 2002-04-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3626
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 62
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0109/20020109238.pdf
[firstpage_image] =>[orig_patent_app_number] => 10063383
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/063383 | Pitch compensation in flip-chip packaging | Apr 16, 2002 | Issued |
Array
(
[id] => 473889
[patent_doc_number] => 07230263
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-06-12
[patent_title] => 'Gallium nitride compound semiconductor element'
[patent_app_type] => utility
[patent_app_number] => 10/474808
[patent_app_country] => US
[patent_app_date] => 2002-04-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 10402
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 130
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/230/07230263.pdf
[firstpage_image] =>[orig_patent_app_number] => 10474808
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/474808 | Gallium nitride compound semiconductor element | Apr 7, 2002 | Issued |
Array
(
[id] => 744731
[patent_doc_number] => 07026223
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-04-11
[patent_title] => 'Hermetic electric component package'
[patent_app_type] => utility
[patent_app_number] => 10/109351
[patent_app_country] => US
[patent_app_date] => 2002-03-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 12
[patent_no_of_words] => 4389
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 147
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/026/07026223.pdf
[firstpage_image] =>[orig_patent_app_number] => 10109351
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/109351 | Hermetic electric component package | Mar 27, 2002 | Issued |
Array
(
[id] => 6727726
[patent_doc_number] => 20030183916
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-10-02
[patent_title] => 'Packaging microelectromechanical systems'
[patent_app_type] => new
[patent_app_number] => 10/107624
[patent_app_country] => US
[patent_app_date] => 2002-03-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 1465
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 31
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0183/20030183916.pdf
[firstpage_image] =>[orig_patent_app_number] => 10107624
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/107624 | Packaging microelectromechanical systems | Mar 26, 2002 | Abandoned |