Search

David E. Graybill

Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )

Most Active Art Unit
2894
Art Unit(s)
2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6897475 [patent_doc_number] => 20010045640 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-11-29 [patent_title] => 'Resin-molded semiconductor device and method for manufacturing the same' [patent_app_type] => new [patent_app_number] => 09/908810 [patent_app_country] => US [patent_app_date] => 2001-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 10548 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0045/20010045640.pdf [firstpage_image] =>[orig_patent_app_number] => 09908810 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/908810
Resin-molded semiconductor device and method for manufacturing the same Jul 19, 2001 Abandoned
Array ( [id] => 1208717 [patent_doc_number] => 06708398 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-23 [patent_title] => 'Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package' [patent_app_type] => B2 [patent_app_number] => 09/907639 [patent_app_country] => US [patent_app_date] => 2001-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 18 [patent_no_of_words] => 5659 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/708/06708398.pdf [firstpage_image] =>[orig_patent_app_number] => 09907639 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/907639
Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package Jul 18, 2001 Issued
Array ( [id] => 5870671 [patent_doc_number] => 20020047186 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-04-25 [patent_title] => 'Semiconductor leadframes comprising silver plating' [patent_app_type] => new [patent_app_number] => 09/907237 [patent_app_country] => US [patent_app_date] => 2001-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5445 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0047/20020047186.pdf [firstpage_image] =>[orig_patent_app_number] => 09907237 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/907237
Semiconductor leadframes comprising silver plating Jul 16, 2001 Abandoned
Array ( [id] => 5888706 [patent_doc_number] => 20020013035 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-31 [patent_title] => 'Method of manufacturing a semiconductor device' [patent_app_type] => new [patent_app_number] => 09/906602 [patent_app_country] => US [patent_app_date] => 2001-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2611 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 32 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0013/20020013035.pdf [firstpage_image] =>[orig_patent_app_number] => 09906602 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/906602
Method of manufacturing a semiconductor device Jul 16, 2001 Issued
Array ( [id] => 6522972 [patent_doc_number] => 20020109223 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-15 [patent_title] => 'High-frequency integrated circuit and high-frequency circuit device using the same' [patent_app_type] => new [patent_app_number] => 09/906049 [patent_app_country] => US [patent_app_date] => 2001-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 9624 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 161 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0109/20020109223.pdf [firstpage_image] =>[orig_patent_app_number] => 09906049 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/906049
High-frequency integrated circuit and high-frequency circuit device using the same Jul 16, 2001 Issued
Array ( [id] => 774846 [patent_doc_number] => 07002236 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-02-21 [patent_title] => 'Semiconductor package and method for producing the same' [patent_app_type] => utility [patent_app_number] => 09/898068 [patent_app_country] => US [patent_app_date] => 2001-07-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 4143 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 284 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/002/07002236.pdf [firstpage_image] =>[orig_patent_app_number] => 09898068 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/898068
Semiconductor package and method for producing the same Jul 4, 2001 Issued
Array ( [id] => 1191760 [patent_doc_number] => 06730134 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-05-04 [patent_title] => 'Interposer assembly' [patent_app_type] => B2 [patent_app_number] => 09/897332 [patent_app_country] => US [patent_app_date] => 2001-07-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 14 [patent_no_of_words] => 3994 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/730/06730134.pdf [firstpage_image] =>[orig_patent_app_number] => 09897332 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/897332
Interposer assembly Jul 1, 2001 Issued
Array ( [id] => 7465190 [patent_doc_number] => 20040053447 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-03-18 [patent_title] => 'Leadframe having fine pitch bond fingers formed using laser cutting method' [patent_app_type] => new [patent_app_number] => 09/895501 [patent_app_country] => US [patent_app_date] => 2001-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3611 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 35 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0053/20040053447.pdf [firstpage_image] =>[orig_patent_app_number] => 09895501 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/895501
Leadframe having fine pitch bond fingers formed using laser cutting method Jun 28, 2001 Abandoned
Array ( [id] => 6755848 [patent_doc_number] => 20030003625 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-02 [patent_title] => 'Leadframe pedestals for uniform die attach' [patent_app_type] => new [patent_app_number] => 09/896452 [patent_app_country] => US [patent_app_date] => 2001-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3537 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0003/20030003625.pdf [firstpage_image] =>[orig_patent_app_number] => 09896452 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/896452
Leadframe pedestals for uniform die attach Jun 28, 2001 Abandoned
Array ( [id] => 6269625 [patent_doc_number] => 20020105061 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-08 [patent_title] => 'Semiconductor device and manufacturing method thereof' [patent_app_type] => new [patent_app_number] => 09/892539 [patent_app_country] => US [patent_app_date] => 2001-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 6608 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0105/20020105061.pdf [firstpage_image] =>[orig_patent_app_number] => 09892539 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/892539
