| Application number | Title of the application | Filing Date | Status |
|---|
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[patent_title] => 'Method of forming solder bumps onto an integrated circuit device'
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[patent_app_number] => 8/649837
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Array
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[patent_kind] => NA
[patent_issue_date] => 1999-04-27
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Array
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[patent_doc_number] => 05681757
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[patent_kind] => NA
[patent_issue_date] => 1997-10-28
[patent_title] => 'Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process'
[patent_app_type] => 1
[patent_app_number] => 8/639435
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Array
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[patent_issue_date] => 1998-12-29
[patent_title] => 'Method of manufacturing an optical semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/638873
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[patent_app_date] => 1996-04-29
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Array
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Array
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[id] => 4292221
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/636915 | Process for bonding circuit substrates using conductive particles and back side exposure | Apr 23, 1996 | Issued |
Array
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[id] => 3942032
[patent_doc_number] => 05989993
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[patent_issue_date] => 1999-11-23
[patent_title] => 'Method for galvanic forming of bonding pads'
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[patent_app_number] => 8/636163
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[patent_app_date] => 1996-04-22
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[firstpage_image] =>[orig_patent_app_number] => 636163
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/636163 | Method for galvanic forming of bonding pads | Apr 21, 1996 | Issued |
Array
(
[id] => 3723604
[patent_doc_number] => 05681777
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[patent_issue_date] => 1997-10-28
[patent_title] => 'Process for manufacturing a multi-layer tab tape semiconductor device'
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[patent_app_number] => 8/625641
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/625641 | Process for manufacturing a multi-layer tab tape semiconductor device | Mar 28, 1996 | Issued |
Array
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[id] => 1571230
[patent_doc_number] => 06498396
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[patent_kind] => B1
[patent_issue_date] => 2002-12-24
[patent_title] => 'Semiconductor chip scale package and ball grid array structures'
[patent_app_type] => B1
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Array
(
[id] => 3620153
[patent_doc_number] => 05688721
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-11-18
[patent_title] => '3D stack of IC chips having leads reached by vias through passivation covering access plane'
[patent_app_type] => 1
[patent_app_number] => 8/622671
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[firstpage_image] =>[orig_patent_app_number] => 622671
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/622671 | 3D stack of IC chips having leads reached by vias through passivation covering access plane | Mar 25, 1996 | Issued |
| 08/616968 | INTEGRATED CIRCUIT WITH LEAD FRAME PACKAGE HAVING INTERNAL POWER AND GROUND BUSSES | Mar 17, 1996 | Abandoned |
| 08/615435 | CAPACITOR, METHOD FOR PRODUCING SAME AND METHOD FOR PRODUCING DIELECTRIC BODY | Mar 13, 1996 | Abandoned |
Array
(
[id] => 4141445
[patent_doc_number] => 06030857
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[patent_title] => 'Method for application of spray adhesive to a leadframe for chip bonding'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/613835 | Method for application of spray adhesive to a leadframe for chip bonding | Mar 10, 1996 | Issued |
| 08/553495 | PROCESS FOR PRODUCING A SEALING AND A MECHANICAL STRENGTH CORD BETWEEN A SUBSTRATE AND A CHIP HYBRIDIZED BY BUMPS ON THE SUBSTRATE | Mar 3, 1996 | Abandoned |
Array
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[id] => 3908054
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[patent_issue_date] => 1999-11-23
[patent_title] => 'Apparatus for transporting lead frames'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/608249 | Apparatus for transporting lead frames | Feb 27, 1996 | Issued |
Array
(
[id] => 4130689
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[patent_kind] => NA
[patent_issue_date] => 2000-09-19
[patent_title] => 'Process of fabricating semiconductor unit employing bumps to bond two components'
[patent_app_type] => 1
[patent_app_number] => 8/606503
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[patent_app_date] => 1996-02-23
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Array
(
[id] => 3687236
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[patent_kind] => NA
[patent_issue_date] => 1997-07-01
[patent_title] => 'Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs'
[patent_app_type] => 1
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[patent_app_date] => 1996-02-16
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/602896 | Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs | Feb 15, 1996 | Issued |
| 08/602179 | CHIP-SCALE CARRIER AND METHODS OF MOUNTING SPRING CONTACTS TO SEMICONDUCTOR DEVICES | Feb 14, 1996 | Abandoned |
Array
(
[id] => 3759638
[patent_doc_number] => 05851852
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[patent_kind] => NA
[patent_issue_date] => 1998-12-22
[patent_title] => 'Die attached process for SiC'
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[firstpage_image] =>[orig_patent_app_number] => 600777
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/600777 | Die attached process for SiC | Feb 12, 1996 | Issued |