Search

David E. Graybill

Examiner (ID: 8531)

Most Active Art Unit
2894
Art Unit(s)
1763, 3727, 2894, 1107, 2822, 2812, 2814, 2827
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4063566 [patent_doc_number] => 06008068 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-12-28 [patent_title] => 'Process for etching a semiconductor lead frame' [patent_app_type] => 1 [patent_app_number] => 8/877549 [patent_app_country] => US [patent_app_date] => 1997-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 31 [patent_no_of_words] => 8738 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 241 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/008/06008068.pdf [firstpage_image] =>[orig_patent_app_number] => 877549 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/877549
Process for etching a semiconductor lead frame Jun 16, 1997 Issued
Array ( [id] => 4102078 [patent_doc_number] => 06051448 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-04-18 [patent_title] => 'Method of manufacturing an electronic component' [patent_app_type] => 1 [patent_app_number] => 8/870344 [patent_app_country] => US [patent_app_date] => 1997-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 16 [patent_no_of_words] => 9418 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 199 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/051/06051448.pdf [firstpage_image] =>[orig_patent_app_number] => 870344 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/870344
Method of manufacturing an electronic component Jun 5, 1997 Issued
Array ( [id] => 1602566 [patent_doc_number] => 06432745 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-08-13 [patent_title] => 'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof' [patent_app_type] => B1 [patent_app_number] => 08/866064 [patent_app_country] => US [patent_app_date] => 1997-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 1241 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 266 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/432/06432745.pdf [firstpage_image] =>[orig_patent_app_number] => 08866064 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/866064
Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof May 29, 1997 Issued
Array ( [id] => 1257426 [patent_doc_number] => 06667560 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-12-23 [patent_title] => 'Board on chip ball grid array' [patent_app_type] => B2 [patent_app_number] => 08/863848 [patent_app_country] => US [patent_app_date] => 1997-05-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 14 [patent_no_of_words] => 1956 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/667/06667560.pdf [firstpage_image] =>[orig_patent_app_number] => 08863848 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/863848
Board on chip ball grid array May 26, 1997 Issued
Array ( [id] => 7117997 [patent_doc_number] => 20010001507 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-05-24 [patent_title] => 'SUBSTRATE FOR A SEMICONDUCTOR DEVICE, A SEMICONDUCTOR DEVICE, A CARD TYPE MODULE, AND A DATA MEMORY DEVICE' [patent_app_type] => new-utility [patent_app_number] => 08/863556 [patent_app_country] => US [patent_app_date] => 1997-05-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4254 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20010001507.pdf [firstpage_image] =>[orig_patent_app_number] => 08863556 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/863556
SUBSTRATE FOR A SEMICONDUCTOR DEVICE, A SEMICONDUCTOR DEVICE, A CARD TYPE MODULE, AND A DATA MEMORY DEVICE May 26, 1997 Abandoned
Array ( [id] => 3956928 [patent_doc_number] => 05930603 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-27 [patent_title] => 'Method for producing a semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/863280 [patent_app_country] => US [patent_app_date] => 1997-05-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 19 [patent_no_of_words] => 8661 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 242 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/930/05930603.pdf [firstpage_image] =>[orig_patent_app_number] => 863280 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/863280
Method for producing a semiconductor device May 26, 1997 Issued
Array ( [id] => 4141979 [patent_doc_number] => 06030889 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-02-29 [patent_title] => 'Substrate-holding fixture of non-wettable material' [patent_app_type] => 1 [patent_app_number] => 8/859546 [patent_app_country] => US [patent_app_date] => 1997-05-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 16 [patent_no_of_words] => 4495 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 217 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/030/06030889.pdf [firstpage_image] =>[orig_patent_app_number] => 859546 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/859546
Substrate-holding fixture of non-wettable material May 19, 1997 Issued
Array ( [id] => 4016077 [patent_doc_number] => 05923957 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-13 [patent_title] => 'Process for manufacturing a lead-on-chip semiconductor device package having a discontinuous adhesive layer formed from liquid adhesive' [patent_app_type] => 1 [patent_app_number] => 8/853907 [patent_app_country] => US [patent_app_date] => 1997-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 3645 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 226 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/923/05923957.pdf [firstpage_image] =>[orig_patent_app_number] => 853907 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/853907
Process for manufacturing a lead-on-chip semiconductor device package having a discontinuous adhesive layer formed from liquid adhesive May 8, 1997 Issued
Array ( [id] => 3916148 [patent_doc_number] => 05944857 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-31 [patent_title] => 'Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor' [patent_app_type] => 1 [patent_app_number] => 8/853172 [patent_app_country] => US [patent_app_date] => 1997-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 7375 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 178 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/944/05944857.pdf [firstpage_image] =>[orig_patent_app_number] => 853172 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/853172
Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor May 7, 1997 Issued
Array ( [id] => 3934711 [patent_doc_number] => 05972738 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-10-26 [patent_title] => 'PBGA stiffener package' [patent_app_type] => 1 [patent_app_number] => 8/852597 [patent_app_country] => US [patent_app_date] => 1997-05-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 1199 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 266 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/972/05972738.pdf [firstpage_image] =>[orig_patent_app_number] => 852597 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/852597
