Search

David E. Graybill

Examiner (ID: 8531)

Most Active Art Unit
2894
Art Unit(s)
1763, 3727, 2894, 1107, 2822, 2812, 2814, 2827
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4310481 [patent_doc_number] => 06252300 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-06-26 [patent_title] => 'Direct contact through hole type wafer structure' [patent_app_type] => 1 [patent_app_number] => 9/260218 [patent_app_country] => US [patent_app_date] => 1999-03-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 12 [patent_no_of_words] => 2383 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 219 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/252/06252300.pdf [firstpage_image] =>[orig_patent_app_number] => 260218 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/260218
Direct contact through hole type wafer structure Feb 28, 1999 Issued
Array ( [id] => 1168035 [patent_doc_number] => 06759738 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-07-06 [patent_title] => 'Systems interconnected by bumps of joining material' [patent_app_type] => B1 [patent_app_number] => 09/250524 [patent_app_country] => US [patent_app_date] => 1999-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 51 [patent_figures_cnt] => 94 [patent_no_of_words] => 27111 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/759/06759738.pdf [firstpage_image] =>[orig_patent_app_number] => 09250524 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/250524
Systems interconnected by bumps of joining material Feb 15, 1999 Issued
09/242069 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME Feb 7, 1999 Abandoned
09/245848 METHOD OF FORMING SOLDER FILM Feb 7, 1999 Abandoned
Array ( [id] => 1463722 [patent_doc_number] => 06351028 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-02-26 [patent_title] => 'Multiple die stack apparatus employing T-shaped interposer elements' [patent_app_type] => B1 [patent_app_number] => 09/247009 [patent_app_country] => US [patent_app_date] => 1999-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 3721 [patent_no_of_claims] => 82 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/351/06351028.pdf [firstpage_image] =>[orig_patent_app_number] => 09247009 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/247009
Multiple die stack apparatus employing T-shaped interposer elements Feb 7, 1999 Issued
Array ( [id] => 6060409 [patent_doc_number] => 20020030272 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-03-14 [patent_title] => 'SEMICONDUCTOR APPARATUS SUBSTRATE, SEMICONDUCTOR APPARATUS, AND METHOD OF MANUFACTURING THEREOF AND ELECTRONIC APPARATUS' [patent_app_type] => new [patent_app_number] => 09/245288 [patent_app_country] => US [patent_app_date] => 1999-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5366 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0030/20020030272.pdf [firstpage_image] =>[orig_patent_app_number] => 09245288 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/245288
SEMICONDUCTOR APPARATUS SUBSTRATE, SEMICONDUCTOR APPARATUS, AND METHOD OF MANUFACTURING THEREOF AND ELECTRONIC APPARATUS Feb 4, 1999 Abandoned
Array ( [id] => 4424792 [patent_doc_number] => 06225688 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-01 [patent_title] => 'Stacked microelectronic assembly and method therefor' [patent_app_type] => 1 [patent_app_number] => 9/244581 [patent_app_country] => US [patent_app_date] => 1999-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 37 [patent_no_of_words] => 8438 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/225/06225688.pdf [firstpage_image] =>[orig_patent_app_number] => 244581 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/244581
Stacked microelectronic assembly and method therefor Feb 3, 1999 Issued
Array ( [id] => 4159762 [patent_doc_number] => 06139591 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-31 [patent_title] => 'Wafer separating and cleaning apparatus and process' [patent_app_type] => 1 [patent_app_number] => 9/244049 [patent_app_country] => US [patent_app_date] => 1999-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 45 [patent_figures_cnt] => 45 [patent_no_of_words] => 32720 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/139/06139591.pdf [firstpage_image] =>[orig_patent_app_number] => 244049 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/244049
Wafer separating and cleaning apparatus and process Feb 3, 1999 Issued
Array ( [id] => 4400641 [patent_doc_number] => 06264707 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-07-24 [patent_title] => 'Electrode for an electric double layer capacitor and process for producing it' [patent_app_type] => 1 [patent_app_number] => 9/238886 [patent_app_country] => US [patent_app_date] => 1999-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4754 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/264/06264707.pdf [firstpage_image] =>[orig_patent_app_number] => 238886 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/238886
Electrode for an electric double layer capacitor and process for producing it Jan 27, 1999 Issued
Array ( [id] => 4190995 [patent_doc_number] => 06093962 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-25 [patent_title] => 'High frequency shielding case of semiconductor laser' [patent_app_type] => 1 [patent_app_number] => 9/238279 [patent_app_country] => US [patent_app_date] => 1999-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 9485 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/093/06093962.pdf [firstpage_image] =>[orig_patent_app_number] => 238279 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/238279
High frequency shielding case of semiconductor laser Jan 26, 1999 Issued
