Search

David E. Graybill

Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )

Most Active Art Unit
2894
Art Unit(s)
2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 721290 [patent_doc_number] => 07049685 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-05-23 [patent_title] => 'Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices' [patent_app_type] => utility [patent_app_number] => 10/099155 [patent_app_country] => US [patent_app_date] => 2002-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 4840 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/049/07049685.pdf [firstpage_image] =>[orig_patent_app_number] => 10099155 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/099155
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices Mar 12, 2002 Issued
Array ( [id] => 6708982 [patent_doc_number] => 20030168731 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-09-11 [patent_title] => 'Thermal interface material and method of fabricating the same' [patent_app_type] => new [patent_app_number] => 10/096272 [patent_app_country] => US [patent_app_date] => 2002-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2881 [patent_no_of_claims] => 42 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0168/20030168731.pdf [firstpage_image] =>[orig_patent_app_number] => 10096272 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/096272
Thermal interface material and method of fabricating the same Mar 10, 2002 Abandoned
Array ( [id] => 6435444 [patent_doc_number] => 20020127867 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-12 [patent_title] => 'Semiconductor devices having a hydrogen diffusion barrier layer and methods of fabricating the same' [patent_app_type] => new [patent_app_number] => 10/093557 [patent_app_country] => US [patent_app_date] => 2002-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4735 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 35 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20020127867.pdf [firstpage_image] =>[orig_patent_app_number] => 10093557 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/093557
Semiconductor devices having a hydrogen diffusion barrier layer and methods of fabricating the same Mar 6, 2002 Abandoned
Array ( [id] => 1320134 [patent_doc_number] => 06602305 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-08-05 [patent_title] => 'Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device' [patent_app_type] => B2 [patent_app_number] => 10/084173 [patent_app_country] => US [patent_app_date] => 2002-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 3207 [patent_no_of_claims] => 46 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/602/06602305.pdf [firstpage_image] =>[orig_patent_app_number] => 10084173 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/084173
Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device Feb 27, 2002 Issued
Array ( [id] => 6010771 [patent_doc_number] => 20020100162 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-01 [patent_title] => 'Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device' [patent_app_type] => new [patent_app_number] => 10/084150 [patent_app_country] => US [patent_app_date] => 2002-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3235 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0100/20020100162.pdf [firstpage_image] =>[orig_patent_app_number] => 10084150 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/084150
Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device Feb 27, 2002 Issued
Array ( [id] => 1040513 [patent_doc_number] => 06869811 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-03-22 [patent_title] => 'Methods for transfer molding encapsulation of a semiconductor die with attached heat sink' [patent_app_type] => utility [patent_app_number] => 10/077452 [patent_app_country] => US [patent_app_date] => 2002-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 0 [patent_no_of_words] => 3080 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/869/06869811.pdf [firstpage_image] =>[orig_patent_app_number] => 10077452 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/077452
Methods for transfer molding encapsulation of a semiconductor die with attached heat sink Feb 13, 2002 Issued
Array ( [id] => 6704398 [patent_doc_number] => 20030151132 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-08-14 [patent_title] => 'Microelectronic die providing improved heat dissipation, and method of packaging same' [patent_app_type] => new [patent_app_number] => 10/073859 [patent_app_country] => US [patent_app_date] => 2002-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3445 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0151/20030151132.pdf [firstpage_image] =>[orig_patent_app_number] => 10073859 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/073859
Microelectronic die providing improved heat dissipation, and method of packaging same Feb 13, 2002 Abandoned
Array ( [id] => 6126638 [patent_doc_number] => 20020075790 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-06-20 [patent_title] => 'Storage medium and manufacture thereof' [patent_app_type] => new [patent_app_number] => 10/077552 [patent_app_country] => US [patent_app_date] => 2002-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4675 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 28 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0075/20020075790.pdf [firstpage_image] =>[orig_patent_app_number] => 10077552 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/077552
Storage medium and manufacture thereof Feb 13, 2002 Abandoned
Array ( [id] => 793439 [patent_doc_number] => 06982485 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2006-01-03 [patent_title] => 'Stacking structure for semiconductor chips and a semiconductor package using it' [patent_app_type] => utility [patent_app_number] => 10/076701 [patent_app_country] => US [patent_app_date] => 2002-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 4761 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 263 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/982/06982485.pdf [firstpage_image] =>[orig_patent_app_number] => 10076701 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/076701
Stacking structure for semiconductor chips and a semiconductor package using it Feb 12, 2002 Issued
Array ( [id] => 1404018 [patent_doc_number] => 06541847 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-04-01 [patent_title] => 'Packaging for multi-processor shared-memory system' [patent_app_type] => B1 [patent_app_number] => 10/066999 [patent_app_country] => US [patent_app_date] => 2002-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 7774 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 206 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/541/06541847.pdf [firstpage_image] =>[orig_patent_app_number] => 10066999 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/066999
