| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3768646
[patent_doc_number] => 05849607
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-15
[patent_title] => 'Process for attaching a lead frame to a semiconductor chip'
[patent_app_type] => 1
[patent_app_number] => 8/598849
[patent_app_country] => US
[patent_app_date] => 1996-02-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/05/849/05849607.pdf
[firstpage_image] =>[orig_patent_app_number] => 598849
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/598849 | Process for attaching a lead frame to a semiconductor chip | Feb 8, 1996 | Issued |
Array
(
[id] => 3731249
[patent_doc_number] => 05665649
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-09
[patent_title] => 'Process for forming a semiconductor device base array and mounting semiconductor devices thereon'
[patent_app_type] => 1
[patent_app_number] => 8/596589
[patent_app_country] => US
[patent_app_date] => 1996-02-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 17
[patent_no_of_words] => 5256
[patent_no_of_claims] => 11
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[pdf_file] => patents/05/665/05665649.pdf
[firstpage_image] =>[orig_patent_app_number] => 596589
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/596589 | Process for forming a semiconductor device base array and mounting semiconductor devices thereon | Feb 4, 1996 | Issued |
Array
(
[id] => 1458817
[patent_doc_number] => 06426273
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-30
[patent_title] => 'Preprocessing method of metal film forming process'
[patent_app_type] => B1
[patent_app_number] => 08/592543
[patent_app_country] => US
[patent_app_date] => 1996-01-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 11
[patent_no_of_words] => 4115
[patent_no_of_claims] => 7
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[pdf_file] => patents/06/426/06426273.pdf
[firstpage_image] =>[orig_patent_app_number] => 08592543
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/592543 | Preprocessing method of metal film forming process | Jan 25, 1996 | Issued |
Array
(
[id] => 3940314
[patent_doc_number] => 05954842
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-21
[patent_title] => 'Lead finger clamp assembly'
[patent_app_type] => 1
[patent_app_number] => 8/592058
[patent_app_country] => US
[patent_app_date] => 1996-01-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 9
[patent_no_of_words] => 4193
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 40
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/954/05954842.pdf
[firstpage_image] =>[orig_patent_app_number] => 592058
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/592058 | Lead finger clamp assembly | Jan 25, 1996 | Issued |
| 08/591365 | TEST AND TEAR-AWAY BOND PAD DESIGN | Jan 24, 1996 | Abandoned |
Array
(
[id] => 3722649
[patent_doc_number] => 05651798
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-07-29
[patent_title] => 'Workpiece monitoring process using a workpiece carrier having an identification code'
[patent_app_type] => 1
[patent_app_number] => 8/588565
[patent_app_country] => US
[patent_app_date] => 1996-01-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3743
[patent_no_of_claims] => 20
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[patent_words_short_claim] => 219
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/651/05651798.pdf
[firstpage_image] =>[orig_patent_app_number] => 588565
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/588565 | Workpiece monitoring process using a workpiece carrier having an identification code | Jan 17, 1996 | Issued |
Array
(
[id] => 3832044
[patent_doc_number] => 05712190
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-01-27
[patent_title] => 'Process for controlling distance between integrated circuit chips in an electronic module'
[patent_app_type] => 1
[patent_app_number] => 8/585579
[patent_app_country] => US
[patent_app_date] => 1996-01-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 3627
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[pdf_file] => patents/05/712/05712190.pdf
[firstpage_image] =>[orig_patent_app_number] => 585579
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/585579 | Process for controlling distance between integrated circuit chips in an electronic module | Jan 15, 1996 | Issued |
Array
(
[id] => 3694897
[patent_doc_number] => 05661086
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-08-26
[patent_title] => 'Process for manufacturing a plurality of strip lead frame semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 8/584299
[patent_app_country] => US
[patent_app_date] => 1996-01-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 13
[patent_no_of_words] => 7109
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 573
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/661/05661086.pdf
[firstpage_image] =>[orig_patent_app_number] => 584299
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/584299 | Process for manufacturing a plurality of strip lead frame semiconductor devices | Jan 10, 1996 | Issued |
Array
(
[id] => 3768577
[patent_doc_number] => 05849602
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-15
[patent_title] => 'Resist processing process'
[patent_app_type] => 1
[patent_app_number] => 8/582280
[patent_app_country] => US
[patent_app_date] => 1996-01-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 10
[patent_no_of_words] => 6150
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/849/05849602.pdf
[firstpage_image] =>[orig_patent_app_number] => 582280
