
David E. Graybill
Examiner (ID: 8531)
| Most Active Art Unit | 2894 |
| Art Unit(s) | 1763, 3727, 2894, 1107, 2822, 2812, 2814, 2827 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5964620
[patent_doc_number] => 20020089049
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-07-11
[patent_title] => 'CONTACTLESS ELECTRONIC MODULE FOR A CARD OR LABEL'
[patent_app_type] => new
[patent_app_number] => 09/101049
[patent_app_country] => US
[patent_app_date] => 1998-10-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 6127
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 14
[patent_words_short_claim] => 23
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0089/20020089049.pdf
[firstpage_image] =>[orig_patent_app_number] => 09101049
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/101049 | CONTACTLESS ELECTRONIC MODULE FOR A CARD OR LABEL | Oct 28, 1998 | Abandoned |
Array
(
[id] => 4147621
[patent_doc_number] => 06156079
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-12-05
[patent_title] => 'Window support member for a semiconductor processing system'
[patent_app_type] => 1
[patent_app_number] => 9/176648
[patent_app_country] => US
[patent_app_date] => 1998-10-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 7
[patent_no_of_words] => 3096
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 46
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/156/06156079.pdf
[firstpage_image] =>[orig_patent_app_number] => 176648
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/176648 | Window support member for a semiconductor processing system | Oct 20, 1998 | Issued |
Array
(
[id] => 4205958
[patent_doc_number] => 06110232
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-29
[patent_title] => 'Method for preventing corrosion in load-lock chambers'
[patent_app_type] => 1
[patent_app_number] => 9/164919
[patent_app_country] => US
[patent_app_date] => 1998-10-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 3882
[patent_no_of_claims] => 29
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 91
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/110/06110232.pdf
[firstpage_image] =>[orig_patent_app_number] => 164919
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/164919 | Method for preventing corrosion in load-lock chambers | Sep 30, 1998 | Issued |
Array
(
[id] => 1254352
[patent_doc_number] => 06670696
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-12-30
[patent_title] => 'Tape-carrier-package semiconductor device and a liquid crystal panel display using such a device as well as a method for testing the disconnection thereof'
[patent_app_type] => B2
[patent_app_number] => 09/161478
[patent_app_country] => US
[patent_app_date] => 1998-09-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 23
[patent_no_of_words] => 14085
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 204
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/670/06670696.pdf
[firstpage_image] =>[orig_patent_app_number] => 09161478
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/161478 | Tape-carrier-package semiconductor device and a liquid crystal panel display using such a device as well as a method for testing the disconnection thereof | Sep 27, 1998 | Issued |
Array
(
[id] => 4153812
[patent_doc_number] => 06103550
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-15
[patent_title] => 'Molded tape support for a molded circuit package prior to dicing'
[patent_app_type] => 1
[patent_app_number] => 9/161408
[patent_app_country] => US
[patent_app_date] => 1998-09-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 1791
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 163
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/103/06103550.pdf
[firstpage_image] =>[orig_patent_app_number] => 161408
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/161408 | Molded tape support for a molded circuit package prior to dicing | Sep 27, 1998 | Issued |
Array
(
[id] => 4187262
[patent_doc_number] => 06020627
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-01
[patent_title] => 'Chip card and method of manufacturing a chip card'
[patent_app_type] => 1
[patent_app_number] => 9/152829
[patent_app_country] => US
[patent_app_date] => 1998-09-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 3917
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 143
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/020/06020627.pdf
[firstpage_image] =>[orig_patent_app_number] => 152829
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/152829 | Chip card and method of manufacturing a chip card | Sep 13, 1998 | Issued |
Array
(
[id] => 4059231
[patent_doc_number] => 06131255
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-17
[patent_title] => 'Repairable wafer scale integration system'
[patent_app_type] => 1
[patent_app_number] => 9/139452
[patent_app_country] => US
