| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3509484
[patent_doc_number] => 05563076
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-08
[patent_title] => 'Process for adjusting heights of plural semiconductor devices on a circuit board'
[patent_app_type] => 1
[patent_app_number] => 8/315263
[patent_app_country] => US
[patent_app_date] => 1994-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 12
[patent_no_of_words] => 2656
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 187
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/563/05563076.pdf
[firstpage_image] =>[orig_patent_app_number] => 315263
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/315263 | Process for adjusting heights of plural semiconductor devices on a circuit board | Sep 28, 1994 | Issued |
| 08/306455 | METALLIZATION AND BONDING PROCESS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES | Sep 14, 1994 | Abandoned |
Array
(
[id] => 3589734
[patent_doc_number] => 05567653
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-22
[patent_title] => 'Process for aligning etch masks on an integrated circuit surface using electromagnetic energy'
[patent_app_type] => 1
[patent_app_number] => 8/306042
[patent_app_country] => US
[patent_app_date] => 1994-09-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 14
[patent_no_of_words] => 3723
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 164
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/567/05567653.pdf
[firstpage_image] =>[orig_patent_app_number] => 306042
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/306042 | Process for aligning etch masks on an integrated circuit surface using electromagnetic energy | Sep 13, 1994 | Issued |
Array
(
[id] => 3561345
[patent_doc_number] => 05525548
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-06-11
[patent_title] => 'Process of fixing a heat sink to a semiconductor chip and package cap'
[patent_app_type] => 1
[patent_app_number] => 8/301431
[patent_app_country] => US
[patent_app_date] => 1994-09-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 22
[patent_no_of_words] => 7861
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 150
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/525/05525548.pdf
[firstpage_image] =>[orig_patent_app_number] => 301431
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/301431 | Process of fixing a heat sink to a semiconductor chip and package cap | Sep 8, 1994 | Issued |
Array
(
[id] => 3591511
[patent_doc_number] => 05521122
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-05-28
[patent_title] => 'Process of manufacturing a multichip module using a temporary support base'
[patent_app_type] => 1
[patent_app_number] => 8/297559
[patent_app_country] => US
[patent_app_date] => 1994-08-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 17
[patent_no_of_words] => 5523
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 120
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/521/05521122.pdf
[firstpage_image] =>[orig_patent_app_number] => 297559
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/297559 | Process of manufacturing a multichip module using a temporary support base | Aug 30, 1994 | Issued |
| 08/297065 | INTERCONNECT BUMP APPARATUS AND METHOD FOR FORMING SAME | Aug 28, 1994 | Abandoned |
Array
(
[id] => 3448227
[patent_doc_number] => 05424254
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-06-13
[patent_title] => 'Process for recovering bare semiconductor chips from plastic packaged modules by thermal shock'
[patent_app_type] => 1
[patent_app_number] => 8/296399
[patent_app_country] => US
[patent_app_date] => 1994-08-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3940
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 200
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/424/05424254.pdf
[firstpage_image] =>[orig_patent_app_number] => 296399
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/296399 | Process for recovering bare semiconductor chips from plastic packaged modules by thermal shock | Aug 25, 1994 | Issued |
| 08/295415 | SEMICONDUCTOR DEVICE AND PROCESS OF PRODUCING SAME | Aug 24, 1994 | Abandoned |
Array
(
[id] => 3601780
[patent_doc_number] => 05578532
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-11-26
[patent_title] => 'Wafer surface protection in a gas deposition process'
[patent_app_type] => 1
[patent_app_number] => 8/294514
[patent_app_country] => US
[patent_app_date] => 1994-08-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 12
[patent_no_of_words] => 7511
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 110
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/578/05578532.pdf
[firstpage_image] =>[orig_patent_app_number] => 294514
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/294514 | Wafer surface protection in a gas deposition process | Aug 22, 1994 | Issued |
| 08/294183 | PACKAGING FOR A SEMICONDUCTOR DEVICE | Aug 21, 1994 | Abandoned |
Array
(
[id] => 3456031
[patent_doc_number] => 05401672
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-03-28
[patent_title] => 'Process of bonding semiconductor wafers having conductive semiconductor material extending through each wafer at the bond areas'
[patent_app_type] => 1
[patent_app_number] => 8/292097
[patent_app_country] => US
[patent_app_date] => 1994-08-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 2307
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/401/05401672.pdf
[firstpage_image] =>[orig_patent_app_number] => 292097
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/292097 | Process of bonding semiconductor wafers having conductive semiconductor material extending through each wafer at the bond areas | Aug 16, 1994 | Issued |
Array
(
[id] => 3554932
[patent_doc_number] => 05543363
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-08-06
[patent_title] => 'Process for adhesively attaching a semiconductor device to an electrode plate'
[patent_app_type] => 1
[patent_app_number] => 8/291753
[patent_app_country] => US
[patent_app_date] => 1994-08-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 34
[patent_figures_cnt] => 47
[patent_no_of_words] => 11623
