
David E. Graybill
Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )
| Most Active Art Unit | 2894 |
| Art Unit(s) | 2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6897475
[patent_doc_number] => 20010045640
[patent_country] => US
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[patent_title] => 'Resin-molded semiconductor device and method for manufacturing the same'
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[patent_app_number] => 09/908810
[patent_app_country] => US
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Array
(
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[patent_doc_number] => 06708398
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[patent_kind] => B2
[patent_issue_date] => 2004-03-23
[patent_title] => 'Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package'
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[patent_app_number] => 09/907639
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/907639 | Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package | Jul 18, 2001 | Issued |
Array
(
[id] => 5870671
[patent_doc_number] => 20020047186
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[patent_kind] => A1
[patent_issue_date] => 2002-04-25
[patent_title] => 'Semiconductor leadframes comprising silver plating'
[patent_app_type] => new
[patent_app_number] => 09/907237
[patent_app_country] => US
[patent_app_date] => 2001-07-17
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Array
(
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[patent_title] => 'Method of manufacturing a semiconductor device'
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Array
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Array
(
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[patent_issue_date] => 2006-02-21
[patent_title] => 'Semiconductor package and method for producing the same'
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Array
(
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[patent_title] => 'Interposer assembly'
[patent_app_type] => B2
[patent_app_number] => 09/897332
[patent_app_country] => US
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Array
(
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[patent_issue_date] => 2004-03-18
[patent_title] => 'Leadframe having fine pitch bond fingers formed using laser cutting method'
[patent_app_type] => new
[patent_app_number] => 09/895501
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[patent_app_date] => 2001-06-29
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[firstpage_image] =>[orig_patent_app_number] => 09895501
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/895501 | Leadframe having fine pitch bond fingers formed using laser cutting method | Jun 28, 2001 | Abandoned |
Array
(
[id] => 6755848
[patent_doc_number] => 20030003625
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-01-02
[patent_title] => 'Leadframe pedestals for uniform die attach'
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Array
(
[id] => 6269625
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Array
(
[id] => 7647043
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[patent_title] => 'Stacked SRAM die package'
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Array
(
[id] => 6753474
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Array
(
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Array
(
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Array
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Array
(
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Array
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Array
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Array
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Array
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