| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3657701
[patent_doc_number] => 05591649
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-01-07
[patent_title] => 'Process of removing a tape automated bonded semiconductor from bonded leads'
[patent_app_type] => 1
[patent_app_number] => 8/375462
[patent_app_country] => US
[patent_app_date] => 1995-01-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/05/591/05591649.pdf
[firstpage_image] =>[orig_patent_app_number] => 375462
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/375462 | Process of removing a tape automated bonded semiconductor from bonded leads | Jan 18, 1995 | Issued |
| 08/372363 | METAL PLANE SUPPORT FOR MULTI-LAYER LEAD FRAMES AND A PROCESS FOR MANUFACTURING SUCH FRAMES | Jan 12, 1995 | Abandoned |
Array
(
[id] => 4348850
[patent_doc_number] => 06190424
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-02-20
[patent_title] => 'Process for fabricating two different types of wafers in a semiconductor wafer production line'
[patent_app_type] => 1
[patent_app_number] => 8/371139
[patent_app_country] => US
[patent_app_date] => 1995-01-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 5581
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 125
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/190/06190424.pdf
[firstpage_image] =>[orig_patent_app_number] => 371139
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/371139 | Process for fabricating two different types of wafers in a semiconductor wafer production line | Jan 10, 1995 | Issued |
| 08/366357 | LINEWIDTH METROLOGY OF INTEGRATED CIRCUIT STRUCTURES | Dec 28, 1994 | Abandoned |
Array
(
[id] => 3594535
[patent_doc_number] => 05533243
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-09
[patent_title] => 'Notch position aligning apparatus and process for using the apparatus to independently align individual wafers in a wafer cassette'
[patent_app_type] => 1
[patent_app_number] => 8/365429
[patent_app_country] => US
[patent_app_date] => 1994-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 10
[patent_no_of_words] => 4270
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 221
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/533/05533243.pdf
[firstpage_image] =>[orig_patent_app_number] => 365429
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/365429 | Notch position aligning apparatus and process for using the apparatus to independently align individual wafers in a wafer cassette | Dec 27, 1994 | Issued |
Array
(
[id] => 3824381
[patent_doc_number] => 05731224
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-03-24
[patent_title] => 'Method for manufacturing ohmic contacts for compound semiconductors'
[patent_app_type] => 1
[patent_app_number] => 8/365243
[patent_app_country] => US
[patent_app_date] => 1994-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 2012
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 101
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/731/05731224.pdf
[firstpage_image] =>[orig_patent_app_number] => 365243
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/365243 | Method for manufacturing ohmic contacts for compound semiconductors | Dec 27, 1994 | Issued |
| 08/364087 | INTEGRATED CIRCUIT PACKAGE ENCAPSULATED BY FIBER LADEN MOLDING MATERIAL AND ITS METHOD OF MANUFACTURING | Dec 26, 1994 | Abandoned |
Array
(
[id] => 3597958
[patent_doc_number] => 05559051
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-09-24
[patent_title] => 'Process for manufacturing a silicon chip with an integrated magnetoresistive head mounted on a slider'
[patent_app_type] => 1
[patent_app_number] => 8/363465
[patent_app_country] => US
[patent_app_date] => 1994-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 32
[patent_no_of_words] => 4332
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 182
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/559/05559051.pdf
[firstpage_image] =>[orig_patent_app_number] => 363465
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/363465 | Process for manufacturing a silicon chip with an integrated magnetoresistive head mounted on a slider | Dec 22, 1994 | Issued |
Array
(
[id] => 3423575
[patent_doc_number] => 05459081
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-10-17
[patent_title] => 'Process for transferring a device to a substrate by viewing a registration pattern'
[patent_app_type] => 1
[patent_app_number] => 8/357935
[patent_app_country] => US
[patent_app_date] => 1994-12-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/05/459/05459081.pdf
[firstpage_image] =>[orig_patent_app_number] => 357935
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/357935 | Process for transferring a device to a substrate by viewing a registration pattern | Dec 15, 1994 | Issued |