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/582280 | Resist processing process | Jan 2, 1996 | Issued |
Array
(
[id] => 1381105
[patent_doc_number] => 06551845
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-04-22
[patent_title] => 'Method of temporarily securing a die to a burn-in carrier'
[patent_app_type] => B1
[patent_app_number] => 08/581905
[patent_app_country] => US
[patent_app_date] => 1996-01-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/06/551/06551845.pdf
[firstpage_image] =>[orig_patent_app_number] => 08581905
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/581905 | Method of temporarily securing a die to a burn-in carrier | Jan 1, 1996 | Issued |
Array
(
[id] => 4063623
[patent_doc_number] => 06008072
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-28
[patent_title] => 'Tape automated bonding method'
[patent_app_type] => 1
[patent_app_number] => 8/579511
[patent_app_country] => US
[patent_app_date] => 1995-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] => patents/06/008/06008072.pdf
[firstpage_image] =>[orig_patent_app_number] => 579511
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/579511 | Tape automated bonding method | Dec 26, 1995 | Issued |
Array
(
[id] => 3952531
[patent_doc_number] => 05940679
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-17
[patent_title] => 'Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage'
[patent_app_type] => 1
[patent_app_number] => 8/577485
[patent_app_country] => US
[patent_app_date] => 1995-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 12
[patent_no_of_words] => 3682
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/940/05940679.pdf
[firstpage_image] =>[orig_patent_app_number] => 577485
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/577485 | Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage | Dec 21, 1995 | Issued |
| 08/574711 | CONSOLIDATED CHIP DESIGN FOR WIRE BOND AND FLIP-CHIP PACKAGE TECHNOLOGIES | Dec 20, 1995 | Abandoned |
Array
(
[id] => 1578251
[patent_doc_number] => 06448169
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-10
[patent_title] => 'Apparatus and method for use in manufacturing semiconductor devices'
[patent_app_type] => B1
[patent_app_number] => 08/576185
[patent_app_country] => US
[patent_app_date] => 1995-12-21
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[pdf_file] => patents/06/448/06448169.pdf
[firstpage_image] =>[orig_patent_app_number] => 08576185
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/576185 | Apparatus and method for use in manufacturing semiconductor devices | Dec 20, 1995 | Issued |
Array
(
[id] => 3759544
[patent_doc_number] => 05851845
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-22
[patent_title] => 'Process for packaging a semiconductor die using dicing and testing'
[patent_app_type] => 1
[patent_app_number] => 8/574403
[patent_app_country] => US
[patent_app_date] => 1995-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[pdf_file] => patents/05/851/05851845.pdf
[firstpage_image] =>[orig_patent_app_number] => 574403
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/574403 | Process for packaging a semiconductor die using dicing and testing | Dec 17, 1995 | Issued |
Array
(
[id] => 4097580
[patent_doc_number] => 06048751
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-11
[patent_title] => 'Process for manufacture of composite semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 8/572275
[patent_app_country] => US
[patent_app_date] => 1995-12-13
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/048/06048751.pdf
[firstpage_image] =>[orig_patent_app_number] => 572275
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/572275 | Process for manufacture of composite semiconductor devices | Dec 12, 1995 | Issued |
Array
(
[id] => 3736331
[patent_doc_number] => 05842257
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-01
[patent_title] => 'Apparatus for and method of fabricating semiconductor devices'
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[patent_app_date] => 1995-12-13
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[pdf_file] => patents/05/842/05842257.pdf
[firstpage_image] =>[orig_patent_app_number] => 571594
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/571594 | Apparatus for and method of fabricating semiconductor devices | Dec 12, 1995 | Issued |
Array
(
[id] => 4006433
[patent_doc_number] => 05888847
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-30
[patent_title] => 'Technique for mounting a semiconductor die'
[patent_app_type] => 1
[patent_app_number] => 8/569501
[patent_app_country] => US
[patent_app_date] => 1995-12-08
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[pdf_file] => patents/05/888/05888847.pdf
[firstpage_image] =>[orig_patent_app_number] => 569501
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/569501 | Technique for mounting a semiconductor die | Dec 7, 1995 | Issued |
Array
(
[id] => 3655877
[patent_doc_number] => 05667535
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-16
[patent_title] => 'Wafer drying apparatus with balancing mechanism for turntable therein'
[patent_app_type] => 1
[patent_app_number] => 8/569723
[patent_app_country] => US
[patent_app_date] => 1995-12-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/05/667/05667535.pdf
[firstpage_image] =>[orig_patent_app_number] => 569723
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/569723 | Wafer drying apparatus with balancing mechanism for turntable therein | Dec 7, 1995 | Issued |
| 08/567193 | METHOD OF PACKAGING FRAGILE DEVICES WITH A GEL MEDIUM CONFINED BY A RIM MEMBER | Dec 4, 1995 | Abandoned |