Search

David E. Graybill

Examiner (ID: 12341, Phone: (571)272-1930 , Office: P/2894 )

Most Active Art Unit
2894
Art Unit(s)
2894, 3727, 2812, 1107, 2827, 2814, 1763, 2822
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6126638 [patent_doc_number] => 20020075790 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-06-20 [patent_title] => 'Storage medium and manufacture thereof' [patent_app_type] => new [patent_app_number] => 10/077552 [patent_app_country] => US [patent_app_date] => 2002-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4675 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 28 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0075/20020075790.pdf [firstpage_image] =>[orig_patent_app_number] => 10077552 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/077552
Storage medium and manufacture thereof Feb 13, 2002 Abandoned
Array ( [id] => 6704398 [patent_doc_number] => 20030151132 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-08-14 [patent_title] => 'Microelectronic die providing improved heat dissipation, and method of packaging same' [patent_app_type] => new [patent_app_number] => 10/073859 [patent_app_country] => US [patent_app_date] => 2002-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3445 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0151/20030151132.pdf [firstpage_image] =>[orig_patent_app_number] => 10073859 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/073859
Microelectronic die providing improved heat dissipation, and method of packaging same Feb 13, 2002 Abandoned
Array ( [id] => 1040513 [patent_doc_number] => 06869811 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-03-22 [patent_title] => 'Methods for transfer molding encapsulation of a semiconductor die with attached heat sink' [patent_app_type] => utility [patent_app_number] => 10/077452 [patent_app_country] => US [patent_app_date] => 2002-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 0 [patent_no_of_words] => 3080 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/869/06869811.pdf [firstpage_image] =>[orig_patent_app_number] => 10077452 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/077452
Methods for transfer molding encapsulation of a semiconductor die with attached heat sink Feb 13, 2002 Issued
Array ( [id] => 793439 [patent_doc_number] => 06982485 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2006-01-03 [patent_title] => 'Stacking structure for semiconductor chips and a semiconductor package using it' [patent_app_type] => utility [patent_app_number] => 10/076701 [patent_app_country] => US [patent_app_date] => 2002-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 4761 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 263 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/982/06982485.pdf [firstpage_image] =>[orig_patent_app_number] => 10076701 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/076701
Stacking structure for semiconductor chips and a semiconductor package using it Feb 12, 2002 Issued
Array ( [id] => 1404018 [patent_doc_number] => 06541847 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-04-01 [patent_title] => 'Packaging for multi-processor shared-memory system' [patent_app_type] => B1 [patent_app_number] => 10/066999 [patent_app_country] => US [patent_app_date] => 2002-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 7774 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 206 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/541/06541847.pdf [firstpage_image] =>[orig_patent_app_number] => 10066999 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/066999
Packaging for multi-processor shared-memory system Feb 3, 2002 Issued
Array ( [id] => 6269570 [patent_doc_number] => 20020105045 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-08 [patent_title] => 'Semiconductor device and chip carrier' [patent_app_type] => new [patent_app_number] => 10/060323 [patent_app_country] => US [patent_app_date] => 2002-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2523 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 29 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0105/20020105045.pdf [firstpage_image] =>[orig_patent_app_number] => 10060323 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/060323
Semiconductor device and chip carrier Jan 31, 2002 Issued
Array ( [id] => 1401974 [patent_doc_number] => 06524351 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-02-25 [patent_title] => 'Semiconductor device mounting jig' [patent_app_type] => B2 [patent_app_number] => 10/050269 [patent_app_country] => US [patent_app_date] => 2002-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 5053 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/524/06524351.pdf [firstpage_image] =>[orig_patent_app_number] => 10050269 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/050269
Semiconductor device mounting jig Jan 15, 2002 Issued
Array ( [id] => 6659656 [patent_doc_number] => 20030134451 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-17 [patent_title] => 'Structure and process for packaging back-to-back chips' [patent_app_type] => new [patent_app_number] => 10/043122 [patent_app_country] => US [patent_app_date] => 2002-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3012 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0134/20030134451.pdf [firstpage_image] =>[orig_patent_app_number] => 10043122 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/043122
Structure and process for packaging back-to-back chips Jan 13, 2002 Abandoned
Array ( [id] => 6758897 [patent_doc_number] => 20030122258 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-03 [patent_title] => 'Current crowding reduction technique using slots' [patent_app_type] => new [patent_app_number] => 10/033008 [patent_app_country] => US [patent_app_date] => 2001-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 2998 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 42 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0122/20030122258.pdf [firstpage_image] =>[orig_patent_app_number] => 10033008 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/033008
Current crowding reduction technique using slots Dec 27, 2001 Abandoned
Array ( [id] => 1192876 [patent_doc_number] => 06730526 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-05-04 [patent_title] => 'Multi-chip module system and method of fabrication' [patent_app_type] => B2 [patent_app_number] => 10/033234 [patent_app_country] => US [patent_app_date] => 2001-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 3483 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/730/06730526.pdf [firstpage_image] =>[orig_patent_app_number] => 10033234 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/033234
