David E. Graybill

Array ( [id] => 487564 [patent_doc_number] => 07217999 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2007-05-15 [patent_title] => 'Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board' [patent_app_type] => utility [patent_app_number] => 09/678609 [patent_app_country] => US [patent_app_date] => 2000-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 158 [patent_figures_cnt] => 158 [patent_no_of_words] => 67952 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/217/07217999.pdf [firstpage_image] =>[orig_patent_app_number] => 09678609 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1219248 [patent_doc_number] => 06702865 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-03-09 [patent_title] => 'Alignment processing mechanism and semiconductor processing device using it' [patent_app_type] => B1 [patent_app_number] => 09/647659 [patent_app_country] => US [patent_app_date] => 2000-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 5406 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/702/06702865.pdf [firstpage_image] =>[orig_patent_app_number] => 09647659 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1476389 [patent_doc_number] => 06388317 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-14 [patent_title] => 'Solid-state chip cooling by use of microchannel coolant flow' [patent_app_type] => B1 [patent_app_number] => 09/669468 [patent_app_country] => US [patent_app_date] => 2000-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 18 [patent_no_of_words] => 10213 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/388/06388317.pdf [firstpage_image] =>[orig_patent_app_number] => 09669468 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1281111 [patent_doc_number] => 06646289 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-11-11 [patent_title] => 'Integrated circuit device' [patent_app_type] => B1 [patent_app_number] => 09/601895 [patent_app_country] => US [patent_app_date] => 2000-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 47 [patent_no_of_words] => 5758 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/646/06646289.pdf [firstpage_image] =>[orig_patent_app_number] => 09601895 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7612374 [patent_doc_number] => 06903463 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-06-07 [patent_title] => 'COG-assembly and connecting material to be used therein' [patent_app_type] => utility [patent_app_number] => 09/659448 [patent_app_country] => US [patent_app_date] => 2000-09-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 4862 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/903/06903463.pdf [firstpage_image] =>[orig_patent_app_number] => 09659448 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 508423 [patent_doc_number] => 07198969 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2007-04-03 [patent_title] => 'Semiconductor chip assemblies, methods of making same and components for same' [patent_app_type] => utility [patent_app_number] => 09/656690 [patent_app_country] => US [patent_app_date] => 2000-09-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 38 [patent_no_of_words] => 20853 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/198/07198969.pdf [firstpage_image] =>[orig_patent_app_number] => 09656690 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1211320 [patent_doc_number] => 06709469 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-03-23 [patent_title] => 'Spacer plate solder ball placement fixture and methods therefor' [patent_app_type] => B1 [patent_app_number] => 09/650834 [patent_app_country] => US [patent_app_date] => 2000-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 35 [patent_no_of_words] => 8055 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/709/06709469.pdf [firstpage_image] =>[orig_patent_app_number] => 09650834 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 931091 [patent_doc_number] => 06979595 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-12-27 [patent_title] => 'Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices' [patent_app_type] => utility [patent_app_number] => 09/645640 [patent_app_country] => US [patent_app_date] => 2000-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 0 [patent_no_of_words] => 4811 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/979/06979595.pdf [firstpage_image] =>[orig_patent_app_number] => 09645640 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1361289 [patent_doc_number] => 06569711 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-05-27 [patent_title] => 'Methods and apparatus for balancing differences in thermal expansion in electronic packaging' [patent_app_type] => B1 [patent_app_number] => 09/643522 [patent_app_country] => US [patent_app_date] => 2000-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 3034 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/569/06569711.pdf [firstpage_image] =>[orig_patent_app_number] => 09643522 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4387515 [patent_doc_number] => 06294826 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-09-25 [patent_title] => 'Molded electronic component having pre-plated lead terminals and manufacturing process thereof' [patent_app_type] => 1 [patent_app_number] => 9/639821 [patent_app_country] => US [patent_app_date] => 2000-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 2406 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/294/06294826.pdf [firstpage_image] =>[orig_patent_app_number] => 639821 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1288677 [patent_doc_number] => 06639304 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-10-28 [patent_title] => 'Ball grid array module' [patent_app_type] => B1 [patent_app_number] => 09/638729 [patent_app_country] => US [patent_app_date] => 2000-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 2953 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/639/06639304.pdf [firstpage_image] =>[orig_patent_app_number] => 09638729 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1027896 [patent_doc_number] => 06881611 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-04-19 [patent_title] => 'Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device' [patent_app_type] => utility [patent_app_number] => 09/635124 [patent_app_country] => US [patent_app_date] => 2000-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 131 [patent_figures_cnt] => 180 [patent_no_of_words] => 69252 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 169 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/881/06881611.pdf [firstpage_image] =>[orig_patent_app_number] => 09635124 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1418835 [patent_doc_number] => 06506626 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-01-14 [patent_title] => 'Semiconductor package structure with heat-dissipation stiffener and method of fabricating the same' [patent_app_type] => B1 [patent_app_number] => 09/629068 [patent_app_country] => US [patent_app_date] => 2000-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 1977 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/506/06506626.pdf [firstpage_image] =>[orig_patent_app_number] => 09629068 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1212640 [patent_doc_number] => 06709895 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-03-23 [patent_title] => 'Packaged microelectronic elements with enhanced thermal conduction' [patent_app_type] => B1 [patent_app_number] => 09/628049 [patent_app_country] => US [patent_app_date] => 2000-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 9 [patent_no_of_words] => 8259 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/709/06709895.pdf [firstpage_image] =>[orig_patent_app_number] => 09628049 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4365631 [patent_doc_number] => 06274407 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-08-14 [patent_title] => 'Method and article for attaching high-operating-temperature electronic component' [patent_app_type] => 1 [patent_app_number] => 9/619546 [patent_app_country] => US [patent_app_date] => 2000-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 8 [patent_no_of_words] => 3920 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/274/06274407.pdf [firstpage_image] =>[orig_patent_app_number] => 619546 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1563020 [patent_doc_number] => 06375687 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-04-23 [patent_title] => 'Filling connection hole with wiring material by using centrifugal force' [patent_app_type] => B1 [patent_app_number] => 09/618108 [patent_app_country] => US [patent_app_date] => 2000-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 3899 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/375/06375687.pdf [firstpage_image] =>[orig_patent_app_number] => 09618108 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 541607 [patent_doc_number] => 07169643 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2007-01-30 [patent_title] => 'Semiconductor device, method of fabricating the same, circuit board, and electronic apparatus' [patent_app_type] => utility [patent_app_number] => 09/615503 [patent_app_country] => US [patent_app_date] => 2000-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 22 [patent_no_of_words] => 5398 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/169/07169643.pdf [firstpage_image] =>[orig_patent_app_number] => 09615503 [rel_patent_id] =>[rel_patent_doc_number] =>)