| Application number | Title of the application | Filing Date | Status |
|---|
Array
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[patent_doc_number] => 05811317
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[patent_kind] => NA
[patent_issue_date] => 1998-09-22
[patent_title] => 'Process for reflow bonding a semiconductor die to a substrate and the product produced by the product'
[patent_app_type] => 1
[patent_app_number] => 8/519561
[patent_app_country] => US
[patent_app_date] => 1995-08-25
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[pdf_file] => patents/05/811/05811317.pdf
[firstpage_image] =>[orig_patent_app_number] => 519561
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/519561 | Process for reflow bonding a semiconductor die to a substrate and the product produced by the product | Aug 24, 1995 | Issued |
Array
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[id] => 3885756
[patent_doc_number] => 05893723
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-13
[patent_title] => 'Manufacturing method for semiconductor unit'
[patent_app_type] => 1
[patent_app_number] => 8/519353
[patent_app_country] => US
[patent_app_date] => 1995-08-25
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[pdf_file] => patents/05/893/05893723.pdf
[firstpage_image] =>[orig_patent_app_number] => 519353
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/519353 | Manufacturing method for semiconductor unit | Aug 24, 1995 | Issued |
Array
(
[id] => 1485340
[patent_doc_number] => 06365500
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-02
[patent_title] => 'Composite bump bonding'
[patent_app_type] => B1
[patent_app_number] => 08/518182
[patent_app_country] => US
[patent_app_date] => 1995-08-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/06/365/06365500.pdf
[firstpage_image] =>[orig_patent_app_number] => 08518182
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/518182 | Composite bump bonding | Aug 22, 1995 | Issued |
| 08/517670 | TAPE AUTOMATED BONDING CIRCUIT WITH INTERIOR SPROCKET HOLES | Aug 21, 1995 | Abandoned |
Array
(
[id] => 1454504
[patent_doc_number] => 06425168
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-30
[patent_title] => 'Quartz glass jig for heat-treating semiconductor wafers and method for producing same'
[patent_app_type] => B1
[patent_app_number] => 08/531023
[patent_app_country] => US
[patent_app_date] => 1995-08-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/06/425/06425168.pdf
[firstpage_image] =>[orig_patent_app_number] => 08531023
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/531023 | Quartz glass jig for heat-treating semiconductor wafers and method for producing same | Aug 19, 1995 | Issued |
| 08/648165 | CLEANING APPARATUS, SEMICONDUCTOR PRODUCTION EQUIPMENT, AND SEMICONDUCTOR PRODUCTION LINE | Aug 18, 1995 | Abandoned |
Array
(
[id] => 4085019
[patent_doc_number] => 06025258
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-15
[patent_title] => 'Method for fabricating solder bumps by forming solder balls with a solder ball forming member'
[patent_app_type] => 1
[patent_app_number] => 8/516284
[patent_app_country] => US
[patent_app_date] => 1995-08-17
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[firstpage_image] =>[orig_patent_app_number] => 516284
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/516284 | Method for fabricating solder bumps by forming solder balls with a solder ball forming member | Aug 16, 1995 | Issued |
Array
(
[id] => 3740362
[patent_doc_number] => 05786237
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-07-28
[patent_title] => 'Method for forming a monolithic electronic module by stacking planar arrays of integrated circuit chips'
[patent_app_type] => 1
[patent_app_number] => 8/515611
[patent_app_country] => US
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Array
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[id] => 3722632
[patent_doc_number] => 05651797
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-07-29
[patent_title] => 'Apparatus and method for the immersion cleaning and transport of semiconductor components'
[patent_app_type] => 1
[patent_app_number] => 8/511975
[patent_app_country] => US
[patent_app_date] => 1995-08-07
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[pdf_file] => patents/05/651/05651797.pdf
[firstpage_image] =>[orig_patent_app_number] => 511975
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/511975 | Apparatus and method for the immersion cleaning and transport of semiconductor components | Aug 6, 1995 | Issued |
Array
(
[id] => 3876694
[patent_doc_number] => 05728599
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-03-17
[patent_title] => 'Printable superconductive leadframes for semiconductor device assembly'
[patent_app_type] => 1
