David E. Graybill

Array ( [id] => 3794776 [patent_doc_number] => 05841188 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-24 [patent_title] => 'Tape carrier structure for a tape carrier package' [patent_app_type] => 1 [patent_app_number] => 8/562511 [patent_app_country] => US [patent_app_date] => 1995-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 3828 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/841/05841188.pdf [firstpage_image] =>[orig_patent_app_number] => 562511 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3877090 [patent_doc_number] => 05804468 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-08 [patent_title] => 'Process for manufacturing a packaged semiconductor having a divided leadframe stage' [patent_app_type] => 1 [patent_app_number] => 8/561421 [patent_app_country] => US [patent_app_date] => 1995-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 43 [patent_no_of_words] => 10040 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/804/05804468.pdf [firstpage_image] =>[orig_patent_app_number] => 561421 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3999268 [patent_doc_number] => 05950071 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-07 [patent_title] => 'Detachment and removal of microscopic surface contaminants using a pulsed detach light' [patent_app_type] => 1 [patent_app_number] => 8/559920 [patent_app_country] => US [patent_app_date] => 1995-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 2501 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/950/05950071.pdf [firstpage_image] =>[orig_patent_app_number] => 559920 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3589671 [patent_doc_number] => 05567648 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-10-22 [patent_title] => 'Process for providing interconnect bumps on a bonding pad by application of a sheet of conductive discs' [patent_app_type] => 1 [patent_app_number] => 8/552430 [patent_app_country] => US [patent_app_date] => 1995-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 1386 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/567/05567648.pdf [firstpage_image] =>[orig_patent_app_number] => 552430 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3607822 [patent_doc_number] => 05589402 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-12-31 [patent_title] => 'Process for manufacturing a package for mating with a bare semiconductor die' [patent_app_type] => 1 [patent_app_number] => 8/550416 [patent_app_country] => US [patent_app_date] => 1995-10-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 2846 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/589/05589402.pdf [firstpage_image] =>[orig_patent_app_number] => 550416 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4369669 [patent_doc_number] => 06287985 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-09-11 [patent_title] => 'Process for applying a molten droplet coating for integrated circuits' [patent_app_type] => 1 [patent_app_number] => 8/549350 [patent_app_country] => US [patent_app_date] => 1995-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2416 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/287/06287985.pdf [firstpage_image] =>[orig_patent_app_number] => 549350 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3926530 [patent_doc_number] => 05877093 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-02 [patent_title] => 'Process for coating an integrated circuit device with a molten spray' [patent_app_type] => 1 [patent_app_number] => 8/549351 [patent_app_country] => US [patent_app_date] => 1995-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 3144 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/877/05877093.pdf [firstpage_image] =>[orig_patent_app_number] => 549351 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3768071 [patent_doc_number] => 05817156 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-06 [patent_title] => 'Substrate heat treatment table apparatus' [patent_app_type] => 1 [patent_app_number] => 8/548151 [patent_app_country] => US [patent_app_date] => 1995-10-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 6437 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/817/05817156.pdf [firstpage_image] =>[orig_patent_app_number] => 548151 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3687181 [patent_doc_number] => 05643831 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-07-01 [patent_title] => 'Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/547532 [patent_app_country] => US [patent_app_date] => 1995-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 27 [patent_no_of_words] => 4119 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/643/05643831.pdf [firstpage_image] =>[orig_patent_app_number] => 547532 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4226545 [patent_doc_number] => 06074442 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-06-13 [patent_title] => 'Method of separating slice base mounting member from wafer and jig adapted therefor' [patent_app_type] => 1 [patent_app_number] => 8/547107 [patent_app_country] => US [patent_app_date] => 1995-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 19 [patent_no_of_words] => 6226 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/074/06074442.pdf [firstpage_image] =>[orig_patent_app_number] => 547107 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3731278 [patent_doc_number] => 05665651 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-09-09 [patent_title] => 'Process for encapsulating a semiconductor device and lead frame' [patent_app_type] => 1 [patent_app_number] => 8/545179 [patent_app_country] => US [patent_app_date] => 1995-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 20 [patent_no_of_words] => 5867 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/665/05665651.pdf [firstpage_image] =>[orig_patent_app_number] => 545179 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3866287 [patent_doc_number] => 05824119 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-20 [patent_title] => 'Process for immersing a substrate in a plurality of processing baths' [patent_app_type] => 1 [patent_app_number] => 8/539202 [patent_app_country] => US [patent_app_date] => 1995-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 50 [patent_no_of_words] => 15583 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/824/05824119.pdf [firstpage_image] =>[orig_patent_app_number] => 539202 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3896231 [patent_doc_number] => 05897337 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-27 [patent_title] => 'Process for adhesively bonding a semiconductor chip to a carrier film' [patent_app_type] => 1 [patent_app_number] => 8/533205 [patent_app_country] => US [patent_app_date] => 1995-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 54 [patent_no_of_words] => 8927 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/897/05897337.pdf [firstpage_image] =>[orig_patent_app_number] => 533205 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3941913 [patent_doc_number] => 05946553 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-31 [patent_title] => 'Process for manufacturing a semiconductor package with bi-substrate die' [patent_app_type] => 1 [patent_app_number] => 8/533373 [patent_app_country] => US [patent_app_date] => 1995-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 19 [patent_no_of_words] => 5562 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/946/05946553.pdf [firstpage_image] =>[orig_patent_app_number] => 533373 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3771560 [patent_doc_number] => 05807766 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-15 [patent_title] => 'Process for attaching a silicon chip to a circuit board using a block of encapsulated wires and the block of wires manufactured by the process' [patent_app_type] => 1 [patent_app_number] => 8/531814 [patent_app_country] => US [patent_app_date] => 1995-09-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 2236 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/807/05807766.pdf [firstpage_image] =>[orig_patent_app_number] => 531814 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3824666 [patent_doc_number] => 05731243 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-03-24 [patent_title] => 'Method of cleaning residue on a semiconductor wafer bonding pad' [patent_app_type] => 1 [patent_app_number] => 8/523775 [patent_app_country] => US [patent_app_date] => 1995-09-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 2322 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/731/05731243.pdf [firstpage_image] =>[orig_patent_app_number] => 523775 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3735296 [patent_doc_number] => 05716218 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-02-10 [patent_title] => 'Process for manufacturing an interconnect for testing a semiconductor die' [patent_app_type] => 1 [patent_app_number] => 8/524018 [patent_app_country] => US [patent_app_date] => 1995-09-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 23 [patent_no_of_words] => 5614 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/716/05716218.pdf [firstpage_image] =>[orig_patent_app_number] => 524018 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3694280 [patent_doc_number] => 05661042 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-08-26 [patent_title] => 'Process for electrically connecting electrical devices using a conductive anisotropic material' [patent_app_type] => 1 [patent_app_number] => 8/520118 [patent_app_country] => US [patent_app_date] => 1995-08-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 2967 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/661/05661042.pdf [firstpage_image] =>[orig_patent_app_number] => 520118 [rel_patent_id] =>[rel_patent_doc_number] =>)