
David E. Graybill
Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )
| Most Active Art Unit | 2894 |
| Art Unit(s) | 2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7643926
[patent_doc_number] => 06429112
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-06
[patent_title] => 'Multi-layer substrates and fabrication processes'
[patent_app_type] => B1
[patent_app_number] => 09/271688
[patent_app_country] => US
[patent_app_date] => 1999-03-18
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/429/06429112.pdf
[firstpage_image] =>[orig_patent_app_number] => 09271688
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/271688 | Multi-layer substrates and fabrication processes | Mar 17, 1999 | Issued |
Array
(
[id] => 4087032
[patent_doc_number] => 06054756
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-25
[patent_title] => 'Connection components with frangible leads and bus'
[patent_app_type] => 1
[patent_app_number] => 9/268289
[patent_app_country] => US
[patent_app_date] => 1999-03-15
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 268289
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/268289 | Connection components with frangible leads and bus | Mar 14, 1999 | Issued |
Array
(
[id] => 4400602
[patent_doc_number] => 06264704
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-24
[patent_title] => 'Method and apparatus for mounting component'
[patent_app_type] => 1
[patent_app_number] => 9/266928
[patent_app_country] => US
[patent_app_date] => 1999-03-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[pdf_file] => patents/06/264/06264704.pdf
[firstpage_image] =>[orig_patent_app_number] => 266928
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/266928 | Method and apparatus for mounting component | Mar 11, 1999 | Issued |
Array
(
[id] => 6573161
[patent_doc_number] => 20020014688
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-02-07
[patent_title] => 'CONTROLLED COLLAPSE CHIP CONNECTION (C4) INTEGRATED CIRCUIT PACKAGE WHICH HAS TWO DISSIMILAR UNDERFILL MATERIALS'
[patent_app_type] => new
[patent_app_number] => 09/261849
[patent_app_country] => US
[patent_app_date] => 1999-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0014/20020014688.pdf
[firstpage_image] =>[orig_patent_app_number] => 09261849
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/261849 | CONTROLLED COLLAPSE CHIP CONNECTION (C4) INTEGRATED CIRCUIT PACKAGE WHICH HAS TWO DISSIMILAR UNDERFILL MATERIALS | Mar 2, 1999 | Abandoned |
| 09/261328 | ULTRA-FINE CONTACT ALIGNMENT | Mar 2, 1999 | Abandoned |
Array
(
[id] => 4310481
[patent_doc_number] => 06252300
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-06-26
[patent_title] => 'Direct contact through hole type wafer structure'
[patent_app_type] => 1
[patent_app_number] => 9/260218
[patent_app_country] => US
[patent_app_date] => 1999-03-01
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[pdf_file] => patents/06/252/06252300.pdf
[firstpage_image] =>[orig_patent_app_number] => 260218
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/260218 | Direct contact through hole type wafer structure | Feb 28, 1999 | Issued |
Array
(
[id] => 1168035
[patent_doc_number] => 06759738
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-07-06
[patent_title] => 'Systems interconnected by bumps of joining material'
[patent_app_type] => B1
[patent_app_number] => 09/250524
[patent_app_country] => US
[patent_app_date] => 1999-02-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 51
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[pdf_file] => patents/06/759/06759738.pdf
[firstpage_image] =>[orig_patent_app_number] => 09250524
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/250524 | Systems interconnected by bumps of joining material | Feb 15, 1999 | Issued |
| 09/242069 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Feb 7, 1999 | Abandoned |
Array
(
[id] => 1463722
[patent_doc_number] => 06351028
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-02-26
[patent_title] => 'Multiple die stack apparatus employing T-shaped interposer elements'
[patent_app_type] => B1
[patent_app_number] => 09/247009
[patent_app_country] => US
[patent_app_date] => 1999-02-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 10
[patent_no_of_words] => 3721
[patent_no_of_claims] => 82
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/351/06351028.pdf
[firstpage_image] =>[orig_patent_app_number] => 09247009
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/247009 | Multiple die stack apparatus employing T-shaped interposer elements | Feb 7, 1999 | Issued |
| 09/245848 | METHOD OF FORMING SOLDER FILM | Feb 7, 1999 | Abandoned |
Array
(
[id] => 6060409
[patent_doc_number] => 20020030272
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-03-14
[patent_title] => 'SEMICONDUCTOR APPARATUS SUBSTRATE, SEMICONDUCTOR APPARATUS, AND METHOD OF MANUFACTURING THEREOF AND ELECTRONIC APPARATUS'
[patent_app_type] => new
[patent_app_number] => 09/245288
[patent_app_country] => US
