| Application number | Title of the application | Filing Date | Status |
|---|
Array
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[patent_kind] => NA
[patent_issue_date] => 1997-07-29
[patent_title] => 'Workpiece monitoring process using a workpiece carrier having an identification code'
[patent_app_type] => 1
[patent_app_number] => 8/588565
[patent_app_country] => US
[patent_app_date] => 1996-01-18
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[pdf_file] => patents/05/651/05651798.pdf
[firstpage_image] =>[orig_patent_app_number] => 588565
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/588565 | Workpiece monitoring process using a workpiece carrier having an identification code | Jan 17, 1996 | Issued |
Array
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[patent_doc_number] => 05712190
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[patent_kind] => NA
[patent_issue_date] => 1998-01-27
[patent_title] => 'Process for controlling distance between integrated circuit chips in an electronic module'
[patent_app_type] => 1
[patent_app_number] => 8/585579
[patent_app_country] => US
[patent_app_date] => 1996-01-16
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[firstpage_image] =>[orig_patent_app_number] => 585579
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/585579 | Process for controlling distance between integrated circuit chips in an electronic module | Jan 15, 1996 | Issued |
Array
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[id] => 3694897
[patent_doc_number] => 05661086
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-08-26
[patent_title] => 'Process for manufacturing a plurality of strip lead frame semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 8/584299
[patent_app_country] => US
[patent_app_date] => 1996-01-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[firstpage_image] =>[orig_patent_app_number] => 584299
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Array
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[patent_doc_number] => 05849602
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-15
[patent_title] => 'Resist processing process'
[patent_app_type] => 1
[patent_app_number] => 8/582280
[patent_app_country] => US
[patent_app_date] => 1996-01-03
[patent_effective_date] => 0000-00-00
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Array
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[id] => 1381105
[patent_doc_number] => 06551845
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[patent_kind] => B1
[patent_issue_date] => 2003-04-22
[patent_title] => 'Method of temporarily securing a die to a burn-in carrier'
[patent_app_type] => B1
[patent_app_number] => 08/581905
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[patent_app_date] => 1996-01-02
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[firstpage_image] =>[orig_patent_app_number] => 08581905
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Array
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[id] => 4063623
[patent_doc_number] => 06008072
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[patent_kind] => NA
[patent_issue_date] => 1999-12-28
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[patent_app_number] => 8/579511
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Array
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[id] => 3952531
[patent_doc_number] => 05940679
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[patent_kind] => NA
[patent_issue_date] => 1999-08-17
[patent_title] => 'Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage'
[patent_app_type] => 1
[patent_app_number] => 8/577485
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[patent_app_date] => 1995-12-22
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[firstpage_image] =>[orig_patent_app_number] => 577485
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/577485 | Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage | Dec 21, 1995 | Issued |
Array
(
[id] => 1578251
[patent_doc_number] => 06448169
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-10
[patent_title] => 'Apparatus and method for use in manufacturing semiconductor devices'
[patent_app_type] => B1
[patent_app_number] => 08/576185
[patent_app_country] => US
[patent_app_date] => 1995-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_no_of_words] => 2787
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[pdf_file] => patents/06/448/06448169.pdf
[firstpage_image] =>[orig_patent_app_number] => 08576185
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/576185 | Apparatus and method for use in manufacturing semiconductor devices | Dec 20, 1995 | Issued |
| 08/574711 | CONSOLIDATED CHIP DESIGN FOR WIRE BOND AND FLIP-CHIP PACKAGE TECHNOLOGIES | Dec 20, 1995 | Abandoned |
Array
(
[id] => 3759544
[patent_doc_number] => 05851845
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-22
[patent_title] => 'Process for packaging a semiconductor die using dicing and testing'
[patent_app_type] => 1
[patent_app_number] => 8/574403
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[patent_app_date] => 1995-12-18
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[firstpage_image] =>[orig_patent_app_number] => 574403
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/574403 | Process for packaging a semiconductor die using dicing and testing | Dec 17, 1995 | Issued |
Array
(
[id] => 4097580
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-11
[patent_title] => 'Process for manufacture of composite semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 8/572275
[patent_app_country] => US
[patent_app_date] => 1995-12-13
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[firstpage_image] =>[orig_patent_app_number] => 572275
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/572275 | Process for manufacture of composite semiconductor devices | Dec 12, 1995 | Issued |
Array
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[id] => 3736331
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[pdf_file] => patents/05/842/05842257.pdf
[firstpage_image] =>[orig_patent_app_number] => 571594
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/571594 | Apparatus for and method of fabricating semiconductor devices | Dec 12, 1995 | Issued |
Array
(
[id] => 4006433
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Array
(
[id] => 3655877
[patent_doc_number] => 05667535
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[patent_kind] => NA
[patent_issue_date] => 1997-09-16
[patent_title] => 'Wafer drying apparatus with balancing mechanism for turntable therein'
[patent_app_type] => 1
[patent_app_number] => 8/569723
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/569723 | Wafer drying apparatus with balancing mechanism for turntable therein | Dec 7, 1995 | Issued |
| 08/567193 | METHOD OF PACKAGING FRAGILE DEVICES WITH A GEL MEDIUM CONFINED BY A RIM MEMBER | Dec 4, 1995 | Abandoned |
Array
(
[id] => 3794776
[patent_doc_number] => 05841188
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[patent_kind] => NA
[patent_issue_date] => 1998-11-24
[patent_title] => 'Tape carrier structure for a tape carrier package'
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[patent_app_country] => US
[patent_app_date] => 1995-11-24
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[pdf_file] => patents/05/841/05841188.pdf
[firstpage_image] =>[orig_patent_app_number] => 562511
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/562511 | Tape carrier structure for a tape carrier package | Nov 23, 1995 | Issued |
| 08/562575 | SUBSTRATE PROCESSING APPARATUS WITH NON-EVAPORABLE GETTER PUMP | Nov 23, 1995 | Abandoned |
Array
(
[id] => 3877090
[patent_doc_number] => 05804468
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/561421 | Process for manufacturing a packaged semiconductor having a divided leadframe stage | Nov 20, 1995 | Issued |
Array
(
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[patent_kind] => NA
[patent_issue_date] => 1999-09-07
[patent_title] => 'Detachment and removal of microscopic surface contaminants using a pulsed detach light'
[patent_app_type] => 1
[patent_app_number] => 8/559920
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Array
(
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