Search

David E. Graybill

Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )

Most Active Art Unit
2894
Art Unit(s)
2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6334320 [patent_doc_number] => 20020033522 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-03-21 [patent_title] => 'IC socket' [patent_app_type] => new [patent_app_number] => 09/791788 [patent_app_country] => US [patent_app_date] => 2001-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3652 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0033/20020033522.pdf [firstpage_image] =>[orig_patent_app_number] => 09791788 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/791788
IC socket Feb 25, 2001 Issued
Array ( [id] => 6366394 [patent_doc_number] => 20020117753 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-29 [patent_title] => 'Three dimensional packaging' [patent_app_type] => new [patent_app_number] => 09/792479 [patent_app_country] => US [patent_app_date] => 2001-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5274 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0117/20020117753.pdf [firstpage_image] =>[orig_patent_app_number] => 09792479 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/792479
Three dimensional packaging Feb 22, 2001 Abandoned
Array ( [id] => 762064 [patent_doc_number] => 07012320 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-03-14 [patent_title] => 'Semiconductor device and process for fabrication thereof' [patent_app_type] => utility [patent_app_number] => 09/785486 [patent_app_country] => US [patent_app_date] => 2001-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 7956 [patent_no_of_claims] => 42 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/012/07012320.pdf [firstpage_image] =>[orig_patent_app_number] => 09785486 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/785486
Semiconductor device and process for fabrication thereof Feb 19, 2001 Issued
Array ( [id] => 6985540 [patent_doc_number] => 20010035533 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-11-01 [patent_title] => 'Semiconductor device and process for fabrication thereof' [patent_app_type] => new [patent_app_number] => 09/785194 [patent_app_country] => US [patent_app_date] => 2001-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 8042 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 19 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0035/20010035533.pdf [firstpage_image] =>[orig_patent_app_number] => 09785194 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/785194
Semiconductor device and process for fabrication thereof Feb 19, 2001 Issued
Array ( [id] => 1138044 [patent_doc_number] => 06780675 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-08-24 [patent_title] => 'Flip-chip technique for chip assembly' [patent_app_type] => B2 [patent_app_number] => 09/780207 [patent_app_country] => US [patent_app_date] => 2001-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2972 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 299 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/780/06780675.pdf [firstpage_image] =>[orig_patent_app_number] => 09780207 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/780207
Flip-chip technique for chip assembly Feb 8, 2001 Issued
Array ( [id] => 1223636 [patent_doc_number] => 06699730 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-02 [patent_title] => 'Stacked microelectronic assembly and method therefor' [patent_app_type] => B2 [patent_app_number] => 09/776356 [patent_app_country] => US [patent_app_date] => 2001-02-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 37 [patent_no_of_words] => 8552 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/699/06699730.pdf [firstpage_image] =>[orig_patent_app_number] => 09776356 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/776356
Stacked microelectronic assembly and method therefor Feb 1, 2001 Issued
Array ( [id] => 6998483 [patent_doc_number] => 20010052644 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-12-20 [patent_title] => 'Copper pad structure' [patent_app_type] => new [patent_app_number] => 09/772949 [patent_app_country] => US [patent_app_date] => 2001-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2338 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0052/20010052644.pdf [firstpage_image] =>[orig_patent_app_number] => 09772949 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/772949
Copper pad structure Jan 30, 2001 Abandoned
Array ( [id] => 6060383 [patent_doc_number] => 20020030258 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-03-14 [patent_title] => 'Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device' [patent_app_type] => new [patent_app_number] => 09/766656 [patent_app_country] => US [patent_app_date] => 2001-01-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 132 [patent_figures_cnt] => 132 [patent_no_of_words] => 70270 [patent_no_of_claims] => 47 [patent_no_of_ind_claims] => 21 [patent_words_short_claim] => 24 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0030/20020030258.pdf [firstpage_image] =>[orig_patent_app_number] => 09766656 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/766656
Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device Jan 22, 2001 Abandoned
Array ( [id] => 7040059 [patent_doc_number] => 20010005046 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-06-28 [patent_title] => 'Direct contact through hole type wafer structure' [patent_app_type] => new-utility [patent_app_number] => 09/753735 [patent_app_country] => US [patent_app_date] => 2001-01-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 2500 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 39 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0005/20010005046.pdf [firstpage_image] =>[orig_patent_app_number] => 09753735 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/753735
Direct contact through hole type wafer structure Jan 1, 2001 Issued
Array ( [id] => 968817 [patent_doc_number] => 06940093 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-09-06 [patent_title] => 'Special contact points for accessing internal circuitry of an integrated circuit' [patent_app_type] => utility [patent_app_number] => 09/753309 [patent_app_country] => US [patent_app_date] => 2000-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 34 [patent_no_of_words] => 9676 [patent_no_of_claims] => 40 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 17 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/940/06940093.pdf [firstpage_image] =>[orig_patent_app_number] => 09753309 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/753309