Array ( [id] => 4094033 [patent_doc_number] => 06096568 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-01 [patent_title] => 'Process for preparing a semiconductor device package for analysis of a die' [patent_app_type] => 1 [patent_app_number] => 9/226929 [patent_app_country] => US [patent_app_date] => 1999-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2141 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/096/06096568.pdf [firstpage_image] =>[orig_patent_app_number] => 226929 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/226929
Process for preparing a semiconductor device package for analysis of a die Jan 7, 1999 Issued
Array ( [id] => 4404351 [patent_doc_number] => 06271059 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-08-07 [patent_title] => 'Chip interconnection structure using stub terminals' [patent_app_type] => 1 [patent_app_number] => 9/225148 [patent_app_country] => US [patent_app_date] => 1999-01-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 20 [patent_no_of_words] => 2258 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/271/06271059.pdf [firstpage_image] =>[orig_patent_app_number] => 225148 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/225148
Chip interconnection structure using stub terminals Jan 3, 1999 Issued
Array ( [id] => 4244446 [patent_doc_number] => 06091141 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-18 [patent_title] => 'Bump chip scale semiconductor package' [patent_app_type] => 1 [patent_app_number] => 9/222226 [patent_app_country] => US [patent_app_date] => 1998-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 22 [patent_no_of_words] => 4516 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/091/06091141.pdf [firstpage_image] =>[orig_patent_app_number] => 222226 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/222226
Bump chip scale semiconductor package Dec 28, 1998 Issued
Array ( [id] => 4236544 [patent_doc_number] => 06136047 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-24 [patent_title] => 'Solder bump transfer plate' [patent_app_type] => 1 [patent_app_number] => 9/222316 [patent_app_country] => US [patent_app_date] => 1998-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 27 [patent_no_of_words] => 5405 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/136/06136047.pdf [firstpage_image] =>[orig_patent_app_number] => 222316 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/222316
Solder bump transfer plate Dec 28, 1998 Issued
Array ( [id] => 4331928 [patent_doc_number] => 06329711 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-11 [patent_title] => 'Semiconductor device and mounting structure' [patent_app_type] => 1 [patent_app_number] => 9/200846 [patent_app_country] => US [patent_app_date] => 1998-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 116 [patent_figures_cnt] => 181 [patent_no_of_words] => 30305 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/329/06329711.pdf [firstpage_image] =>[orig_patent_app_number] => 200846 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/200846
Semiconductor device and mounting structure Nov 29, 1998 Issued
Array ( [id] => 6474295 [patent_doc_number] => 20020022340 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-02-21 [patent_title] => 'METHOD OF FORMING A SHALLOW TRENCH ISOLATION' [patent_app_type] => new [patent_app_number] => 09/200282 [patent_app_country] => US [patent_app_date] => 1998-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1794 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0022/20020022340.pdf [firstpage_image] =>[orig_patent_app_number] => 09200282 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/200282
METHOD OF FORMING A SHALLOW TRENCH ISOLATION Nov 23, 1998 Abandoned
Array ( [id] => 4182585 [patent_doc_number] => 06159770 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-12-12 [patent_title] => 'Method and apparatus for fabricating semiconductor device' [patent_app_type] => 1 [patent_app_number] => 9/192445 [patent_app_country] => US [patent_app_date] => 1998-11-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 154 [patent_figures_cnt] => 271 [patent_no_of_words] => 47295 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/159/06159770.pdf [firstpage_image] =>[orig_patent_app_number] => 192445 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/192445
Method and apparatus for fabricating semiconductor device Nov 15, 1998 Issued
Array ( [id] => 4153681 [patent_doc_number] => 06103541 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-15 [patent_title] => 'Encapsulation method of an organic electroluminescent device' [patent_app_type] => 1 [patent_app_number] => 9/191329 [patent_app_country] => US [patent_app_date] => 1998-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2012 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/103/06103541.pdf [firstpage_image] =>[orig_patent_app_number] => 191329 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/191329
Encapsulation method of an organic electroluminescent device Nov 12, 1998 Issued
Array ( [id] => 4093511 [patent_doc_number] => 06099599 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-08 [patent_title] => 'Semiconductor device fabrication system' [patent_app_type] => 1 [patent_app_number] => 9/190339 [patent_app_country] => US [patent_app_date] => 1998-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 5282 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/099/06099599.pdf [firstpage_image] =>[orig_patent_app_number] => 190339 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/190339
Semiconductor device fabrication system Nov 11, 1998 Issued
09/190378 METHOD FOR THINNING SEMICONDUCTOR WAFERS WITH CIRCUITS AND WAFERS MADE BY THE SAME Nov 9, 1998 Abandoned
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