[patent_app_date] => 1999-02-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[pdf_file] => publications/A1/0030/20020030272.pdf
[firstpage_image] =>[orig_patent_app_number] => 09245288
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Array
(
[id] => 4159762
[patent_doc_number] => 06139591
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-31
[patent_title] => 'Wafer separating and cleaning apparatus and process'
[patent_app_type] => 1
[patent_app_number] => 9/244049
[patent_app_country] => US
[patent_app_date] => 1999-02-04
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[pdf_file] => patents/06/139/06139591.pdf
[firstpage_image] =>[orig_patent_app_number] => 244049
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/244049 | Wafer separating and cleaning apparatus and process | Feb 3, 1999 | Issued |
Array
(
[id] => 4424792
[patent_doc_number] => 06225688
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-05-01
[patent_title] => 'Stacked microelectronic assembly and method therefor'
[patent_app_type] => 1
[patent_app_number] => 9/244581
[patent_app_country] => US
[patent_app_date] => 1999-02-04
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[firstpage_image] =>[orig_patent_app_number] => 244581
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/244581 | Stacked microelectronic assembly and method therefor | Feb 3, 1999 | Issued |
Array
(
[id] => 4400641
[patent_doc_number] => 06264707
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-24
[patent_title] => 'Electrode for an electric double layer capacitor and process for producing it'
[patent_app_type] => 1
[patent_app_number] => 9/238886
[patent_app_country] => US
[patent_app_date] => 1999-01-28
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 238886
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/238886 | Electrode for an electric double layer capacitor and process for producing it | Jan 27, 1999 | Issued |
Array
(
[id] => 4190995
[patent_doc_number] => 06093962
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-07-25
[patent_title] => 'High frequency shielding case of semiconductor laser'
[patent_app_type] => 1
[patent_app_number] => 9/238279
[patent_app_country] => US
[patent_app_date] => 1999-01-27
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[pdf_file] => patents/06/093/06093962.pdf
[firstpage_image] =>[orig_patent_app_number] => 238279
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/238279 | High frequency shielding case of semiconductor laser | Jan 26, 1999 | Issued |
Array
(
[id] => 4094033
[patent_doc_number] => 06096568
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-01
[patent_title] => 'Process for preparing a semiconductor device package for analysis of a die'
[patent_app_type] => 1
[patent_app_number] => 9/226929
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[patent_app_date] => 1999-01-08
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Array
(
[id] => 4404351
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[patent_title] => 'Chip interconnection structure using stub terminals'
[patent_app_type] => 1
[patent_app_number] => 9/225148
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[firstpage_image] =>[orig_patent_app_number] => 225148
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/225148 | Chip interconnection structure using stub terminals | Jan 3, 1999 | Issued |
Array
(
[id] => 4244446
[patent_doc_number] => 06091141
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[patent_kind] => NA
[patent_issue_date] => 2000-07-18
[patent_title] => 'Bump chip scale semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 9/222226
[patent_app_country] => US
[patent_app_date] => 1998-12-29
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/091/06091141.pdf
[firstpage_image] =>[orig_patent_app_number] => 222226
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/222226 | Bump chip scale semiconductor package | Dec 28, 1998 | Issued |
Array
(
[id] => 4236544
[patent_doc_number] => 06136047
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-24
[patent_title] => 'Solder bump transfer plate'
[patent_app_type] => 1
[patent_app_number] => 9/222316
[patent_app_country] => US
[patent_app_date] => 1998-12-29
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[pdf_file] => patents/06/136/06136047.pdf
[firstpage_image] =>[orig_patent_app_number] => 222316
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/222316 | Solder bump transfer plate | Dec 28, 1998 | Issued |
Array
(
[id] => 4331928
[patent_doc_number] => 06329711
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-11
[patent_title] => 'Semiconductor device and mounting structure'
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[patent_app_number] => 9/200846
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[pdf_file] => patents/06/329/06329711.pdf
[firstpage_image] =>[orig_patent_app_number] => 200846
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/200846 | Semiconductor device and mounting structure | Nov 29, 1998 | Issued |