
David E. Graybill
Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )
| Most Active Art Unit | 2894 |
| Art Unit(s) | 2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814 |
| Total Applications | 1844 |
| Issued Applications | 1278 |
| Pending Applications | 38 |
| Abandoned Applications | 533 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4056841
[patent_doc_number] => 05895222
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-20
[patent_title] => 'Encapsulant dam standoff for shell-enclosed die assemblies'
[patent_app_type] => 1
[patent_app_number] => 8/891279
[patent_app_country] => US
[patent_app_date] => 1997-07-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 14
[patent_no_of_words] => 4538
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 111
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/895/05895222.pdf
[firstpage_image] =>[orig_patent_app_number] => 891279
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/891279 | Encapsulant dam standoff for shell-enclosed die assemblies | Jul 9, 1997 | Issued |
Array
(
[id] => 4317297
[patent_doc_number] => 06331194
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-18
[patent_title] => 'Process for manufacturing hollow fused-silica insulator cylinder'
[patent_app_type] => 1
[patent_app_number] => 8/889587
[patent_app_country] => US
[patent_app_date] => 1997-07-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 7109
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[patent_words_short_claim] => 100
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/331/06331194.pdf
[firstpage_image] =>[orig_patent_app_number] => 889587
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/889587 | Process for manufacturing hollow fused-silica insulator cylinder | Jul 7, 1997 | Issued |
Array
(
[id] => 4182504
[patent_doc_number] => 06159764
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-12-12
[patent_title] => 'Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages'
[patent_app_type] => 1
[patent_app_number] => 8/887381
[patent_app_country] => US
[patent_app_date] => 1997-07-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 5092
[patent_no_of_claims] => 1
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 149
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/159/06159764.pdf
[firstpage_image] =>[orig_patent_app_number] => 887381
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/887381 | Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages | Jul 1, 1997 | Issued |
Array
(
[id] => 3758622
[patent_doc_number] => 05772700
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-30
[patent_title] => 'Location guide bar which accommodates multiple size cassettes for use in a loader and unloader indexer'
[patent_app_type] => 1
[patent_app_number] => 8/885797
[patent_app_country] => US
[patent_app_date] => 1997-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 15
[patent_no_of_words] => 3634
[patent_no_of_claims] => 16
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/772/05772700.pdf
[firstpage_image] =>[orig_patent_app_number] => 885797
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/885797 | Location guide bar which accommodates multiple size cassettes for use in a loader and unloader indexer | Jun 29, 1997 | Issued |
Array
(
[id] => 4144624
[patent_doc_number] => 06106582
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-22
[patent_title] => 'Apparatus and method for positioning an object at multiple positions within an enclosure'
[patent_app_type] => 1
[patent_app_number] => 8/882567
[patent_app_country] => US
[patent_app_date] => 1997-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 3985
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/106/06106582.pdf
[firstpage_image] =>[orig_patent_app_number] => 882567
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/882567 | Apparatus and method for positioning an object at multiple positions within an enclosure | Jun 24, 1997 | Issued |
Array
(
[id] => 4063566
[patent_doc_number] => 06008068
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-28
[patent_title] => 'Process for etching a semiconductor lead frame'
[patent_app_type] => 1
[patent_app_number] => 8/877549
[patent_app_country] => US
[patent_app_date] => 1997-06-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 8738
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[pdf_file] => patents/06/008/06008068.pdf
[firstpage_image] =>[orig_patent_app_number] => 877549
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/877549 | Process for etching a semiconductor lead frame | Jun 16, 1997 | Issued |
Array
(
[id] => 4102078
[patent_doc_number] => 06051448
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-18
[patent_title] => 'Method of manufacturing an electronic component'
[patent_app_type] => 1
[patent_app_number] => 8/870344
[patent_app_country] => US
[patent_app_date] => 1997-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 16
[patent_no_of_words] => 9418
[patent_no_of_claims] => 24
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[patent_words_short_claim] => 199
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/051/06051448.pdf
[firstpage_image] =>[orig_patent_app_number] => 870344
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/870344 | Method of manufacturing an electronic component | Jun 5, 1997 | Issued |
Array
(
[id] => 1602566
[patent_doc_number] => 06432745
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-13
[patent_title] => 'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof'
[patent_app_type] => B1
[patent_app_number] => 08/866064
[patent_app_country] => US
[patent_app_date] => 1997-05-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 4
[patent_no_of_words] => 1241
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[patent_words_short_claim] => 266
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/432/06432745.pdf
[firstpage_image] =>[orig_patent_app_number] => 08866064
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/866064 | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof | May 29, 1997 | Issued |