[patent_app_date] => 1998-08-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 8
[patent_no_of_words] => 3389
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 121
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/131/06131255.pdf
[firstpage_image] =>[orig_patent_app_number] => 139452
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/139452 | Repairable wafer scale integration system | Aug 24, 1998 | Issued |
Array
(
[id] => 4111618
[patent_doc_number] => 06023103
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-08
[patent_title] => 'Chip-scale carrier for semiconductor devices including mounted spring contacts'
[patent_app_type] => 1
[patent_app_number] => 9/106943
[patent_app_country] => US
[patent_app_date] => 1998-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 33
[patent_no_of_words] => 17209
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 116
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/023/06023103.pdf
[firstpage_image] =>[orig_patent_app_number] => 106943
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/106943 | Chip-scale carrier for semiconductor devices including mounted spring contacts | Jun 29, 1998 | Issued |
Array
(
[id] => 3936934
[patent_doc_number] => 05981311
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-09
[patent_title] => 'Process for using a removeable plating bus layer for high density substrates'
[patent_app_type] => 1
[patent_app_number] => 9/104838
[patent_app_country] => US
[patent_app_date] => 1998-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 6
[patent_no_of_words] => 2313
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 147
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/981/05981311.pdf
[firstpage_image] =>[orig_patent_app_number] => 104838
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/104838 | Process for using a removeable plating bus layer for high density substrates | Jun 24, 1998 | Issued |
Array
(
[id] => 4138834
[patent_doc_number] => 06060332
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-05-09
[patent_title] => 'Hybrid device with flush-mounted contacts for generating acoustic signals, and method for making same'
[patent_app_type] => 1
[patent_app_number] => 9/065088
[patent_app_country] => US
[patent_app_date] => 1998-06-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 11
[patent_no_of_words] => 5003
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 231
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/060/06060332.pdf
[firstpage_image] =>[orig_patent_app_number] => 065088
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/065088 | Hybrid device with flush-mounted contacts for generating acoustic signals, and method for making same | Jun 18, 1998 | Issued |
Array
(
[id] => 4211840
[patent_doc_number] => 06039770
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-03-21
[patent_title] => 'Semiconductor device manufacturing system having means for reducing a pressure difference between loadlock and processing chambers'
[patent_app_type] => 1
[patent_app_number] => 9/090862
[patent_app_country] => US
[patent_app_date] => 1998-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 2471
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 176
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/039/06039770.pdf
[firstpage_image] =>[orig_patent_app_number] => 090862
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/090862 | Semiconductor device manufacturing system having means for reducing a pressure difference between loadlock and processing chambers | Jun 4, 1998 | Issued |
Array
(
[id] => 4182617
[patent_doc_number] => 06159772
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-12-12
[patent_title] => 'Packaging electrical circuits'
[patent_app_type] => 1
[patent_app_number] => 9/089438
[patent_app_country] => US
[patent_app_date] => 1998-06-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 37
[patent_no_of_words] => 8585
[patent_no_of_claims] => 19
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/159/06159772.pdf
[firstpage_image] =>[orig_patent_app_number] => 089438
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/089438 | Packaging electrical circuits | Jun 2, 1998 | Issued |
Array
(
[id] => 4083503
[patent_doc_number] => 06162661
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-12-19
[patent_title] => 'Spacer plate solder ball placement fixture and methods therefor'
[patent_app_type] => 1
[patent_app_number] => 9/086808
[patent_app_country] => US
[patent_app_date] => 1998-05-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 35
[patent_no_of_words] => 7781
[patent_no_of_claims] => 32
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[patent_words_short_claim] => 149
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/162/06162661.pdf
[firstpage_image] =>[orig_patent_app_number] => 086808