Packaging for multi-processor shared-memory system Feb 3, 2002 Issued
Array ( [id] => 6269570 [patent_doc_number] => 20020105045 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-08 [patent_title] => 'Semiconductor device and chip carrier' [patent_app_type] => new [patent_app_number] => 10/060323 [patent_app_country] => US [patent_app_date] => 2002-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2523 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 29 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0105/20020105045.pdf [firstpage_image] =>[orig_patent_app_number] => 10060323 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/060323
Semiconductor device and chip carrier Jan 31, 2002 Issued
Array ( [id] => 1401974 [patent_doc_number] => 06524351 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-02-25 [patent_title] => 'Semiconductor device mounting jig' [patent_app_type] => B2 [patent_app_number] => 10/050269 [patent_app_country] => US [patent_app_date] => 2002-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 5053 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/524/06524351.pdf [firstpage_image] =>[orig_patent_app_number] => 10050269 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/050269
Semiconductor device mounting jig Jan 15, 2002 Issued
Array ( [id] => 6659656 [patent_doc_number] => 20030134451 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-17 [patent_title] => 'Structure and process for packaging back-to-back chips' [patent_app_type] => new [patent_app_number] => 10/043122 [patent_app_country] => US [patent_app_date] => 2002-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3012 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0134/20030134451.pdf [firstpage_image] =>[orig_patent_app_number] => 10043122 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/043122
Structure and process for packaging back-to-back chips Jan 13, 2002 Abandoned
Array ( [id] => 547794 [patent_doc_number] => 07166915 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-01-23 [patent_title] => 'Multi-chip module system' [patent_app_type] => utility [patent_app_number] => 10/032734 [patent_app_country] => US [patent_app_date] => 2001-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 3481 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/166/07166915.pdf [firstpage_image] =>[orig_patent_app_number] => 10032734 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/032734
Multi-chip module system Dec 27, 2001 Issued
Array ( [id] => 1192876 [patent_doc_number] => 06730526 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-05-04 [patent_title] => 'Multi-chip module system and method of fabrication' [patent_app_type] => B2 [patent_app_number] => 10/033234 [patent_app_country] => US [patent_app_date] => 2001-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 3483 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/730/06730526.pdf [firstpage_image] =>[orig_patent_app_number] => 10033234 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/033234
Multi-chip module system and method of fabrication Dec 27, 2001 Issued
Array ( [id] => 6758897 [patent_doc_number] => 20030122258 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-03 [patent_title] => 'Current crowding reduction technique using slots' [patent_app_type] => new [patent_app_number] => 10/033008 [patent_app_country] => US [patent_app_date] => 2001-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 2998 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 42 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0122/20030122258.pdf [firstpage_image] =>[orig_patent_app_number] => 10033008 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/033008
Current crowding reduction technique using slots Dec 27, 2001 Abandoned
Array ( [id] => 6903804 [patent_doc_number] => 20050099199 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-12 [patent_title] => 'Semiconductor device and its test method' [patent_app_type] => utility [patent_app_number] => 10/468794 [patent_app_country] => US [patent_app_date] => 2001-12-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 10647 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0099/20050099199.pdf [firstpage_image] =>[orig_patent_app_number] => 10468794 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/468794
Semiconductor device and its test method Dec 25, 2001 Abandoned
Array ( [id] => 508037 [patent_doc_number] => 07202556 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-04-10 [patent_title] => 'Semiconductor package having substrate with multi-layer metal bumps' [patent_app_type] => utility [patent_app_number] => 10/023049 [patent_app_country] => US [patent_app_date] => 2001-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 24 [patent_no_of_words] => 7400 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/202/07202556.pdf [firstpage_image] =>[orig_patent_app_number] => 10023049 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/023049
Semiconductor package having substrate with multi-layer metal bumps Dec 19, 2001 Issued
Array ( [id] => 1519024 [patent_doc_number] => 06501164 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-12-31 [patent_title] => 'Multi-chip semiconductor package with heat dissipating structure' [patent_app_type] => B1 [patent_app_number] => 10/026599 [patent_app_country] => US [patent_app_date] => 2001-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 2788 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/501/06501164.pdf [firstpage_image] =>[orig_patent_app_number] => 10026599 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/026599
Multi-chip semiconductor package with heat dissipating structure Dec 19, 2001 Issued
Array ( [id] => 6666756 [patent_doc_number] => 20030111739 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-19 [patent_title] => 'Semiconductor device and package thereof' [patent_app_type] => new [patent_app_number] => 10/020928 [patent_app_country] => US [patent_app_date] => 2001-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4292 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0111/20030111739.pdf [firstpage_image] =>[orig_patent_app_number] => 10020928 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/020928
Semiconductor device and package thereof Dec 18, 2001 Abandoned
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