
David E. Graybill
Examiner (ID: 12341, Phone: (571)272-1930 , Office: P/2894 )
| Most Active Art Unit | 2894 |
| Art Unit(s) | 2894, 3727, 2812, 1107, 2827, 2814, 1763, 2822 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1223636
[patent_doc_number] => 06699730
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-03-02
[patent_title] => 'Stacked microelectronic assembly and method therefor'
[patent_app_type] => B2
[patent_app_number] => 09/776356
[patent_app_country] => US
[patent_app_date] => 2001-02-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 37
[patent_no_of_words] => 8552
[patent_no_of_claims] => 33
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 150
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/699/06699730.pdf
[firstpage_image] =>[orig_patent_app_number] => 09776356
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/776356 | Stacked microelectronic assembly and method therefor | Feb 1, 2001 | Issued |
Array
(
[id] => 6998483
[patent_doc_number] => 20010052644
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-12-20
[patent_title] => 'Copper pad structure'
[patent_app_type] => new
[patent_app_number] => 09/772949
[patent_app_country] => US
[patent_app_date] => 2001-01-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2338
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 55
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0052/20010052644.pdf
[firstpage_image] =>[orig_patent_app_number] => 09772949
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/772949 | Copper pad structure | Jan 30, 2001 | Abandoned |
Array
(
[id] => 6060383
[patent_doc_number] => 20020030258
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-03-14
[patent_title] => 'Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device'
[patent_app_type] => new
[patent_app_number] => 09/766656
[patent_app_country] => US
[patent_app_date] => 2001-01-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 132
[patent_figures_cnt] => 132
[patent_no_of_words] => 70270
[patent_no_of_claims] => 47
[patent_no_of_ind_claims] => 21
[patent_words_short_claim] => 24
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0030/20020030258.pdf
[firstpage_image] =>[orig_patent_app_number] => 09766656
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/766656 | Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device | Jan 22, 2001 | Abandoned |
Array
(
[id] => 7040059
[patent_doc_number] => 20010005046
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-06-28
[patent_title] => 'Direct contact through hole type wafer structure'
[patent_app_type] => new-utility
[patent_app_number] => 09/753735
[patent_app_country] => US
[patent_app_date] => 2001-01-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 2500
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 39
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0005/20010005046.pdf
[firstpage_image] =>[orig_patent_app_number] => 09753735
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/753735 | Direct contact through hole type wafer structure | Jan 1, 2001 | Issued |
Array
(
[id] => 968817
[patent_doc_number] => 06940093
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-09-06
[patent_title] => 'Special contact points for accessing internal circuitry of an integrated circuit'
[patent_app_type] => utility
[patent_app_number] => 09/753309
[patent_app_country] => US
[patent_app_date] => 2000-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 34
[patent_no_of_words] => 9676
[patent_no_of_claims] => 40
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 17
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/940/06940093.pdf
[firstpage_image] =>[orig_patent_app_number] => 09753309
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/753309 | Special contact points for accessing internal circuitry of an integrated circuit | Dec 28, 2000 | Issued |
Array
(
[id] => 6411342
[patent_doc_number] => 20020125044
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-09-12
[patent_title] => 'Layered circuit boards and methods of production thereof'
[patent_app_type] => new
[patent_app_number] => 09/752658
[patent_app_country] => US
[patent_app_date] => 2000-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4085
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 32
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0125/20020125044.pdf
[firstpage_image] =>[orig_patent_app_number] => 09752658
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/752658 | Layered circuit boards and methods of production thereof | Dec 27, 2000 | Abandoned |
Array
(
[id] => 6876098
[patent_doc_number] => 20010006251
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-07-05
[patent_title] => 'Semiconductor device and manufacturing method'
[patent_app_type] => new-utility
[patent_app_number] => 09/741899
[patent_app_country] => US
[patent_app_date] => 2000-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 6948
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 100
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0006/20010006251.pdf
[firstpage_image] =>[orig_patent_app_number] => 09741899
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/741899 | Semiconductor device and manufacturing method | Dec 21, 2000 | Abandoned |
Array
(
[id] => 7040095
[patent_doc_number] => 20010005060
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-06-28
[patent_title] => 'Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device'
[patent_app_type] => new-utility
[patent_app_number] => 09/737768
[patent_app_country] => US
[patent_app_date] => 2000-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 5918
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 79
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0005/20010005060.pdf
[firstpage_image] =>[orig_patent_app_number] => 09737768
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/737768 | Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device | Dec 17, 2000 | Abandoned |
Array
(
[id] => 6907626
[patent_doc_number] => 20010010393
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-08-02
[patent_title] => 'Semiconductor device and semiconductor device mounting method thereof'
[patent_app_type] => new
[patent_app_number] => 09/737658
[patent_app_country] => US
[patent_app_date] => 2000-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 4110
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 8
[patent_words_short_claim] => 63
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0010/20010010393.pdf
[firstpage_image] =>[orig_patent_app_number] => 09737658
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/737658 | Semiconductor device and semiconductor device mounting method thereof | Dec 14, 2000 | Abandoned |
Array
(
[id] => 6130002
[patent_doc_number] => 20020076854
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-06-20
[patent_title] => 'System, method and apparatus for constructing a semiconductor wafer-interposer using B-Stage laminates'