Special contact points for accessing internal circuitry of an integrated circuit Dec 28, 2000 Issued
Array ( [id] => 6411342 [patent_doc_number] => 20020125044 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-12 [patent_title] => 'Layered circuit boards and methods of production thereof' [patent_app_type] => new [patent_app_number] => 09/752658 [patent_app_country] => US [patent_app_date] => 2000-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4085 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 32 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0125/20020125044.pdf [firstpage_image] =>[orig_patent_app_number] => 09752658 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/752658
Layered circuit boards and methods of production thereof Dec 27, 2000 Abandoned
Array ( [id] => 6876098 [patent_doc_number] => 20010006251 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-07-05 [patent_title] => 'Semiconductor device and manufacturing method' [patent_app_type] => new-utility [patent_app_number] => 09/741899 [patent_app_country] => US [patent_app_date] => 2000-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 6948 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20010006251.pdf [firstpage_image] =>[orig_patent_app_number] => 09741899 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/741899
Semiconductor device and manufacturing method Dec 21, 2000 Abandoned
Array ( [id] => 7040095 [patent_doc_number] => 20010005060 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-06-28 [patent_title] => 'Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device' [patent_app_type] => new-utility [patent_app_number] => 09/737768 [patent_app_country] => US [patent_app_date] => 2000-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5918 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0005/20010005060.pdf [firstpage_image] =>[orig_patent_app_number] => 09737768 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/737768
Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device Dec 17, 2000 Abandoned
Array ( [id] => 6907626 [patent_doc_number] => 20010010393 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-08-02 [patent_title] => 'Semiconductor device and semiconductor device mounting method thereof' [patent_app_type] => new [patent_app_number] => 09/737658 [patent_app_country] => US [patent_app_date] => 2000-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4110 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0010/20010010393.pdf [firstpage_image] =>[orig_patent_app_number] => 09737658 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/737658
Semiconductor device and semiconductor device mounting method thereof Dec 14, 2000 Abandoned
Array ( [id] => 6130002 [patent_doc_number] => 20020076854 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-06-20 [patent_title] => 'System, method and apparatus for constructing a semiconductor wafer-interposer using B-Stage laminates' [patent_app_type] => new [patent_app_number] => 09/738193 [patent_app_country] => US [patent_app_date] => 2000-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3021 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0076/20020076854.pdf [firstpage_image] =>[orig_patent_app_number] => 09738193 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/738193
System, method and apparatus for constructing a semiconductor wafer-interposer using B-Stage laminates Dec 14, 2000 Abandoned
Array ( [id] => 1477939 [patent_doc_number] => 06451623 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-09-17 [patent_title] => 'Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device' [patent_app_type] => B1 [patent_app_number] => 09/717082 [patent_app_country] => US [patent_app_date] => 2000-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 3185 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/451/06451623.pdf [firstpage_image] =>[orig_patent_app_number] => 09717082 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/717082
Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device Nov 21, 2000 Issued
Array ( [id] => 1063702 [patent_doc_number] => 06849916 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-02-01 [patent_title] => 'Flip chip on glass sensor package' [patent_app_type] => utility [patent_app_number] => 09/713848 [patent_app_country] => US [patent_app_date] => 2000-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 6924 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/849/06849916.pdf [firstpage_image] =>[orig_patent_app_number] => 09713848 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/713848
Flip chip on glass sensor package Nov 14, 2000 Issued
Array ( [id] => 1422713 [patent_doc_number] => 06518662 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-02-11 [patent_title] => 'Method of assembling a semiconductor chip package' [patent_app_type] => B1 [patent_app_number] => 09/713527 [patent_app_country] => US [patent_app_date] => 2000-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 7811 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/518/06518662.pdf [firstpage_image] =>[orig_patent_app_number] => 09713527 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/713527
Method of assembling a semiconductor chip package Nov 14, 2000 Issued
09/673479 Binder, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment Oct 15, 2000 Abandoned
Array ( [id] => 1253263 [patent_doc_number] => 06670214 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-12-30 [patent_title] => 'Insulated bonding wire for microelectronic packaging' [patent_app_type] => B1 [patent_app_number] => 09/687263 [patent_app_country] => US [patent_app_date] => 2000-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 1363 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/670/06670214.pdf [firstpage_image] =>[orig_patent_app_number] => 09687263 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/687263
Insulated bonding wire for microelectronic packaging Oct 11, 2000 Issued
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