David E. Graybill

Array ( [id] => 4423776 [patent_doc_number] => 06177728 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-23 [patent_title] => 'Integrated circuit chip device having balanced thermal expansion' [patent_app_type] => 1 [patent_app_number] => 9/067707 [patent_app_country] => US [patent_app_date] => 1998-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 3028 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/177/06177728.pdf [firstpage_image] =>[orig_patent_app_number] => 067707 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4353316 [patent_doc_number] => 06168638 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-02 [patent_title] => 'Touchless stabilizer for processing spherical shaped devices' [patent_app_type] => 1 [patent_app_number] => 9/066222 [patent_app_country] => US [patent_app_date] => 1998-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 2803 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/168/06168638.pdf [firstpage_image] =>[orig_patent_app_number] => 066222 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4413864 [patent_doc_number] => 06310389 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-10-30 [patent_title] => 'Semiconductor package' [patent_app_type] => 1 [patent_app_number] => 9/065559 [patent_app_country] => US [patent_app_date] => 1998-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 1441 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/310/06310389.pdf [firstpage_image] =>[orig_patent_app_number] => 065559 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4132709 [patent_doc_number] => 06127727 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-03 [patent_title] => 'Semiconductor substrate subassembly with alignment and stress relief features' [patent_app_type] => 1 [patent_app_number] => 9/055679 [patent_app_country] => US [patent_app_date] => 1998-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 12237 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 173 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/127/06127727.pdf [firstpage_image] =>[orig_patent_app_number] => 055679 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7026676 [patent_doc_number] => 20010013652 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-08-16 [patent_title] => 'SEMICONDUCTOR DEVICE FREE FROM SHORT-CIRCUIT BETWEEN BUMP ELECTRODES AND SEPARATION FROM CIRCUIT BOARD AND PROCESS OF FABRICATION THEREOF' [patent_app_type] => new [patent_app_number] => 09/052287 [patent_app_country] => US [patent_app_date] => 1998-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3677 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0013/20010013652.pdf [firstpage_image] =>[orig_patent_app_number] => 09052287 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4258639 [patent_doc_number] => 06306183 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-10-23 [patent_title] => 'Method of forming manufacturing semiconductor device' [patent_app_type] => 1 [patent_app_number] => 9/043989 [patent_app_country] => US [patent_app_date] => 1998-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 2450 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/306/06306183.pdf [firstpage_image] =>[orig_patent_app_number] => 043989 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4131447 [patent_doc_number] => 06059846 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-05-09 [patent_title] => 'Bonding wire height inspection device' [patent_app_type] => 1 [patent_app_number] => 9/042843 [patent_app_country] => US [patent_app_date] => 1998-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 3387 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/059/06059846.pdf [firstpage_image] =>[orig_patent_app_number] => 042843 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4238408 [patent_doc_number] => 06080651 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-06-27 [patent_title] => 'Wire bonding method' [patent_app_type] => 1 [patent_app_number] => 9/042842 [patent_app_country] => US [patent_app_date] => 1998-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 3259 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/080/06080651.pdf [firstpage_image] =>[orig_patent_app_number] => 042842 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4111520 [patent_doc_number] => 06023096 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-02-08 [patent_title] => 'Semiconductor device having metal foil integral with sealing resin' [patent_app_type] => 1 [patent_app_number] => 9/032758 [patent_app_country] => US [patent_app_date] => 1998-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 4206 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/023/06023096.pdf [firstpage_image] =>[orig_patent_app_number] => 032758 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4226729 [patent_doc_number] => 06143040 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-11-07 [patent_title] => 'Substrate processing apparatus and maintenance method therefor' [patent_app_type] => 1 [patent_app_number] => 9/031950 [patent_app_country] => US [patent_app_date] => 1998-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 18 [patent_no_of_words] => 7520 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/143/06143040.pdf [firstpage_image] =>[orig_patent_app_number] => 031950 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4145206 [patent_doc_number] => 06063640 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-05-16 [patent_title] => 'Semiconductor wafer testing method with probe pin contact' [patent_app_type] => 1 [patent_app_number] => 9/030349 [patent_app_country] => US [patent_app_date] => 1998-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 46 [patent_figures_cnt] => 82 [patent_no_of_words] => 19735 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/063/06063640.pdf [firstpage_image] =>[orig_patent_app_number] => 030349 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4101154 [patent_doc_number] => 06100108 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-08 [patent_title] => 'Method of fabricating electronic circuit device' [patent_app_type] => 1 [patent_app_number] => 9/025107 [patent_app_country] => US [patent_app_date] => 1998-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 6678 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/100/06100108.pdf [firstpage_image] =>[orig_patent_app_number] => 025107 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5921978 [patent_doc_number] => 20020115236 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-22 [patent_title] => 'Methods of making compliant semiconductor chip packages' [patent_app_type] => new [patent_app_number] => 09/020647 [patent_app_country] => US [patent_app_date] => 1998-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5258 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 148 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0115/20020115236.pdf [firstpage_image] =>[orig_patent_app_number] => 09020647 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4227163 [patent_doc_number] => 06117367 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-09-12 [patent_title] => 'Pastes for improved substrate dimensional control' [patent_app_type] => 1 [patent_app_number] => 9/021045 [patent_app_country] => US [patent_app_date] => 1998-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 18 [patent_no_of_words] => 4778 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 38 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/117/06117367.pdf [firstpage_image] =>[orig_patent_app_number] => 021045 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6573090 [patent_doc_number] => 20020014685 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-02-07 [patent_title] => 'ELECTRONIC COMPONENT WITH BALL BONDED PADS CONNECTED TO A PLATED LEAD FRAME' [patent_app_type] => new [patent_app_number] => 09/011039 [patent_app_country] => US [patent_app_date] => 1998-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 5924 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0014/20020014685.pdf [firstpage_image] =>[orig_patent_app_number] => 09011039 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4226560 [patent_doc_number] => 06074443 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-06-13 [patent_title] => 'Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot' [patent_app_type] => 1 [patent_app_number] => 9/015726 [patent_app_country] => US [patent_app_date] => 1998-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 20 [patent_no_of_words] => 13385 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/074/06074443.pdf [firstpage_image] =>[orig_patent_app_number] => 015726 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1456930 [patent_doc_number] => 06391067 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-05-21 [patent_title] => 'Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus' [patent_app_type] => B2 [patent_app_number] => 09/015582 [patent_app_country] => US [patent_app_date] => 1998-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 23 [patent_no_of_words] => 7500 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/391/06391067.pdf [firstpage_image] =>[orig_patent_app_number] => 09015582 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3993221 [patent_doc_number] => 05985686 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-16 [patent_title] => 'Process for manufacturing vertical cavity surface emitting lasers using patterned wafer fusion and the device manufactured by the process' [patent_app_type] => 1 [patent_app_number] => 9/014778 [patent_app_country] => US [patent_app_date] => 1998-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 4084 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/985/05985686.pdf [firstpage_image] =>[orig_patent_app_number] => 014778 [rel_patent_id] =>[rel_patent_doc_number] =>)