
David E. Graybill
Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )
| Most Active Art Unit | 2894 |
| Art Unit(s) | 2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6334320
[patent_doc_number] => 20020033522
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-03-21
[patent_title] => 'IC socket'
[patent_app_type] => new
[patent_app_number] => 09/791788
[patent_app_country] => US
[patent_app_date] => 2001-02-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] => publications/A1/0033/20020033522.pdf
[firstpage_image] =>[orig_patent_app_number] => 09791788
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/791788 | IC socket | Feb 25, 2001 | Issued |
Array
(
[id] => 6366394
[patent_doc_number] => 20020117753
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[patent_kind] => A1
[patent_issue_date] => 2002-08-29
[patent_title] => 'Three dimensional packaging'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/792479 | Three dimensional packaging | Feb 22, 2001 | Abandoned |
Array
(
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[patent_issue_date] => 2006-03-14
[patent_title] => 'Semiconductor device and process for fabrication thereof'
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Array
(
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[patent_doc_number] => 20010035533
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[patent_issue_date] => 2001-11-01
[patent_title] => 'Semiconductor device and process for fabrication thereof'
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Array
(
[id] => 1138044
[patent_doc_number] => 06780675
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[patent_kind] => B2
[patent_issue_date] => 2004-08-24
[patent_title] => 'Flip-chip technique for chip assembly'
[patent_app_type] => B2
[patent_app_number] => 09/780207
[patent_app_country] => US
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[pdf_file] => patents/06/780/06780675.pdf
[firstpage_image] =>[orig_patent_app_number] => 09780207
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/780207 | Flip-chip technique for chip assembly | Feb 8, 2001 | Issued |
Array
(
[id] => 1223636
[patent_doc_number] => 06699730
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-03-02
[patent_title] => 'Stacked microelectronic assembly and method therefor'
[patent_app_type] => B2
[patent_app_number] => 09/776356
[patent_app_country] => US
[patent_app_date] => 2001-02-02
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[patent_drawing_sheets_cnt] => 12
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[firstpage_image] =>[orig_patent_app_number] => 09776356
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/776356 | Stacked microelectronic assembly and method therefor | Feb 1, 2001 | Issued |
Array
(
[id] => 6998483
[patent_doc_number] => 20010052644
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[patent_kind] => A1
[patent_issue_date] => 2001-12-20
[patent_title] => 'Copper pad structure'
[patent_app_type] => new
[patent_app_number] => 09/772949
[patent_app_country] => US
[patent_app_date] => 2001-01-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => publications/A1/0052/20010052644.pdf
[firstpage_image] =>[orig_patent_app_number] => 09772949
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/772949 | Copper pad structure | Jan 30, 2001 | Abandoned |
Array
(
[id] => 6060383
[patent_doc_number] => 20020030258
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-03-14
[patent_title] => 'Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device'
[patent_app_type] => new
[patent_app_number] => 09/766656
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[patent_app_date] => 2001-01-23
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[patent_drawing_sheets_cnt] => 132
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[pdf_file] => publications/A1/0030/20020030258.pdf
[firstpage_image] =>[orig_patent_app_number] => 09766656
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/766656 | Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device | Jan 22, 2001 | Abandoned |
Array
(
[id] => 7040059
[patent_doc_number] => 20010005046
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-06-28
[patent_title] => 'Direct contact through hole type wafer structure'
[patent_app_type] => new-utility
[patent_app_number] => 09/753735
[patent_app_country] => US
[patent_app_date] => 2001-01-02
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[patent_drawing_sheets_cnt] => 10
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/753735 | Direct contact through hole type wafer structure | Jan 1, 2001 | Issued |
Array
(
[id] => 968817
[patent_doc_number] => 06940093
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-09-06
[patent_title] => 'Special contact points for accessing internal circuitry of an integrated circuit'
[patent_app_type] => utility
[patent_app_number] => 09/753309
[patent_app_country] => US
[patent_app_date] => 2000-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[pdf_file] => patents/06/940/06940093.pdf
[firstpage_image] =>[orig_patent_app_number] => 09753309
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/753309 | Special contact points for accessing internal circuitry of an integrated circuit | Dec 28, 2000 | Issued |
Array
(
[id] => 6411342
[patent_doc_number] => 20020125044
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-09-12
[patent_title] => 'Layered circuit boards and methods of production thereof'
[patent_app_type] => new
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/752658 | Layered circuit boards and methods of production thereof | Dec 27, 2000 | Abandoned |
Array
(
[id] => 6876098
[patent_doc_number] => 20010006251
[patent_country] => US
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[patent_issue_date] => 2001-07-05
[patent_title] => 'Semiconductor device and manufacturing method'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/741899 | Semiconductor device and manufacturing method | Dec 21, 2000 | Abandoned |
Array
(
[id] => 7040095
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[patent_title] => 'Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device'
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Array
(
[id] => 6907626
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[patent_title] => 'Semiconductor device and semiconductor device mounting method thereof'
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Array
(
[id] => 6130002
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Array
(
[id] => 1477939
[patent_doc_number] => 06451623
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-17
[patent_title] => 'Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device'
[patent_app_type] => B1
[patent_app_number] => 09/717082
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[firstpage_image] =>[orig_patent_app_number] => 09717082
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/717082 | Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device | Nov 21, 2000 | Issued |
Array
(
[id] => 1063702
[patent_doc_number] => 06849916
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2005-02-01
[patent_title] => 'Flip chip on glass sensor package'
[patent_app_type] => utility
[patent_app_number] => 09/713848
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/713848 | Flip chip on glass sensor package | Nov 14, 2000 | Issued |
Array
(
[id] => 1422713
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[patent_title] => 'Method of assembling a semiconductor chip package'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/713527 | Method of assembling a semiconductor chip package | Nov 14, 2000 | Issued |
| 09/673479 | Binder, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment | Oct 15, 2000 | Abandoned |
Array
(
[id] => 1253263
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[patent_title] => 'Insulated bonding wire for microelectronic packaging'
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[firstpage_image] =>[orig_patent_app_number] => 09687263
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/687263 | Insulated bonding wire for microelectronic packaging | Oct 11, 2000 | Issued |