
David E. Graybill
Examiner (ID: 8531)
| Most Active Art Unit | 2894 |
| Art Unit(s) | 1763, 3727, 2894, 1107, 2822, 2812, 2814, 2827 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4063566
[patent_doc_number] => 06008068
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-28
[patent_title] => 'Process for etching a semiconductor lead frame'
[patent_app_type] => 1
[patent_app_number] => 8/877549
[patent_app_country] => US
[patent_app_date] => 1997-06-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 31
[patent_no_of_words] => 8738
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 241
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/008/06008068.pdf
[firstpage_image] =>[orig_patent_app_number] => 877549
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/877549 | Process for etching a semiconductor lead frame | Jun 16, 1997 | Issued |
Array
(
[id] => 4102078
[patent_doc_number] => 06051448
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-18
[patent_title] => 'Method of manufacturing an electronic component'
[patent_app_type] => 1
[patent_app_number] => 8/870344
[patent_app_country] => US
[patent_app_date] => 1997-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 16
[patent_no_of_words] => 9418
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 199
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/051/06051448.pdf
[firstpage_image] =>[orig_patent_app_number] => 870344
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/870344 | Method of manufacturing an electronic component | Jun 5, 1997 | Issued |
Array
(
[id] => 1602566
[patent_doc_number] => 06432745
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-13
[patent_title] => 'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof'
[patent_app_type] => B1
[patent_app_number] => 08/866064
[patent_app_country] => US
[patent_app_date] => 1997-05-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 4
[patent_no_of_words] => 1241
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 266
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/432/06432745.pdf
[firstpage_image] =>[orig_patent_app_number] => 08866064
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/866064 | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof | May 29, 1997 | Issued |
Array
(
[id] => 1257426
[patent_doc_number] => 06667560
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-12-23
[patent_title] => 'Board on chip ball grid array'
[patent_app_type] => B2
[patent_app_number] => 08/863848
[patent_app_country] => US
[patent_app_date] => 1997-05-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 14
[patent_no_of_words] => 1956
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 83
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/667/06667560.pdf
[firstpage_image] =>[orig_patent_app_number] => 08863848
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/863848 | Board on chip ball grid array | May 26, 1997 | Issued |
Array
(
[id] => 7117997
[patent_doc_number] => 20010001507
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-05-24
[patent_title] => 'SUBSTRATE FOR A SEMICONDUCTOR DEVICE, A SEMICONDUCTOR DEVICE, A CARD TYPE MODULE, AND A DATA MEMORY DEVICE'
[patent_app_type] => new-utility
[patent_app_number] => 08/863556
[patent_app_country] => US
[patent_app_date] => 1997-05-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 4254
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 8
[patent_words_short_claim] => 103
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0001/20010001507.pdf
[firstpage_image] =>[orig_patent_app_number] => 08863556
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/863556 | SUBSTRATE FOR A SEMICONDUCTOR DEVICE, A SEMICONDUCTOR DEVICE, A CARD TYPE MODULE, AND A DATA MEMORY DEVICE | May 26, 1997 | Abandoned |
Array
(
[id] => 3956928
[patent_doc_number] => 05930603
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-27
[patent_title] => 'Method for producing a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/863280
[patent_app_country] => US
[patent_app_date] => 1997-05-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 19
[patent_no_of_words] => 8661
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 242
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/930/05930603.pdf
[firstpage_image] =>[orig_patent_app_number] => 863280
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/863280 | Method for producing a semiconductor device | May 26, 1997 | Issued |
Array
(
[id] => 4141979
[patent_doc_number] => 06030889
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-29
[patent_title] => 'Substrate-holding fixture of non-wettable material'
[patent_app_type] => 1
[patent_app_number] => 8/859546
[patent_app_country] => US
[patent_app_date] => 1997-05-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 16
[patent_no_of_words] => 4495
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 217
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/030/06030889.pdf
[firstpage_image] =>[orig_patent_app_number] => 859546
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/859546 | Substrate-holding fixture of non-wettable material | May 19, 1997 | Issued |
Array
(
[id] => 4016077
[patent_doc_number] => 05923957
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-13
[patent_title] => 'Process for manufacturing a lead-on-chip semiconductor device package having a discontinuous adhesive layer formed from liquid adhesive'
[patent_app_type] => 1
[patent_app_number] => 8/853907
[patent_app_country] => US
[patent_app_date] => 1997-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 10
[patent_no_of_words] => 3645
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 226
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/923/05923957.pdf
[firstpage_image] =>[orig_patent_app_number] => 853907
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/853907 | Process for manufacturing a lead-on-chip semiconductor device package having a discontinuous adhesive layer formed from liquid adhesive | May 8, 1997 | Issued |
Array
(
[id] => 3916148
[patent_doc_number] => 05944857
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-31
[patent_title] => 'Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor'
[patent_app_type] => 1
[patent_app_number] => 8/853172
[patent_app_country] => US
[patent_app_date] => 1997-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 7375
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 178
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/944/05944857.pdf
[firstpage_image] =>[orig_patent_app_number] => 853172
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/853172 | Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor | May 7, 1997 | Issued |
Array
(
[id] => 3934711
[patent_doc_number] => 05972738
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-10-26
[patent_title] => 'PBGA stiffener package'
[patent_app_type] => 1
[patent_app_number] => 8/852597
[patent_app_country] => US
[patent_app_date] => 1997-05-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 1199
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 266
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/972/05972738.pdf
[firstpage_image] =>[orig_patent_app_number] => 852597
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/852597 | PBGA stiffener package | May 6, 1997 | Issued |
