| Application number | Title of the application | Filing Date | Status |
|---|
| 09/613349 | Wafer level application of tack-free die-attach adhesive film | Jul 10, 2000 | Abandoned |
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| 09/530490 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Apr 27, 2000 | Abandoned |
| 09/553123 | Process for the formation of a spatial chip arrangement and spatial chip arrangement | Apr 18, 2000 | Abandoned |
Array
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| 09/543247 | Semicondutor device and process for fabrication thereof | Apr 4, 2000 | Abandoned |
| 09/538684 | Varied-thickness heat sink for integrated circuit (ic) package | Mar 29, 2000 | Abandoned |
| 09/534939 | Connection component with frangible leads and bus | Mar 23, 2000 | Abandoned |
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