PBGA stiffener package May 6, 1997 Issued
Array ( [id] => 3964540 [patent_doc_number] => 05885852 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-23 [patent_title] => 'Packaged semiconductor device having a flange at its side surface and its manufacturing method' [patent_app_type] => 1 [patent_app_number] => 8/848566 [patent_app_country] => US [patent_app_date] => 1997-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 4027 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 486 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/885/05885852.pdf [firstpage_image] =>[orig_patent_app_number] => 848566 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/848566
Packaged semiconductor device having a flange at its side surface and its manufacturing method Apr 27, 1997 Issued
Array ( [id] => 3947961 [patent_doc_number] => 05982041 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-09 [patent_title] => 'Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 8/835287 [patent_app_country] => US [patent_app_date] => 1997-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 10041 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/982/05982041.pdf [firstpage_image] =>[orig_patent_app_number] => 835287 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/835287
Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices Apr 8, 1997 Issued
Array ( [id] => 3730716 [patent_doc_number] => 05752985 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-19 [patent_title] => 'Clean room having an air conditioning system' [patent_app_type] => 1 [patent_app_number] => 8/833429 [patent_app_country] => US [patent_app_date] => 1997-04-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 5394 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 240 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/752/05752985.pdf [firstpage_image] =>[orig_patent_app_number] => 833429 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/833429
Clean room having an air conditioning system Apr 6, 1997 Issued
Array ( [id] => 4070060 [patent_doc_number] => 05970320 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-10-19 [patent_title] => 'Process of resin sealing a semiconductor device and lead frame' [patent_app_type] => 1 [patent_app_number] => 8/833311 [patent_app_country] => US [patent_app_date] => 1997-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 16 [patent_no_of_words] => 6562 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 350 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/970/05970320.pdf [firstpage_image] =>[orig_patent_app_number] => 833311 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/833311
Process of resin sealing a semiconductor device and lead frame Apr 3, 1997 Issued
Array ( [id] => 3990707 [patent_doc_number] => 05891755 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-06 [patent_title] => 'Process for flat plate cooling a semiconductor chip using a thermal paste retainer' [patent_app_type] => 1 [patent_app_number] => 8/825297 [patent_app_country] => US [patent_app_date] => 1997-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 4002 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/891/05891755.pdf [firstpage_image] =>[orig_patent_app_number] => 825297 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/825297
Process for flat plate cooling a semiconductor chip using a thermal paste retainer Mar 26, 1997 Issued
Array ( [id] => 4037800 [patent_doc_number] => 05868803 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-02-09 [patent_title] => 'Method for mounting a wafer loading device to a process machine' [patent_app_type] => 1 [patent_app_number] => 8/821274 [patent_app_country] => US [patent_app_date] => 1997-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 2950 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/868/05868803.pdf [firstpage_image] =>[orig_patent_app_number] => 821274 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/821274
Method for mounting a wafer loading device to a process machine Mar 19, 1997 Issued
Array ( [id] => 4037894 [patent_doc_number] => 05908317 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-06-01 [patent_title] => 'Method of forming chip bumps of bump chip scale semiconductor package' [patent_app_type] => 1 [patent_app_number] => 8/813725 [patent_app_country] => US [patent_app_date] => 1997-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 22 [patent_no_of_words] => 4458 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/908/05908317.pdf [firstpage_image] =>[orig_patent_app_number] => 813725 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/813725
Method of forming chip bumps of bump chip scale semiconductor package Mar 6, 1997 Issued
Array ( [id] => 3869714 [patent_doc_number] => 05763293 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-06-09 [patent_title] => 'Process of fabricating a thermoelectric module formed of V-VI group compound semiconductor including the steps of rapid cooling and hot pressing' [patent_app_type] => 1 [patent_app_number] => 8/810651 [patent_app_country] => US [patent_app_date] => 1997-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 11 [patent_no_of_words] => 3425 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 222 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/763/05763293.pdf [firstpage_image] =>[orig_patent_app_number] => 810651 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/810651
Process of fabricating a thermoelectric module formed of V-VI group compound semiconductor including the steps of rapid cooling and hot pressing Mar 2, 1997 Issued
Array ( [id] => 4285549 [patent_doc_number] => 06183523 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-02-06 [patent_title] => 'Apparatus for thermal control of variously sized articles in vacuum' [patent_app_type] => 1 [patent_app_number] => 8/810359 [patent_app_country] => US [patent_app_date] => 1997-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 2577 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 262 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/183/06183523.pdf [firstpage_image] =>[orig_patent_app_number] => 810359 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/810359
Apparatus for thermal control of variously sized articles in vacuum Mar 2, 1997 Issued
Array ( [id] => 4030642 [patent_doc_number] => 05963785 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-10-05 [patent_title] => 'Dielectrically-isolated integrated circuit' [patent_app_type] => 1 [patent_app_number] => 8/808647 [patent_app_country] => US [patent_app_date] => 1997-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 25 [patent_no_of_words] => 8032 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/963/05963785.pdf [firstpage_image] =>[orig_patent_app_number] => 808647 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/808647
Dielectrically-isolated integrated circuit Feb 27, 1997 Issued
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