Array
(
[id] => 1257426
[patent_doc_number] => 06667560
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-12-23
[patent_title] => 'Board on chip ball grid array'
[patent_app_type] => B2
[patent_app_number] => 08/863848
[patent_app_country] => US
[patent_app_date] => 1997-05-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 1956
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/667/06667560.pdf
[firstpage_image] =>[orig_patent_app_number] => 08863848
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/863848 | Board on chip ball grid array | May 26, 1997 | Issued |
Array
(
[id] => 7117997
[patent_doc_number] => 20010001507
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-05-24
[patent_title] => 'SUBSTRATE FOR A SEMICONDUCTOR DEVICE, A SEMICONDUCTOR DEVICE, A CARD TYPE MODULE, AND A DATA MEMORY DEVICE'
[patent_app_type] => new-utility
[patent_app_number] => 08/863556
[patent_app_country] => US
[patent_app_date] => 1997-05-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 4254
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0001/20010001507.pdf
[firstpage_image] =>[orig_patent_app_number] => 08863556
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/863556 | SUBSTRATE FOR A SEMICONDUCTOR DEVICE, A SEMICONDUCTOR DEVICE, A CARD TYPE MODULE, AND A DATA MEMORY DEVICE | May 26, 1997 | Abandoned |
Array
(
[id] => 3956928
[patent_doc_number] => 05930603
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-27
[patent_title] => 'Method for producing a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/863280
[patent_app_country] => US
[patent_app_date] => 1997-05-27
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[pdf_file] => patents/05/930/05930603.pdf
[firstpage_image] =>[orig_patent_app_number] => 863280
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/863280 | Method for producing a semiconductor device | May 26, 1997 | Issued |
Array
(
[id] => 4141979
[patent_doc_number] => 06030889
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-29
[patent_title] => 'Substrate-holding fixture of non-wettable material'
[patent_app_type] => 1
[patent_app_number] => 8/859546
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[pdf_file] => patents/06/030/06030889.pdf
[firstpage_image] =>[orig_patent_app_number] => 859546
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/859546 | Substrate-holding fixture of non-wettable material | May 19, 1997 | Issued |
Array
(
[id] => 4016077
[patent_doc_number] => 05923957
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-13
[patent_title] => 'Process for manufacturing a lead-on-chip semiconductor device package having a discontinuous adhesive layer formed from liquid adhesive'
[patent_app_type] => 1
[patent_app_number] => 8/853907
[patent_app_country] => US
[patent_app_date] => 1997-05-09
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[firstpage_image] =>[orig_patent_app_number] => 853907
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/853907 | Process for manufacturing a lead-on-chip semiconductor device package having a discontinuous adhesive layer formed from liquid adhesive | May 8, 1997 | Issued |
Array
(
[id] => 3916148
[patent_doc_number] => 05944857
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[patent_kind] => NA
[patent_issue_date] => 1999-08-31
[patent_title] => 'Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor'
[patent_app_type] => 1
[patent_app_number] => 8/853172
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[pdf_file] => patents/05/944/05944857.pdf
[firstpage_image] =>[orig_patent_app_number] => 853172
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/853172 | Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor | May 7, 1997 | Issued |
Array
(
[id] => 3934711
[patent_doc_number] => 05972738
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[patent_kind] => NA
[patent_issue_date] => 1999-10-26
[patent_title] => 'PBGA stiffener package'
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[pdf_file] => patents/05/972/05972738.pdf
[firstpage_image] =>[orig_patent_app_number] => 852597
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/852597 | PBGA stiffener package | May 6, 1997 | Issued |
Array
(
[id] => 3964540
[patent_doc_number] => 05885852
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[patent_kind] => NA
[patent_issue_date] => 1999-03-23
[patent_title] => 'Packaged semiconductor device having a flange at its side surface and its manufacturing method'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/848566 | Packaged semiconductor device having a flange at its side surface and its manufacturing method | Apr 27, 1997 | Issued |
Array
(
[id] => 3947961
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[patent_issue_date] => 1999-11-09
[patent_title] => 'Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/835287 | Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices | Apr 8, 1997 | Issued |
Array
(
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[patent_title] => 'Clean room having an air conditioning system'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/833429 | Clean room having an air conditioning system | Apr 6, 1997 | Issued |
Array
(
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[firstpage_image] =>[orig_patent_app_number] => 833311
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/833311 | Process of resin sealing a semiconductor device and lead frame | Apr 3, 1997 | Issued |
Array
(
[id] => 3990707
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[patent_issue_date] => 1999-04-06
[patent_title] => 'Process for flat plate cooling a semiconductor chip using a thermal paste retainer'
[patent_app_type] => 1
[patent_app_number] => 8/825297
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[pdf_file] => patents/05/891/05891755.pdf
[firstpage_image] =>[orig_patent_app_number] => 825297
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/825297 | Process for flat plate cooling a semiconductor chip using a thermal paste retainer | Mar 26, 1997 | Issued |