
David E. Graybill
Examiner (ID: 12341, Phone: (571)272-1930 , Office: P/2894 )
| Most Active Art Unit | 2894 |
| Art Unit(s) | 2894, 3727, 2812, 1107, 2827, 2814, 1763, 2822 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1192905
[patent_doc_number] => 06730543
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[patent_kind] => B2
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[patent_title] => 'Methods for multiple die stack apparatus employing'
[patent_app_type] => B2
[patent_app_number] => 09/989341
[patent_app_country] => US
[patent_app_date] => 2001-11-20
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[pdf_file] => patents/06/730/06730543.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/989341 | Methods for multiple die stack apparatus employing | Nov 19, 2001 | Issued |
Array
(
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[patent_issue_date] => 2002-06-06
[patent_title] => 'Ultra-fine contact alignment'
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Array
(
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[patent_doc_number] => 20020113322
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[patent_issue_date] => 2002-08-22
[patent_title] => 'Semiconductor device and method to produce the same'
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[patent_app_number] => 10/000177
[patent_app_country] => US
[patent_app_date] => 2001-11-02
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[patent_drawing_sheets_cnt] => 6
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[firstpage_image] =>[orig_patent_app_number] => 10000177
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/000177 | Semiconductor device and method to produce the same | Nov 1, 2001 | Abandoned |
| 09/806401 | Electronic module, especially a multichip module, with multi-layer metallization and corresponding production method | Oct 21, 2001 | Abandoned |
Array
(
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[patent_issue_date] => 2002-02-07
[patent_title] => 'Semiconductor device, function setting method thereof, and evaluation method thereof'
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Array
(
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[patent_title] => 'Multi-chip package type semiconductor device'
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[patent_app_date] => 2001-09-27
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[firstpage_image] =>[orig_patent_app_number] => 09963590
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/963590 | Multi-chip package type semiconductor device | Sep 26, 2001 | Issued |
Array
(
[id] => 6129997
[patent_doc_number] => 20020076852
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[patent_kind] => A1
[patent_issue_date] => 2002-06-20
[patent_title] => 'Method for manufacturing a component which is encapsulated in plastic, and a component which is encapsulated in plastic'
[patent_app_type] => new
[patent_app_number] => 09/962697
[patent_app_country] => US
[patent_app_date] => 2001-09-24
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/962697 | Method for manufacturing a component which is encapsulated in plastic, and a component which is encapsulated in plastic | Sep 23, 2001 | Abandoned |
Array
(
[id] => 6395981
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[patent_title] => 'High frequency flip chip module and assembling method thereof'
[patent_app_type] => new
[patent_app_number] => 09/960338
[patent_app_country] => US
[patent_app_date] => 2001-09-24
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/960338 | High frequency flip chip module and assembling method thereof | Sep 23, 2001 | Abandoned |
Array
(
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[patent_issue_date] => 2006-08-08
[patent_title] => 'Process for the formation of a spatial chip arrangement and spatial chip arrangement'
[patent_app_type] => utility
[patent_app_number] => 09/962553
[patent_app_country] => US
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Array
(
[id] => 1022433
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[patent_title] => 'Bare chip carrier and method for manufacturing semiconductor device using the bare chip carrier'
[patent_app_type] => utility
[patent_app_number] => 09/956348
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Array
(
[id] => 6720894
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[patent_title] => 'Method for producing an image sensor assembly'
[patent_app_type] => new
[patent_app_number] => 09/957188
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/957188 | Method for producing an image sensor assembly | Sep 19, 2001 | Abandoned |
Array
(
[id] => 6237537
[patent_doc_number] => 20020043702
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[patent_title] => 'Semiconductor package comprising substrate with mounting leads and manufacturing method therefor'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/957888 | Semiconductor package comprising substrate with mounting leads and manufacturing method therefor | Sep 19, 2001 | Abandoned |
Array
(
[id] => 1576417
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[patent_title] => 'Flip-chip transition interface structure'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/957439 | Flip-chip transition interface structure | Sep 16, 2001 | Issued |
Array
(
[id] => 6577680
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Array
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[patent_title] => 'Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly'
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Array
(
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Array
(
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[patent_title] => 'Thin semiconductor package including stacked dies'
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Array
(
[id] => 6107203
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Array
(
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Array
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