Search

David E. Graybill

Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )

Most Active Art Unit
2894
Art Unit(s)
2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1559674 [patent_doc_number] => 06436754 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-08-20 [patent_title] => 'Selective salicide process by reformation of silicon nitride sidewall spacers' [patent_app_type] => B1 [patent_app_number] => 09/863221 [patent_app_country] => US [patent_app_date] => 2001-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 2216 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 235 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/436/06436754.pdf [firstpage_image] =>[orig_patent_app_number] => 09863221 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/863221
Selective salicide process by reformation of silicon nitride sidewall spacers May 23, 2001 Issued
Array ( [id] => 6985601 [patent_doc_number] => 20010035571 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-11-01 [patent_title] => 'Lead frame assemblies with voltage reference plane and IC packages including same' [patent_app_type] => new [patent_app_number] => 09/864698 [patent_app_country] => US [patent_app_date] => 2001-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 4634 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0035/20010035571.pdf [firstpage_image] =>[orig_patent_app_number] => 09864698 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/864698
Lead frame assemblies with voltage reference plane and IC packages including same May 22, 2001 Issued
Array ( [id] => 1380388 [patent_doc_number] => 06544301 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-04-08 [patent_title] => 'Method and apparatus for manufacturing solid electrolytic capacitor' [patent_app_type] => B2 [patent_app_number] => 09/861958 [patent_app_country] => US [patent_app_date] => 2001-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 22 [patent_no_of_words] => 14342 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/544/06544301.pdf [firstpage_image] =>[orig_patent_app_number] => 09861958 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/861958
Method and apparatus for manufacturing solid electrolytic capacitor May 20, 2001 Issued
Array ( [id] => 6434391 [patent_doc_number] => 20020127772 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-12 [patent_title] => 'Bumpless flip chip assembly with solder via' [patent_app_type] => new [patent_app_number] => 09/852824 [patent_app_country] => US [patent_app_date] => 2001-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2648 [patent_no_of_claims] => 55 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20020127772.pdf [firstpage_image] =>[orig_patent_app_number] => 09852824 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/852824
Bumpless flip chip assembly with solder via May 9, 2001 Abandoned
Array ( [id] => 6044422 [patent_doc_number] => 20020167077 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-11-14 [patent_title] => 'Flip-chip package with underfill having low density filler' [patent_app_type] => new [patent_app_number] => 09/850922 [patent_app_country] => US [patent_app_date] => 2001-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5360 [patent_no_of_claims] => 38 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0167/20020167077.pdf [firstpage_image] =>[orig_patent_app_number] => 09850922 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/850922
Flip-chip package with underfill having low density filler May 7, 2001 Issued
Array ( [id] => 6892072 [patent_doc_number] => 20010018234 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-08-30 [patent_title] => 'Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components' [patent_app_type] => new [patent_app_number] => 09/849812 [patent_app_country] => US [patent_app_date] => 2001-05-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 5536 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0018/20010018234.pdf [firstpage_image] =>[orig_patent_app_number] => 09849812 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/849812
Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components May 3, 2001 Issued
Array ( [id] => 6891251 [patent_doc_number] => 20010017413 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-08-30 [patent_title] => 'Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components' [patent_app_type] => new [patent_app_number] => 09/849037 [patent_app_country] => US [patent_app_date] => 2001-05-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 5536 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0017/20010017413.pdf [firstpage_image] =>[orig_patent_app_number] => 09849037 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/849037
Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components May 3, 2001 Issued
Array ( [id] => 1375259 [patent_doc_number] => 06558981 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-05-06 [patent_title] => 'Method for making an encapsulated semiconductor chip module' [patent_app_type] => B2 [patent_app_number] => 09/848510 [patent_app_country] => US [patent_app_date] => 2001-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 3238 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 188 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/558/06558981.pdf [firstpage_image] =>[orig_patent_app_number] => 09848510 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/848510
Method for making an encapsulated semiconductor chip module May 2, 2001 Issued
Array ( [id] => 1576401 [patent_doc_number] => 06469377 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-10-22 [patent_title] => 'Semiconductor device' [patent_app_type] => B1 [patent_app_number] => 09/842938 [patent_app_country] => US [patent_app_date] => 2001-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 4629 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/469/06469377.pdf [firstpage_image] =>[orig_patent_app_number] => 09842938 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/842938
Semiconductor device Apr 24, 2001 Issued
Array ( [id] => 6986863 [patent_doc_number] => 20010036695 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-11-01 [patent_title] => 'Chip scale package' [patent_app_type] => new [patent_app_number] => 09/840439 [patent_app_country] => US [patent_app_date] => 2001-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1654 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20010036695.pdf [firstpage_image] =>[orig_patent_app_number] => 09840439 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/840439
