
David E. Graybill
Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )
| Most Active Art Unit | 2894 |
| Art Unit(s) | 2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4318195
[patent_doc_number] => 06248599
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-06-19
[patent_title] => 'Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices'
[patent_app_type] => 1
[patent_app_number] => 9/452935
[patent_app_country] => US
[patent_app_date] => 1999-12-02
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[pdf_file] => patents/06/248/06248599.pdf
[firstpage_image] =>[orig_patent_app_number] => 452935
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/452935 | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Dec 1, 1999 | Issued |
Array
(
[id] => 4145174
[patent_doc_number] => 06081978
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[patent_kind] => NA
[patent_issue_date] => 2000-07-04
[patent_title] => 'Resin-encapsulated semiconductor device producing apparatus and method'
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[patent_app_date] => 1999-12-02
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Array
(
[id] => 4388353
[patent_doc_number] => 06278179
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[patent_issue_date] => 2001-08-21
[patent_title] => 'Power electronic device'
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[patent_app_number] => 9/444998
[patent_app_country] => US
[patent_app_date] => 1999-11-23
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Array
(
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[patent_doc_number] => 06927491
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[patent_kind] => B1
[patent_issue_date] => 2005-08-09
[patent_title] => 'Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board'
[patent_app_type] => utility
[patent_app_number] => 09/435448
[patent_app_country] => US
[patent_app_date] => 1999-11-22
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[firstpage_image] =>[orig_patent_app_number] => 09435448
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/435448 | Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board | Nov 21, 1999 | Issued |
Array
(
[id] => 4163045
[patent_doc_number] => 06157086
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-12-05
[patent_title] => 'Chip package with transfer mold underfill'
[patent_app_type] => 1
[patent_app_number] => 9/442390
[patent_app_country] => US
[patent_app_date] => 1999-11-18
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Array
(
[id] => 4335005
[patent_doc_number] => 06284006
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-09-04
[patent_title] => 'Processing apparatus for microelectronic devices in which polymeric bellows are used to help accomplish substrate transport inside of the apparatus'
[patent_app_type] => 1
[patent_app_number] => 9/440388
[patent_app_country] => US
[patent_app_date] => 1999-11-15
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/284/06284006.pdf
[firstpage_image] =>[orig_patent_app_number] => 440388
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/440388 | Processing apparatus for microelectronic devices in which polymeric bellows are used to help accomplish substrate transport inside of the apparatus | Nov 14, 1999 | Issued |
| 09/436598 | POWER SEMICONDUCTOR MODULE WITH CERAMIC SUBSTRATE | Nov 8, 1999 | Abandoned |
Array
(
[id] => 1352287
[patent_doc_number] => 06580159
[patent_country] => US
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[patent_issue_date] => 2003-06-17
[patent_title] => 'Integrated circuit device packages and substrates for making the packages'
[patent_app_type] => B1
[patent_app_number] => 09/434589
[patent_app_country] => US
[patent_app_date] => 1999-11-05
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[firstpage_image] =>[orig_patent_app_number] => 09434589
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Array
(
[id] => 4224511
[patent_doc_number] => 06117193
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[patent_kind] => NA
[patent_issue_date] => 2000-09-12
[patent_title] => 'Optical sensor array mounting and alignment'
[patent_app_type] => 1
[patent_app_number] => 9/422008
[patent_app_country] => US
[patent_app_date] => 1999-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/06/117/06117193.pdf
[firstpage_image] =>[orig_patent_app_number] => 422008
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/422008 | Optical sensor array mounting and alignment | Oct 19, 1999 | Issued |
Array
(
[id] => 4210163
[patent_doc_number] => 06078092
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[patent_kind] => NA
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[patent_title] => 'Resettable fuse integrated circuit package'
[patent_app_type] => 1
[patent_app_number] => 9/419308
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/419308 | Resettable fuse integrated circuit package | Oct 17, 1999 | Issued |
Array
(
[id] => 4130425
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[patent_title] => 'Method of manufacturing a test circuit on a silicon wafer'
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[patent_app_number] => 9/420259
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Array
(
[id] => 1583123
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[patent_title] => 'Touchless stabilizer for processing spherical devices'
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Array
(
[id] => 6044419
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[patent_title] => 'LEAD FRAME AND BOTTOM LEAD SEMICONDUCTOR PACKAGE USING THE LEAD FRAME'
[patent_app_type] => new
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/415268 | Lead frame and bottom lead semiconductor package using the lead frame | Oct 11, 1999 | Issued |
Array
(
[id] => 1053126
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[patent_title] => 'Integrated circuit package alignment feature'
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/417159 | Leads under chip IC package | Oct 11, 1999 | Issued |
| 09/415508 | METHOD AND SYSTEM FOR CONSTRUCTING SEMICONDUCTOR DEVICES | Oct 7, 1999 | Abandoned |
Array
(
[id] => 1366498
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[patent_title] => 'Method for making a contactless card with antenna connected with soldered wires'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/381803 | Method for making a contactless card with antenna connected with soldered wires | Sep 23, 1999 | Issued |
Array
(
[id] => 4236532
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Array
(
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/393869 | Stack package and method of fabricating the same | Sep 9, 1999 | Issued |