David E. Graybill

Array ( [id] => 1155841 [patent_doc_number] => 06764938 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-07-20 [patent_title] => 'Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof' [patent_app_type] => B2 [patent_app_number] => 09/392722 [patent_app_country] => US [patent_app_date] => 1999-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 25 [patent_no_of_words] => 3617 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 188 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/764/06764938.pdf [firstpage_image] =>[orig_patent_app_number] => 09392722 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4414418 [patent_doc_number] => 06265775 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-07-24 [patent_title] => 'Flip chip technique for chip assembly' [patent_app_type] => 1 [patent_app_number] => 9/392153 [patent_app_country] => US [patent_app_date] => 1999-09-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2945 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 289 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/265/06265775.pdf [firstpage_image] =>[orig_patent_app_number] => 392153 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7636043 [patent_doc_number] => 06380617 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-04-30 [patent_title] => 'Electrode terminal connection structure of semiconductor module' [patent_app_type] => B1 [patent_app_number] => 09/389329 [patent_app_country] => US [patent_app_date] => 1999-09-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3960 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 39 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/380/06380617.pdf [firstpage_image] =>[orig_patent_app_number] => 09389329 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4424789 [patent_doc_number] => 06225687 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-01 [patent_title] => 'Chip package with degassing holes' [patent_app_type] => 1 [patent_app_number] => 9/388768 [patent_app_country] => US [patent_app_date] => 1999-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 3764 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/225/06225687.pdf [firstpage_image] =>[orig_patent_app_number] => 388768 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4161517 [patent_doc_number] => 06107682 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-22 [patent_title] => 'Compliant wirebond packages having wire loop' [patent_app_type] => 1 [patent_app_number] => 9/387880 [patent_app_country] => US [patent_app_date] => 1999-09-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 28 [patent_no_of_words] => 6532 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/107/06107682.pdf [firstpage_image] =>[orig_patent_app_number] => 387880 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1498596 [patent_doc_number] => 06485531 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-11-26 [patent_title] => 'Process chamber' [patent_app_type] => B1 [patent_app_number] => 09/384818 [patent_app_country] => US [patent_app_date] => 1999-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 5809 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/485/06485531.pdf [firstpage_image] =>[orig_patent_app_number] => 09384818 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4424826 [patent_doc_number] => 06225693 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-01 [patent_title] => 'Semiconductor package for radio frequency' [patent_app_type] => 1 [patent_app_number] => 9/377899 [patent_app_country] => US [patent_app_date] => 1999-08-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 2168 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/225/06225693.pdf [firstpage_image] =>[orig_patent_app_number] => 377899 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1175755 [patent_doc_number] => 06750488 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-06-15 [patent_title] => 'Focal plane plate for a high-resolution camera with light-sensitive semiconductor sensors' [patent_app_type] => B1 [patent_app_number] => 09/376442 [patent_app_country] => US [patent_app_date] => 1999-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 3519 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/750/06750488.pdf [firstpage_image] =>[orig_patent_app_number] => 09376442 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6091335 [patent_doc_number] => 20020050403 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-05-02 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => new [patent_app_number] => 09/370990 [patent_app_country] => US [patent_app_date] => 1999-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1108 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 28 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0050/20020050403.pdf [firstpage_image] =>[orig_patent_app_number] => 09370990 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4136325 [patent_doc_number] => 06015722 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-01-18 [patent_title] => 'Method for assembling an integrated circuit chip package having an underfill material between a chip and a substrate' [patent_app_type] => 1 [patent_app_number] => 9/369800 [patent_app_country] => US [patent_app_date] => 1999-08-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 30 [patent_no_of_words] => 25877 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 330 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/015/06015722.pdf [firstpage_image] =>[orig_patent_app_number] => 369800 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4106360 [patent_doc_number] => 06022762 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-02-08 [patent_title] => 'Process for forming a morphological edge structure to seal integrated electronic devices' [patent_app_type] => 1 [patent_app_number] => 9/368559 [patent_app_country] => US [patent_app_date] => 1999-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 8240 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/022/06022762.pdf [firstpage_image] =>[orig_patent_app_number] => 368559 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4376775 [patent_doc_number] => 06288445 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-09-11 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 9/366539 [patent_app_country] => US [patent_app_date] => 1999-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 19 [patent_no_of_words] => 4979 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/288/06288445.pdf [firstpage_image] =>[orig_patent_app_number] => 366539 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4287141 [patent_doc_number] => 06240610 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-06-05 [patent_title] => 'Wafer and transport system' [patent_app_type] => 1 [patent_app_number] => 9/363875 [patent_app_country] => US [patent_app_date] => 1999-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 13 [patent_no_of_words] => 13227 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/240/06240610.pdf [firstpage_image] =>[orig_patent_app_number] => 363875 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4350003 [patent_doc_number] => 06291274 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-09-18 [patent_title] => 'Resin molded semiconductor device and method for manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 9/341918 [patent_app_country] => US [patent_app_date] => 1999-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 33 [patent_no_of_words] => 10387 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 167 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/291/06291274.pdf [firstpage_image] =>[orig_patent_app_number] => 341918 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6973099 [patent_doc_number] => 20010003377 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-06-14 [patent_title] => 'HEAT SINK FOR A SEMICONDUCTOR DEVICE' [patent_app_type] => new-utility [patent_app_number] => 09/357058 [patent_app_country] => US [patent_app_date] => 1999-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3334 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 27 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0003/20010003377.pdf [firstpage_image] =>[orig_patent_app_number] => 09357058 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6671938 [patent_doc_number] => 20030057541 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-27 [patent_title] => 'UN-PACKAGED OR SEMI-PACKAGED ELECTRICALLY TESTED ELECTRONIC DEVICE FREE FROM INFANTILE MORTALITY AND PROCESS FOR MANUFACTURE THEREOF' [patent_app_type] => new [patent_app_number] => 09/350989 [patent_app_country] => US [patent_app_date] => 1999-07-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3725 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0057/20030057541.pdf [firstpage_image] =>[orig_patent_app_number] => 09350989 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4162546 [patent_doc_number] => 06157050 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-12-05 [patent_title] => 'Optical module and lead frame for optical module' [patent_app_type] => 1 [patent_app_number] => 9/308779 [patent_app_country] => US [patent_app_date] => 1999-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 26 [patent_no_of_words] => 13050 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 266 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/157/06157050.pdf [firstpage_image] =>[orig_patent_app_number] => 308779 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4365398 [patent_doc_number] => 06274389 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-08-14 [patent_title] => 'Mounting structure and mounting process from semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 9/341288 [patent_app_country] => US [patent_app_date] => 1999-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 5621 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/274/06274389.pdf [firstpage_image] =>[orig_patent_app_number] => 341288 [rel_patent_id] =>[rel_patent_doc_number] =>)