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/086808 | Spacer plate solder ball placement fixture and methods therefor | May 28, 1998 | Issued |
Array
(
[id] => 6877563
[patent_doc_number] => 20010003049
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-06-07
[patent_title] => 'METHOD AND MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MOUNTING THE DEVICE'
[patent_app_type] => new-utility
[patent_app_number] => 09/029608
[patent_app_country] => US
[patent_app_date] => 1998-05-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 131
[patent_figures_cnt] => 131
[patent_no_of_words] => 70272
[patent_no_of_claims] => 86
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0003/20010003049.pdf
[firstpage_image] =>[orig_patent_app_number] => 09029608
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/029608 | METHOD AND MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MOUNTING THE DEVICE | May 14, 1998 | Abandoned |
Array
(
[id] => 4137683
[patent_doc_number] => 06063139
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-05-16
[patent_title] => 'Apparatus for continuous assembly of a semiconductor lead frame package'
[patent_app_type] => 1
[patent_app_number] => 9/074171
[patent_app_country] => US
[patent_app_date] => 1998-05-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 4169
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/063/06063139.pdf
[firstpage_image] =>[orig_patent_app_number] => 074171
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/074171 | Apparatus for continuous assembly of a semiconductor lead frame package | May 6, 1998 | Issued |
Array
(
[id] => 4423776
[patent_doc_number] => 06177728
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-23
[patent_title] => 'Integrated circuit chip device having balanced thermal expansion'
[patent_app_type] => 1
[patent_app_number] => 9/067707
[patent_app_country] => US
[patent_app_date] => 1998-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 3028
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/177/06177728.pdf
[firstpage_image] =>[orig_patent_app_number] => 067707
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/067707 | Integrated circuit chip device having balanced thermal expansion | Apr 27, 1998 | Issued |
Array
(
[id] => 4413864
[patent_doc_number] => 06310389
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-10-30
[patent_title] => 'Semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 9/065559
[patent_app_country] => US
[patent_app_date] => 1998-04-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 1441
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/310/06310389.pdf
[firstpage_image] =>[orig_patent_app_number] => 065559
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/065559 | Semiconductor package | Apr 23, 1998 | Issued |
Array
(
[id] => 4353316
[patent_doc_number] => 06168638
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-02
[patent_title] => 'Touchless stabilizer for processing spherical shaped devices'
[patent_app_type] => 1
[patent_app_number] => 9/066222
[patent_app_country] => US
[patent_app_date] => 1998-04-24
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/168/06168638.pdf
[firstpage_image] =>[orig_patent_app_number] => 066222
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/066222 | Touchless stabilizer for processing spherical shaped devices | Apr 23, 1998 | Issued |
Array
(
[id] => 4132709
[patent_doc_number] => 06127727
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-03
[patent_title] => 'Semiconductor substrate subassembly with alignment and stress relief features'
[patent_app_type] => 1
[patent_app_number] => 9/055679
[patent_app_country] => US
[patent_app_date] => 1998-04-06
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/127/06127727.pdf
[firstpage_image] =>[orig_patent_app_number] => 055679
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/055679 | Semiconductor substrate subassembly with alignment and stress relief features | Apr 5, 1998 | Issued |
Array
(
[id] => 7026676
[patent_doc_number] => 20010013652
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-08-16
[patent_title] => 'SEMICONDUCTOR DEVICE FREE FROM SHORT-CIRCUIT BETWEEN BUMP ELECTRODES AND SEPARATION FROM CIRCUIT BOARD AND PROCESS OF FABRICATION THEREOF'
[patent_app_type] => new
[patent_app_number] => 09/052287
[patent_app_country] => US
[patent_app_date] => 1998-03-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 3677
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 85
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0013/20010013652.pdf
[firstpage_image] =>[orig_patent_app_number] => 09052287
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/052287 | SEMICONDUCTOR DEVICE FREE FROM SHORT-CIRCUIT BETWEEN BUMP ELECTRODES AND SEPARATION FROM CIRCUIT BOARD AND PROCESS OF FABRICATION THEREOF | Mar 30, 1998 | Abandoned |