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 307
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/543/05543363.pdf
[firstpage_image] =>[orig_patent_app_number] => 291753
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/291753 | Process for adhesively attaching a semiconductor device to an electrode plate | Aug 15, 1994 | Issued |
Array
(
[id] => 3869755
[patent_doc_number] => 05763296
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-09
[patent_title] => 'Method for fabricating an electronic device structure with studs locating lead frame on backing plate'
[patent_app_type] => 1
[patent_app_number] => 8/289773
[patent_app_country] => US
[patent_app_date] => 1994-08-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 4
[patent_no_of_words] => 2349
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 221
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/763/05763296.pdf
[firstpage_image] =>[orig_patent_app_number] => 289773
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/289773 | Method for fabricating an electronic device structure with studs locating lead frame on backing plate | Aug 11, 1994 | Issued |
Array
(
[id] => 3729966
[patent_doc_number] => 05701031
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-23
[patent_title] => 'Sealed stacked arrangement of semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 8/280381
[patent_app_country] => US
[patent_app_date] => 1994-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 45
[patent_figures_cnt] => 67
[patent_no_of_words] => 25331
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 327
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/701/05701031.pdf
[firstpage_image] =>[orig_patent_app_number] => 280381
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/280381 | Sealed stacked arrangement of semiconductor devices | Jul 24, 1994 | Issued |
Array
(
[id] => 4397968
[patent_doc_number] => 06171350
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-09
[patent_title] => 'Apparatus for mounting electronic parts to a mounting body'
[patent_app_type] => 1
[patent_app_number] => 8/277013
[patent_app_country] => US
[patent_app_date] => 1994-07-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 13
[patent_no_of_words] => 5640
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 215
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/171/06171350.pdf
[firstpage_image] =>[orig_patent_app_number] => 277013
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/277013 | Apparatus for mounting electronic parts to a mounting body | Jul 18, 1994 | Issued |
Array
(
[id] => 3656261
[patent_doc_number] => 05622897
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-04-22
[patent_title] => 'Process of manufacturing a drop-on-demand ink jet printhead having thermoelectric temperature control means'
[patent_app_type] => 1
[patent_app_number] => 8/272145
[patent_app_country] => US
[patent_app_date] => 1994-07-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 11
[patent_no_of_words] => 9622
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 107
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/622/05622897.pdf
[firstpage_image] =>[orig_patent_app_number] => 272145
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/272145 | Process of manufacturing a drop-on-demand ink jet printhead having thermoelectric temperature control means | Jul 7, 1994 | Issued |
Array
(
[id] => 3458962
[patent_doc_number] => 05441907
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-08-15
[patent_title] => 'Process for manufacturing a plug-diode mask ROM'
[patent_app_type] => 1
[patent_app_number] => 8/266505
[patent_app_country] => US
[patent_app_date] => 1994-06-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 2702
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 157
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/441/05441907.pdf
[firstpage_image] =>[orig_patent_app_number] => 266505
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/266505 | Process for manufacturing a plug-diode mask ROM | Jun 26, 1994 | Issued |
Array
(
[id] => 3442772
[patent_doc_number] => 05423889
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-06-13
[patent_title] => 'Process for manufacturing a multi-port adhesive dispensing tool'
[patent_app_type] => 1
[patent_app_number] => 8/265355
[patent_app_country] => US
[patent_app_date] => 1994-06-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 11
[patent_no_of_words] => 3096
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 225
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/423/05423889.pdf
[firstpage_image] =>[orig_patent_app_number] => 265355
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/265355 | Process for manufacturing a multi-port adhesive dispensing tool | Jun 23, 1994 | Issued |
Array
(
[id] => 3727265
[patent_doc_number] => 05670429
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-23
[patent_title] => 'Process of conveying an encapsulated electronic component by engaging an integral resin projection'
[patent_app_type] => 1
[patent_app_number] => 8/260047
[patent_app_country] => US
[patent_app_date] => 1994-06-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 3591
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/670/05670429.pdf
[firstpage_image] =>[orig_patent_app_number] => 260047
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/260047 | Process of conveying an encapsulated electronic component by engaging an integral resin projection | Jun 15, 1994 | Issued |
Array
(
[id] => 4097621
[patent_doc_number] => 06048754
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-11
[patent_title] => 'Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package'
[patent_app_type] => 1
[patent_app_number] => 8/260977
[patent_app_country] => US
[patent_app_date] => 1994-06-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 4357
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 129
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/048/06048754.pdf
[firstpage_image] =>[orig_patent_app_number] => 260977
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/260977 | Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package | Jun 14, 1994 | Issued |