Array
(
[id] => 3495956
[patent_doc_number] => 05532187
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-02
[patent_title] => 'Process for sealing apertures in glass-silicon-glass micromechanical acceleration sensors'
[patent_app_type] => 1
[patent_app_number] => 8/357801
[patent_app_country] => US
[patent_app_date] => 1994-12-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 2467
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 172
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/532/05532187.pdf
[firstpage_image] =>[orig_patent_app_number] => 357801
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/357801 | Process for sealing apertures in glass-silicon-glass micromechanical acceleration sensors | Dec 15, 1994 | Issued |
Array
(
[id] => 3924220
[patent_doc_number] => 05972051
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-10-26
[patent_title] => 'Method and apparatus for removing particles from semiconductor wafer edges using a particle withdrawing means'
[patent_app_type] => 1
[patent_app_number] => 8/357086
[patent_app_country] => US
[patent_app_date] => 1994-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 5164
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 114
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/972/05972051.pdf
[firstpage_image] =>[orig_patent_app_number] => 357086
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/357086 | Method and apparatus for removing particles from semiconductor wafer edges using a particle withdrawing means | Dec 14, 1994 | Issued |
Array
(
[id] => 3687157
[patent_doc_number] => 05643829
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-07-01
[patent_title] => 'Method for the fabrication of multilayer electroluminescence device'
[patent_app_type] => 1
[patent_app_number] => 8/355777
[patent_app_country] => US
[patent_app_date] => 1994-12-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 6
[patent_no_of_words] => 3182
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/643/05643829.pdf
[firstpage_image] =>[orig_patent_app_number] => 355777
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/355777 | Method for the fabrication of multilayer electroluminescence device | Dec 13, 1994 | Issued |
| 08/354261 | INTEGRATED CIRCUIT WITH LEAD FRAME PACKAGE HAVING INTERNAL POWER AND GROUND BUSSES | Dec 11, 1994 | Abandoned |
| 08/352403 | CIRCUIT IDENTIFIER FOR USE WITH FOCUSED ION BEAM EQUIPMENT | Dec 7, 1994 | Abandoned |
| 08/351761 | PROCESS FOR FABRICATING AN ELECTRONIC CIRCUIT PACKAGE | Dec 7, 1994 | Abandoned |
| 08/352301 | METHOD AND APPARATUS FOR IN-SITU TESTING OF INTEGRATED CIRCUIT CHIPS | Dec 7, 1994 | Abandoned |
Array
(
[id] => 3492101
[patent_doc_number] => 05536677
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-16
[patent_title] => 'Method of forming conductive bumps on a semiconductor device using a double mask structure'
[patent_app_type] => 1
[patent_app_number] => 8/348009
[patent_app_country] => US
[patent_app_date] => 1994-12-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 5053
[patent_no_of_claims] => 17
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/536/05536677.pdf
[firstpage_image] =>[orig_patent_app_number] => 348009
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/348009 | Method of forming conductive bumps on a semiconductor device using a double mask structure | Nov 30, 1994 | Issued |
Array
(
[id] => 3506203
[patent_doc_number] => 05569625
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-29
[patent_title] => 'Process for manufacturing a plural stacked leadframe semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/345755
[patent_app_country] => US
[patent_app_date] => 1994-11-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[pdf_file] => patents/05/569/05569625.pdf
[firstpage_image] =>[orig_patent_app_number] => 345755
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/345755 | Process for manufacturing a plural stacked leadframe semiconductor device | Nov 21, 1994 | Issued |
| 08/340727 | LEADFRAME WITH ALIGNMENT FEATURE, SEMICONDUCTOR DEVICES EMPLOYING THE LEADFRAME, AND MOUNTING THE DEVICES TO PRINTED WIRING BOARDS | Nov 15, 1994 | Abandoned |
Array
(
[id] => 3876708
[patent_doc_number] => 05728600
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-03-17
[patent_title] => 'Circuit encapsulation process'
[patent_app_type] => 1
[patent_app_number] => 8/340162
[patent_app_country] => US
[patent_app_date] => 1994-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 28
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/728/05728600.pdf
[firstpage_image] =>[orig_patent_app_number] => 340162
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/340162 | Circuit encapsulation process | Nov 14, 1994 | Issued |