[patent_app_type] => new
[patent_app_number] => 09/738193
[patent_app_country] => US
[patent_app_date] => 2000-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3021
[patent_no_of_claims] => 31
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 79
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0076/20020076854.pdf
[firstpage_image] =>[orig_patent_app_number] => 09738193
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/738193 | System, method and apparatus for constructing a semiconductor wafer-interposer using B-Stage laminates | Dec 14, 2000 | Abandoned |
Array
(
[id] => 1477939
[patent_doc_number] => 06451623
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-17
[patent_title] => 'Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device'
[patent_app_type] => B1
[patent_app_number] => 09/717082
[patent_app_country] => US
[patent_app_date] => 2000-11-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 5
[patent_no_of_words] => 3185
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 116
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/451/06451623.pdf
[firstpage_image] =>[orig_patent_app_number] => 09717082
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/717082 | Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device | Nov 21, 2000 | Issued |
Array
(
[id] => 1422713
[patent_doc_number] => 06518662
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-02-11
[patent_title] => 'Method of assembling a semiconductor chip package'
[patent_app_type] => B1
[patent_app_number] => 09/713527
[patent_app_country] => US
[patent_app_date] => 2000-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 11
[patent_no_of_words] => 7811
[patent_no_of_claims] => 35
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 147
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/518/06518662.pdf
[firstpage_image] =>[orig_patent_app_number] => 09713527
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/713527 | Method of assembling a semiconductor chip package | Nov 14, 2000 | Issued |
Array
(
[id] => 1063702
[patent_doc_number] => 06849916
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2005-02-01
[patent_title] => 'Flip chip on glass sensor package'
[patent_app_type] => utility
[patent_app_number] => 09/713848
[patent_app_country] => US
[patent_app_date] => 2000-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 11
[patent_no_of_words] => 6924
[patent_no_of_claims] => 28
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/849/06849916.pdf
[firstpage_image] =>[orig_patent_app_number] => 09713848
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/713848 | Flip chip on glass sensor package | Nov 14, 2000 | Issued |
| 09/673479 | Binder, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment | Oct 15, 2000 | Abandoned |
Array
(
[id] => 1253263
[patent_doc_number] => 06670214
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-12-30
[patent_title] => 'Insulated bonding wire for microelectronic packaging'
[patent_app_type] => B1
[patent_app_number] => 09/687263
[patent_app_country] => US
[patent_app_date] => 2000-10-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 5
[patent_no_of_words] => 1363
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/670/06670214.pdf
[firstpage_image] =>[orig_patent_app_number] => 09687263
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/687263 | Insulated bonding wire for microelectronic packaging | Oct 11, 2000 | Issued |
Array
(
[id] => 1219248
[patent_doc_number] => 06702865
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-03-09
[patent_title] => 'Alignment processing mechanism and semiconductor processing device using it'
[patent_app_type] => B1
[patent_app_number] => 09/647659
[patent_app_country] => US
[patent_app_date] => 2000-10-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 5406
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 126
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/702/06702865.pdf
[firstpage_image] =>[orig_patent_app_number] => 09647659
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/647659 | Alignment processing mechanism and semiconductor processing device using it | Oct 3, 2000 | Issued |
Array
(
[id] => 487564
[patent_doc_number] => 07217999
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2007-05-15
[patent_title] => 'Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board'
[patent_app_type] => utility
[patent_app_number] => 09/678609
[patent_app_country] => US
[patent_app_date] => 2000-10-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 158
[patent_figures_cnt] => 158
[patent_no_of_words] => 67952
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 142
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/217/07217999.pdf
[firstpage_image] =>[orig_patent_app_number] => 09678609
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/678609 | Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board | Oct 3, 2000 | Issued |
Array
(
[id] => 1476389
[patent_doc_number] => 06388317
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-14
[patent_title] => 'Solid-state chip cooling by use of microchannel coolant flow'
[patent_app_type] => B1
[patent_app_number] => 09/669468
[patent_app_country] => US
[patent_app_date] => 2000-09-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 18
[patent_no_of_words] => 10213
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 131
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/388/06388317.pdf
[firstpage_image] =>[orig_patent_app_number] => 09669468
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/669468 | Solid-state chip cooling by use of microchannel coolant flow | Sep 24, 2000 | Issued |
Array
(
[id] => 1281111
[patent_doc_number] => 06646289
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-11-11
[patent_title] => 'Integrated circuit device'
[patent_app_type] => B1
[patent_app_number] => 09/601895
[patent_app_country] => US
[patent_app_date] => 2000-09-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
[patent_figures_cnt] => 47
[patent_no_of_words] => 5758
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/646/06646289.pdf
[firstpage_image] =>[orig_patent_app_number] => 09601895
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/601895 | Integrated circuit device | Sep 21, 2000 | Issued |
Array
(
[id] => 7612374
[patent_doc_number] => 06903463
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2005-06-07
[patent_title] => 'COG-assembly and connecting material to be used therein'
[patent_app_type] => utility
[patent_app_number] => 09/659448
[patent_app_country] => US
[patent_app_date] => 2000-09-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 4862
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 126
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/903/06903463.pdf
[firstpage_image] =>[orig_patent_app_number] => 09659448
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/659448 | COG-assembly and connecting material to be used therein | Sep 10, 2000 | Issued |