Chip scale package Apr 22, 2001 Issued
Array ( [id] => 1410585 [patent_doc_number] => 06534850 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-03-18 [patent_title] => 'Electronic device sealed under vacuum containing a getter and method of operation' [patent_app_type] => B2 [patent_app_number] => 09/836061 [patent_app_country] => US [patent_app_date] => 2001-04-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 13 [patent_no_of_words] => 4700 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/534/06534850.pdf [firstpage_image] =>[orig_patent_app_number] => 09836061 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/836061
Electronic device sealed under vacuum containing a getter and method of operation Apr 15, 2001 Issued
Array ( [id] => 6947907 [patent_doc_number] => 20010021541 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-09-13 [patent_title] => 'Wafer-level package and methods of fabricating' [patent_app_type] => new [patent_app_number] => 09/832160 [patent_app_country] => US [patent_app_date] => 2001-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 7224 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0021/20010021541.pdf [firstpage_image] =>[orig_patent_app_number] => 09832160 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/832160
Wafer-level package and methods of fabricating Apr 8, 2001 Issued
Array ( [id] => 6879085 [patent_doc_number] => 20010030370 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-10-18 [patent_title] => 'Microelectronic assembly having encapsulated wire bonding leads' [patent_app_type] => new [patent_app_number] => 09/827840 [patent_app_country] => US [patent_app_date] => 2001-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 20660 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0030/20010030370.pdf [firstpage_image] =>[orig_patent_app_number] => 09827840 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/827840
Microelectronic assembly having encapsulated wire bonding leads Apr 5, 2001 Abandoned
Array ( [id] => 6921578 [patent_doc_number] => 20010029063 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-10-11 [patent_title] => 'Semiconductor device and manufacturing method thereof' [patent_app_type] => new [patent_app_number] => 09/814942 [patent_app_country] => US [patent_app_date] => 2001-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6240 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0029/20010029063.pdf [firstpage_image] =>[orig_patent_app_number] => 09814942 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/814942
Semiconductor device and manufacturing method thereof Mar 22, 2001 Issued
Array ( [id] => 6577353 [patent_doc_number] => 20020040994 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-04-11 [patent_title] => 'Semiconductor device having trenches and process for same' [patent_app_type] => new [patent_app_number] => 09/813791 [patent_app_country] => US [patent_app_date] => 2001-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 6670 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0040/20020040994.pdf [firstpage_image] =>[orig_patent_app_number] => 09813791 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/813791
Semiconductor device having trenches and process for same Mar 21, 2001 Issued
Array ( [id] => 6907639 [patent_doc_number] => 20010010406 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-08-02 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => new [patent_app_number] => 09/811795 [patent_app_country] => US [patent_app_date] => 2001-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1861 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0010/20010010406.pdf [firstpage_image] =>[orig_patent_app_number] => 09811795 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/811795
Semiconductor device and method for manufacturing the same Mar 18, 2001 Issued
Array ( [id] => 1505290 [patent_doc_number] => 06440178 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-08-27 [patent_title] => 'Modular semiconductor workpiece processing tool' [patent_app_type] => B1 [patent_app_number] => 09/810192 [patent_app_country] => US [patent_app_date] => 2001-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 46 [patent_figures_cnt] => 51 [patent_no_of_words] => 26381 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/440/06440178.pdf [firstpage_image] =>[orig_patent_app_number] => 09810192 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/810192
Modular semiconductor workpiece processing tool Mar 15, 2001 Issued
Array ( [id] => 6887319 [patent_doc_number] => 20010008313 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-07-19 [patent_title] => 'Chip package with degassing holes' [patent_app_type] => new-utility [patent_app_number] => 09/800703 [patent_app_country] => US [patent_app_date] => 2001-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3815 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0008/20010008313.pdf [firstpage_image] =>[orig_patent_app_number] => 09800703 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/800703
Chip package with degassing holes Mar 6, 2001 Issued
Array ( [id] => 5870695 [patent_doc_number] => 20020047197 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-04-25 [patent_title] => 'Semiconductor device module frame and group thereof' [patent_app_type] => new [patent_app_number] => 09/794029 [patent_app_country] => US [patent_app_date] => 2001-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3592 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0047/20020047197.pdf [firstpage_image] =>[orig_patent_app_number] => 09794029 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/794029
Semiconductor device module frame and group thereof Feb 27, 2001 Issued
Array ( [id] => 5948591 [patent_doc_number] => 20020005568 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-17 [patent_title] => 'Semiconductor device and method for manufacturing' [patent_app_type] => new [patent_app_number] => 09/794108 [patent_app_country] => US [patent_app_date] => 2001-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 6653 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0005/20020005568.pdf [firstpage_image] =>[orig_patent_app_number] => 09794108 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/794108
Semiconductor device and method for manufacturing Feb 27, 2001 Issued
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