Semiconductor device Jun 27, 2001 Issued
Array ( [id] => 7647043 [patent_doc_number] => 06476475 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-11-05 [patent_title] => 'Stacked SRAM die package' [patent_app_type] => B1 [patent_app_number] => 09/892779 [patent_app_country] => US [patent_app_date] => 2001-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2268 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 5 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/476/06476475.pdf [firstpage_image] =>[orig_patent_app_number] => 09892779 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/892779
Stacked SRAM die package Jun 27, 2001 Issued
Array ( [id] => 6753474 [patent_doc_number] => 20030001250 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-02 [patent_title] => 'TCP optical device' [patent_app_type] => new [patent_app_number] => 09/888379 [patent_app_country] => US [patent_app_date] => 2001-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2544 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20030001250.pdf [firstpage_image] =>[orig_patent_app_number] => 09888379 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/888379
TCP optical device Jun 26, 2001 Abandoned
Array ( [id] => 1547562 [patent_doc_number] => 06445066 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-09-03 [patent_title] => 'Splitting and assigning power planes' [patent_app_type] => B1 [patent_app_number] => 09/885491 [patent_app_country] => US [patent_app_date] => 2001-06-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 3090 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 297 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/445/06445066.pdf [firstpage_image] =>[orig_patent_app_number] => 09885491 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/885491
Splitting and assigning power planes Jun 19, 2001 Issued
Array ( [id] => 7643587 [patent_doc_number] => 06429454 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-08-06 [patent_title] => 'Semiconductor device with test circuit' [patent_app_type] => B2 [patent_app_number] => 09/877788 [patent_app_country] => US [patent_app_date] => 2001-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 3667 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 5 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/429/06429454.pdf [firstpage_image] =>[orig_patent_app_number] => 09877788 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/877788
Semiconductor device with test circuit Jun 10, 2001 Issued
Array ( [id] => 6028833 [patent_doc_number] => 20020017709 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-02-14 [patent_title] => 'Assembly jig and manufacturing method of multilayer semiconductor device' [patent_app_type] => new [patent_app_number] => 09/876290 [patent_app_country] => US [patent_app_date] => 2001-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5629 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 173 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0017/20020017709.pdf [firstpage_image] =>[orig_patent_app_number] => 09876290 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/876290
Assembly jig and manufacturing method of multilayer semiconductor device Jun 6, 2001 Abandoned
Array ( [id] => 6895222 [patent_doc_number] => 20010026012 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-10-04 [patent_title] => 'Method and apparatus for mounting component' [patent_app_type] => new [patent_app_number] => 09/873347 [patent_app_country] => US [patent_app_date] => 2001-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 9967 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0026/20010026012.pdf [firstpage_image] =>[orig_patent_app_number] => 09873347 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/873347
Method and apparatus for mounting component Jun 4, 2001 Issued
Array ( [id] => 620025 [patent_doc_number] => 07141448 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-11-28 [patent_title] => 'Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials' [patent_app_type] => utility [patent_app_number] => 09/874666 [patent_app_country] => US [patent_app_date] => 2001-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1713 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/141/07141448.pdf [firstpage_image] =>[orig_patent_app_number] => 09874666 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/874666
Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials Jun 4, 2001 Issued
Array ( [id] => 975970 [patent_doc_number] => 06933587 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-08-23 [patent_title] => 'Electronic circuit unit suitable for miniaturization' [patent_app_type] => utility [patent_app_number] => 09/870129 [patent_app_country] => US [patent_app_date] => 2001-05-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 20 [patent_no_of_words] => 6580 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/933/06933587.pdf [firstpage_image] =>[orig_patent_app_number] => 09870129 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/870129
Electronic circuit unit suitable for miniaturization May 28, 2001 Issued
Array ( [id] => 6901498 [patent_doc_number] => 20010023081 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-09-20 [patent_title] => 'Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices' [patent_app_type] => new [patent_app_number] => 09/867364 [patent_app_country] => US [patent_app_date] => 2001-05-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3887 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20010023081.pdf [firstpage_image] =>[orig_patent_app_number] => 09867364 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/867364
Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices May 28, 2001 Issued
Array ( [id] => 1225143 [patent_doc_number] => 06700177 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-02 [patent_title] => 'Compact, surface-mounting-type, electronic-circuit unit' [patent_app_type] => B2 [patent_app_number] => 09/867919 [patent_app_country] => US [patent_app_date] => 2001-05-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 20 [patent_no_of_words] => 6149 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/700/06700177.pdf [firstpage_image] =>[orig_patent_app_number] => 09867919 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/867919
Compact, surface-mounting-type, electronic-circuit unit May 28, 2001 Issued
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