Array
(
[id] => 3964540
[patent_doc_number] => 05885852
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-23
[patent_title] => 'Packaged semiconductor device having a flange at its side surface and its manufacturing method'
[patent_app_type] => 1
[patent_app_number] => 8/848566
[patent_app_country] => US
[patent_app_date] => 1997-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 14
[patent_no_of_words] => 4027
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 486
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/885/05885852.pdf
[firstpage_image] =>[orig_patent_app_number] => 848566
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/848566 | Packaged semiconductor device having a flange at its side surface and its manufacturing method | Apr 27, 1997 | Issued |
Array
(
[id] => 3947961
[patent_doc_number] => 05982041
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-09
[patent_title] => 'Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 8/835287
[patent_app_country] => US
[patent_app_date] => 1997-04-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 10041
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 58
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/982/05982041.pdf
[firstpage_image] =>[orig_patent_app_number] => 835287
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/835287 | Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices | Apr 8, 1997 | Issued |
Array
(
[id] => 3730716
[patent_doc_number] => 05752985
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-19
[patent_title] => 'Clean room having an air conditioning system'
[patent_app_type] => 1
[patent_app_number] => 8/833429
[patent_app_country] => US
[patent_app_date] => 1997-04-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 10
[patent_no_of_words] => 5394
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 240
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/752/05752985.pdf
[firstpage_image] =>[orig_patent_app_number] => 833429
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/833429 | Clean room having an air conditioning system | Apr 6, 1997 | Issued |
Array
(
[id] => 4070060
[patent_doc_number] => 05970320
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-10-19
[patent_title] => 'Process of resin sealing a semiconductor device and lead frame'
[patent_app_type] => 1
[patent_app_number] => 8/833311
[patent_app_country] => US
[patent_app_date] => 1997-04-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 16
[patent_no_of_words] => 6562
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 350
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/970/05970320.pdf
[firstpage_image] =>[orig_patent_app_number] => 833311
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/833311 | Process of resin sealing a semiconductor device and lead frame | Apr 3, 1997 | Issued |
Array
(
[id] => 3990707
[patent_doc_number] => 05891755
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-06
[patent_title] => 'Process for flat plate cooling a semiconductor chip using a thermal paste retainer'
[patent_app_type] => 1
[patent_app_number] => 8/825297
[patent_app_country] => US
[patent_app_date] => 1997-03-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 4002
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 145
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/891/05891755.pdf
[firstpage_image] =>[orig_patent_app_number] => 825297
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/825297 | Process for flat plate cooling a semiconductor chip using a thermal paste retainer | Mar 26, 1997 | Issued |
Array
(
[id] => 4037800
[patent_doc_number] => 05868803
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-02-09
[patent_title] => 'Method for mounting a wafer loading device to a process machine'
[patent_app_type] => 1
[patent_app_number] => 8/821274
[patent_app_country] => US
[patent_app_date] => 1997-03-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 4
[patent_no_of_words] => 2950
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 111
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/868/05868803.pdf
[firstpage_image] =>[orig_patent_app_number] => 821274
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/821274 | Method for mounting a wafer loading device to a process machine | Mar 19, 1997 | Issued |
Array
(
[id] => 4037894
[patent_doc_number] => 05908317
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-06-01
[patent_title] => 'Method of forming chip bumps of bump chip scale semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 8/813725
[patent_app_country] => US
[patent_app_date] => 1997-03-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 22
[patent_no_of_words] => 4458
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 122
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/908/05908317.pdf
[firstpage_image] =>[orig_patent_app_number] => 813725
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/813725 | Method of forming chip bumps of bump chip scale semiconductor package | Mar 6, 1997 | Issued |
Array
(
[id] => 3869714
[patent_doc_number] => 05763293
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-09
[patent_title] => 'Process of fabricating a thermoelectric module formed of V-VI group compound semiconductor including the steps of rapid cooling and hot pressing'
[patent_app_type] => 1
[patent_app_number] => 8/810651
[patent_app_country] => US
[patent_app_date] => 1997-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 11
[patent_no_of_words] => 3425
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 222
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/763/05763293.pdf
[firstpage_image] =>[orig_patent_app_number] => 810651
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/810651 | Process of fabricating a thermoelectric module formed of V-VI group compound semiconductor including the steps of rapid cooling and hot pressing | Mar 2, 1997 | Issued |
Array
(
[id] => 4285549
[patent_doc_number] => 06183523
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-02-06
[patent_title] => 'Apparatus for thermal control of variously sized articles in vacuum'
[patent_app_type] => 1
[patent_app_number] => 8/810359
[patent_app_country] => US
[patent_app_date] => 1997-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 2577
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 262
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/183/06183523.pdf
[firstpage_image] =>[orig_patent_app_number] => 810359
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/810359 | Apparatus for thermal control of variously sized articles in vacuum | Mar 2, 1997 | Issued |
Array
(
[id] => 4030642
[patent_doc_number] => 05963785
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-10-05
[patent_title] => 'Dielectrically-isolated integrated circuit'
[patent_app_type] => 1
[patent_app_number] => 8/808647
[patent_app_country] => US
[patent_app_date] => 1997-02-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 25
[patent_no_of_words] => 8032
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/963/05963785.pdf
[firstpage_image] =>[orig_patent_app_number] => 808647
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/808647 | Dielectrically-isolated integrated circuit | Feb 27, 1997 | Issued |