[patent_app_number] => 8/432539
[patent_app_country] => US
[patent_app_date] => 1995-08-07
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[pdf_file] => patents/05/728/05728599.pdf
[firstpage_image] =>[orig_patent_app_number] => 432539
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/432539 | Printable superconductive leadframes for semiconductor device assembly | Aug 6, 1995 | Issued |
Array
(
[id] => 3938387
[patent_doc_number] => 05872051
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-02-16
[patent_title] => 'Process for transferring material to semiconductor chip conductive pads using a transfer substrate'
[patent_app_type] => 1
[patent_app_number] => 8/510401
[patent_app_country] => US
[patent_app_date] => 1995-08-02
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[firstpage_image] =>[orig_patent_app_number] => 510401
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/510401 | Process for transferring material to semiconductor chip conductive pads using a transfer substrate | Aug 1, 1995 | Issued |
Array
(
[id] => 3824353
[patent_doc_number] => 05731222
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-03-24
[patent_title] => 'Externally connected thin electronic circuit having recessed bonding pads'
[patent_app_type] => 1
[patent_app_number] => 8/509849
[patent_app_country] => US
[patent_app_date] => 1995-08-01
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[pdf_file] => patents/05/731/05731222.pdf
[firstpage_image] =>[orig_patent_app_number] => 509849
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/509849 | Externally connected thin electronic circuit having recessed bonding pads | Jul 31, 1995 | Issued |
Array
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[id] => 3627284
[patent_doc_number] => 05686352
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-11-11
[patent_title] => 'Method for making a tab semiconductor device with self-aligning cavity and intrinsic standoff'
[patent_app_type] => 1
[patent_app_number] => 8/509442
[patent_app_country] => US
[patent_app_date] => 1995-07-31
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[firstpage_image] =>[orig_patent_app_number] => 509442
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/509442 | Method for making a tab semiconductor device with self-aligning cavity and intrinsic standoff | Jul 30, 1995 | Issued |
Array
(
[id] => 3867222
[patent_doc_number] => 05837562
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-11-17
[patent_title] => 'Process for bonding a shell to a substrate for packaging a semiconductor'
[patent_app_type] => 1
[patent_app_number] => 8/499411
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[patent_app_date] => 1995-07-07
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/499411 | Process for bonding a shell to a substrate for packaging a semiconductor | Jul 6, 1995 | Issued |
| 08/433403 | LOCAL HARDENING METHOD OF A SEMICONDUCTOR INTEGRATED CIRCUIT | Jul 5, 1995 | Abandoned |
Array
(
[id] => 3614495
[patent_doc_number] => 05593465
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-01-14
[patent_title] => 'Mounting for carrier bodies in an apparatus for the deposition of semiconductor material'
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[firstpage_image] =>[orig_patent_app_number] => 490303
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/490303 | Mounting for carrier bodies in an apparatus for the deposition of semiconductor material | Jun 13, 1995 | Issued |
Array
(
[id] => 3647339
[patent_doc_number] => 05683943
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-11-04
[patent_title] => 'Process for etching a semiconductor lead frame'
[patent_app_type] => 1
[patent_app_number] => 8/489319
[patent_app_country] => US
[patent_app_date] => 1995-06-12
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 489319
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/489319 | Process for etching a semiconductor lead frame | Jun 11, 1995 | Issued |
| 08/484813 | LEAD FRAME FOR INTEGRATED CIRCUITS | Jun 6, 1995 | Abandoned |
Array
(
[id] => 4007037
[patent_doc_number] => 05888889
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-30
[patent_title] => 'Integrated structure pad assembly for lead bonding'
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[firstpage_image] =>[orig_patent_app_number] => 483315
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/483315 | Integrated structure pad assembly for lead bonding | Jun 6, 1995 | Issued |
Array
(
[id] => 3649462
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[patent_kind] => NA
[patent_issue_date] => 1997-02-25
[patent_title] => 'Device packaging using heat spreaders and assisted deposition of wire bonds'
[patent_app_type] => 1
[patent_app_number] => 8/472103
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