David E. Graybill

Array ( [id] => 4337159 [patent_doc_number] => 06313533 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-11-06 [patent_title] => 'Function element, substrate for mounting function element thereon, and method of connecting them to each other' [patent_app_type] => 1 [patent_app_number] => 9/346949 [patent_app_country] => US [patent_app_date] => 1999-07-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 24 [patent_no_of_words] => 17826 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/313/06313533.pdf [firstpage_image] =>[orig_patent_app_number] => 346949 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4401506 [patent_doc_number] => 06297548 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-10-02 [patent_title] => 'Stackable ceramic FBGA for high thermal applications' [patent_app_type] => 1 [patent_app_number] => 9/344279 [patent_app_country] => US [patent_app_date] => 1999-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 1516 [patent_no_of_claims] => 46 [patent_no_of_ind_claims] => 11 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/297/06297548.pdf [firstpage_image] =>[orig_patent_app_number] => 344279 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 469786 [patent_doc_number] => 07233056 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2007-06-19 [patent_title] => 'Chip scale package with heat spreader' [patent_app_type] => utility [patent_app_number] => 09/342789 [patent_app_country] => US [patent_app_date] => 1999-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 3253 [patent_no_of_claims] => 37 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/233/07233056.pdf [firstpage_image] =>[orig_patent_app_number] => 09342789 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4390200 [patent_doc_number] => 06262483 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-07-17 [patent_title] => 'Semiconductor chip module and method for manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 9/329598 [patent_app_country] => US [patent_app_date] => 1999-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 1790 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/262/06262483.pdf [firstpage_image] =>[orig_patent_app_number] => 329598 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4388419 [patent_doc_number] => 06278183 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-08-21 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 9/329599 [patent_app_country] => US [patent_app_date] => 1999-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 1820 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/278/06278183.pdf [firstpage_image] =>[orig_patent_app_number] => 329599 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1421048 [patent_doc_number] => 06521979 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-02-18 [patent_title] => 'Member for semiconductor package and semiconductor package using the same, and fabrication method thereof' [patent_app_type] => B1 [patent_app_number] => 09/324780 [patent_app_country] => US [patent_app_date] => 1999-06-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 14 [patent_no_of_words] => 2443 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/521/06521979.pdf [firstpage_image] =>[orig_patent_app_number] => 09324780 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4195176 [patent_doc_number] => 06153926 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-11-28 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 9/324799 [patent_app_country] => US [patent_app_date] => 1999-06-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 9 [patent_no_of_words] => 5989 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 222 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/153/06153926.pdf [firstpage_image] =>[orig_patent_app_number] => 324799 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4343519 [patent_doc_number] => 06284571 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-09-04 [patent_title] => 'Lead frame assemblies with voltage reference plane and IC packages including same' [patent_app_type] => 1 [patent_app_number] => 9/318019 [patent_app_country] => US [patent_app_date] => 1999-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 4554 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/284/06284571.pdf [firstpage_image] =>[orig_patent_app_number] => 318019 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4348864 [patent_doc_number] => 06190425 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-02-20 [patent_title] => 'Memory bar and related circuits and methods' [patent_app_type] => 1 [patent_app_number] => 9/309339 [patent_app_country] => US [patent_app_date] => 1999-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 2261 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/190/06190425.pdf [firstpage_image] =>[orig_patent_app_number] => 309339 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4137697 [patent_doc_number] => 06063140 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-05-16 [patent_title] => 'Process for manufacturing a metallized film capacitor' [patent_app_type] => 1 [patent_app_number] => 9/307399 [patent_app_country] => US [patent_app_date] => 1999-05-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 2035 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/063/06063140.pdf [firstpage_image] =>[orig_patent_app_number] => 307399 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7634868 [patent_doc_number] => 06656750 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-12-02 [patent_title] => 'Method for testing chips on flat solder