Multi-chip module system and method of fabrication Dec 27, 2001 Issued
Array ( [id] => 547794 [patent_doc_number] => 07166915 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-01-23 [patent_title] => 'Multi-chip module system' [patent_app_type] => utility [patent_app_number] => 10/032734 [patent_app_country] => US [patent_app_date] => 2001-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 3481 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/166/07166915.pdf [firstpage_image] =>[orig_patent_app_number] => 10032734 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/032734
Multi-chip module system Dec 27, 2001 Issued
Array ( [id] => 6903804 [patent_doc_number] => 20050099199 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-12 [patent_title] => 'Semiconductor device and its test method' [patent_app_type] => utility [patent_app_number] => 10/468794 [patent_app_country] => US [patent_app_date] => 2001-12-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 10647 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0099/20050099199.pdf [firstpage_image] =>[orig_patent_app_number] => 10468794 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/468794
Semiconductor device and its test method Dec 25, 2001 Abandoned
Array ( [id] => 508037 [patent_doc_number] => 07202556 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-04-10 [patent_title] => 'Semiconductor package having substrate with multi-layer metal bumps' [patent_app_type] => utility [patent_app_number] => 10/023049 [patent_app_country] => US [patent_app_date] => 2001-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 24 [patent_no_of_words] => 7400 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/202/07202556.pdf [firstpage_image] =>[orig_patent_app_number] => 10023049 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/023049
Semiconductor package having substrate with multi-layer metal bumps Dec 19, 2001 Issued
Array ( [id] => 1519024 [patent_doc_number] => 06501164 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-12-31 [patent_title] => 'Multi-chip semiconductor package with heat dissipating structure' [patent_app_type] => B1 [patent_app_number] => 10/026599 [patent_app_country] => US [patent_app_date] => 2001-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 2788 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/501/06501164.pdf [firstpage_image] =>[orig_patent_app_number] => 10026599 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/026599
Multi-chip semiconductor package with heat dissipating structure Dec 19, 2001 Issued
Array ( [id] => 6666756 [patent_doc_number] => 20030111739 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-19 [patent_title] => 'Semiconductor device and package thereof' [patent_app_type] => new [patent_app_number] => 10/020928 [patent_app_country] => US [patent_app_date] => 2001-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4292 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0111/20030111739.pdf [firstpage_image] =>[orig_patent_app_number] => 10020928 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/020928
Semiconductor device and package thereof Dec 18, 2001 Abandoned
Array ( [id] => 6393649 [patent_doc_number] => 20020036100 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-03-28 [patent_title] => 'Microbeam assembly for integrated circuit interconnection to substrates' [patent_app_type] => new [patent_app_number] => 10/005633 [patent_app_country] => US [patent_app_date] => 2001-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4414 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20020036100.pdf [firstpage_image] =>[orig_patent_app_number] => 10005633 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/005633
Microbeam assembly for integrated circuit interconnection to substrates Dec 4, 2001 Abandoned
Array ( [id] => 935675 [patent_doc_number] => 06975025 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-12-13 [patent_title] => 'Semiconductor chip package and method of manufacturing same' [patent_app_type] => utility [patent_app_number] => 09/999169 [patent_app_country] => US [patent_app_date] => 2001-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 3010 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/975/06975025.pdf [firstpage_image] =>[orig_patent_app_number] => 09999169 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/999169
Semiconductor chip package and method of manufacturing same Dec 2, 2001 Issued
Array ( [id] => 6095905 [patent_doc_number] => 20020052091 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-05-02 [patent_title] => 'Automated combi deposition apparatus and method' [patent_app_type] => new [patent_app_number] => 09/994669 [patent_app_country] => US [patent_app_date] => 2001-11-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3223 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0052/20020052091.pdf [firstpage_image] =>[orig_patent_app_number] => 09994669 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/994669
Automated combi deposition apparatus and method Nov 27, 2001 Issued
Array ( [id] => 1310158 [patent_doc_number] => 06617672 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-09-09 [patent_title] => 'Method for producing contact chip cards with a low-cost dielectric' [patent_app_type] => B1 [patent_app_number] => 09/979709 [patent_app_country] => US [patent_app_date] => 2001-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 0 [patent_no_of_words] => 3372 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/617/06617672.pdf [firstpage_image] =>[orig_patent_app_number] => 09979709 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/979709
Method for producing contact chip cards with a low-cost dielectric Nov 25, 2001 Issued
Array ( [id] => 999872 [patent_doc_number] => 06911723 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-06-28 [patent_title] => 'Multiple die stack apparatus employing T-shaped interposer elements' [patent_app_type] => utility [patent_app_number] => 09/989326 [patent_app_country] => US [patent_app_date] => 2001-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 3769 [patent_no_of_claims] => 50 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/911/06911723.pdf [firstpage_image] =>[orig_patent_app_number] => 09989326 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/989326
Multiple die stack apparatus employing T-shaped interposer elements Nov 19, 2001 Issued
Menu