bumps' [patent_app_type] => B1 [patent_app_number] => 09/301889 [patent_app_country] => US [patent_app_date] => 1999-04-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 9 [patent_no_of_words] => 3059 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 20 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/656/06656750.pdf [firstpage_image] =>[orig_patent_app_number] => 09301889 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4380703 [patent_doc_number] => 06277673 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-08-21 [patent_title] => 'Leads under chip in conventional IC package' [patent_app_type] => 1 [patent_app_number] => 9/302083 [patent_app_country] => US [patent_app_date] => 1999-04-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4420 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 238 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/277/06277673.pdf [firstpage_image] =>[orig_patent_app_number] => 302083 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4406837 [patent_doc_number] => 06238951 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-29 [patent_title] => 'Process for producing a sealing and mechanical strength ring between a substrate and a chip hybridized by bumps on the substrate' [patent_app_type] => 1 [patent_app_number] => 9/298696 [patent_app_country] => US [patent_app_date] => 1999-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 8 [patent_no_of_words] => 4023 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 211 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/238/06238951.pdf [firstpage_image] =>[orig_patent_app_number] => 298696 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1113802 [patent_doc_number] => 06803657 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-10-12 [patent_title] => 'Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components' [patent_app_type] => B2 [patent_app_number] => 09/295709 [patent_app_country] => US [patent_app_date] => 1999-04-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 43 [patent_no_of_words] => 5484 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/803/06803657.pdf [firstpage_image] =>[orig_patent_app_number] => 09295709 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4274959 [patent_doc_number] => 06281048 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-08-28 [patent_title] => 'Method of making an electronic component, and an electronic component' [patent_app_type] => 1 [patent_app_number] => 9/295118 [patent_app_country] => US [patent_app_date] => 1999-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 1794 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/281/06281048.pdf [firstpage_image] =>[orig_patent_app_number] => 295118 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1494706 [patent_doc_number] => 06403387 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-11 [patent_title] => 'Method and apparatus for transfer molding encapsulation of a semiconductor die with attached heat sink' [patent_app_type] => B1 [patent_app_number] => 09/287665 [patent_app_country] => US [patent_app_date] => 1999-04-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 3048 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/403/06403387.pdf [firstpage_image] =>[orig_patent_app_number] => 09287665 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3993192 [patent_doc_number] => 05985684 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-16 [patent_title] => 'Process for manufacturing a laser diode having a heat sink' [patent_app_type] => 1 [patent_app_number] => 9/286145 [patent_app_country] => US [patent_app_date] => 1999-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 5117 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/985/05985684.pdf [firstpage_image] =>[orig_patent_app_number] => 286145 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4407958 [patent_doc_number] => 06309914 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-10-30 [patent_title] => 'Method for making a semiconductor package' [patent_app_type] => 1 [patent_app_number] => 9/285629 [patent_app_country] => US [patent_app_date] => 1999-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 18 [patent_no_of_words] => 3701 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 252 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/309/06309914.pdf [firstpage_image] =>[orig_patent_app_number] => 285629 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4293663 [patent_doc_number] => 06184065 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-02-06 [patent_title] => 'Photolithographically patterned spring contact' [patent_app_type] => 1 [patent_app_number] => 9/276098 [patent_app_country] => US [patent_app_date] => 1999-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 30 [patent_no_of_words] => 6632 [patent_no_of_claims] => 79 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 20 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/184/06184065.pdf [firstpage_image] =>[orig_patent_app_number] => 276098 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4243110 [patent_doc_number] => 06144104 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-11-07 [patent_title] => 'High-operating-temperature electronic component' [patent_app_type] => 1 [patent_app_number] => 9/275129 [patent_app_country] => US [patent_app_date] => 1999-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 8 [patent_no_of_words] => 3923 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/144/06144104.pdf [firstpage_image] =>[orig_patent_app_number] => 275129 [rel_patent_id] =>[rel_patent_doc_number] =>)