Search

David E. Graybill

Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )

Most Active Art Unit
2894
Art Unit(s)
2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3556688 [patent_doc_number] => 05502002 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-03-26 [patent_title] => 'Polyimide passivation of GaAs microwave monolithic integrated circuit flip-chip' [patent_app_type] => 1 [patent_app_number] => 8/317983 [patent_app_country] => US [patent_app_date] => 1994-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2742 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 384 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/502/05502002.pdf [firstpage_image] =>[orig_patent_app_number] => 317983 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/317983
Polyimide passivation of GaAs microwave monolithic integrated circuit flip-chip Oct 3, 1994 Issued
Array ( [id] => 3694823 [patent_doc_number] => 05661081 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-08-26 [patent_title] => 'Method of bonding an aluminum wire to an intergrated circuit bond pad' [patent_app_type] => 1 [patent_app_number] => 8/316083 [patent_app_country] => US [patent_app_date] => 1994-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 2357 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/661/05661081.pdf [firstpage_image] =>[orig_patent_app_number] => 316083 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/316083
Method of bonding an aluminum wire to an intergrated circuit bond pad Sep 29, 1994 Issued
Array ( [id] => 3941210 [patent_doc_number] => 05989934 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-23 [patent_title] => 'Process for manufacturing a semiconductor device having a logic circuit and a plurality of input/output amplifier circuits' [patent_app_type] => 1 [patent_app_number] => 8/315619 [patent_app_country] => US [patent_app_date] => 1994-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 3539 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/989/05989934.pdf [firstpage_image] =>[orig_patent_app_number] => 315619 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/315619
Process for manufacturing a semiconductor device having a logic circuit and a plurality of input/output amplifier circuits Sep 29, 1994 Issued
08/316247 TWO-POLE SMT MINIATURE HOUSING FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE MANUFACTURE THEREOF Sep 29, 1994 Abandoned
Array ( [id] => 3739096 [patent_doc_number] => 05753535 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-19 [patent_title] => 'Leadframe and resin-sealed semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/314269 [patent_app_country] => US [patent_app_date] => 1994-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 15 [patent_no_of_words] => 3822 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 259 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/753/05753535.pdf [firstpage_image] =>[orig_patent_app_number] => 314269 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/314269
Leadframe and resin-sealed semiconductor device Sep 29, 1994 Issued
Array ( [id] => 3509484 [patent_doc_number] => 05563076 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-10-08 [patent_title] => 'Process for adjusting heights of plural semiconductor devices on a circuit board' [patent_app_type] => 1 [patent_app_number] => 8/315263 [patent_app_country] => US [patent_app_date] => 1994-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 12 [patent_no_of_words] => 2656 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 187 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/563/05563076.pdf [firstpage_image] =>[orig_patent_app_number] => 315263 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/315263
Process for adjusting heights of plural semiconductor devices on a circuit board Sep 28, 1994 Issued
08/306455 METALLIZATION AND BONDING PROCESS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES Sep 14, 1994 Abandoned
Array ( [id] => 3589734 [patent_doc_number] => 05567653 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-10-22 [patent_title] => 'Process for aligning etch masks on an integrated circuit surface using electromagnetic energy' [patent_app_type] => 1 [patent_app_number] => 8/306042 [patent_app_country] => US [patent_app_date] => 1994-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 3723 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/567/05567653.pdf [firstpage_image] =>[orig_patent_app_number] => 306042 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/306042
Process for aligning etch masks on an integrated circuit surface using electromagnetic energy Sep 13, 1994 Issued
Array ( [id] => 3561345 [patent_doc_number] => 05525548 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-06-11 [patent_title] => 'Process of fixing a heat sink to a semiconductor chip and package cap' [patent_app_type] => 1 [patent_app_number] => 8/301431 [patent_app_country] => US [patent_app_date] => 1994-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 22 [patent_no_of_words] => 7861 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/525/05525548.pdf [firstpage_image] =>[orig_patent_app_number] => 301431 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/301431
Process of fixing a heat sink to a semiconductor chip and package cap Sep 8, 1994 Issued
Array ( [id] => 3591511 [patent_doc_number] => 05521122 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-05-28 [patent_title] => 'Process of manufacturing a multichip module using a temporary support base' [patent_app_type] => 1 [patent_app_number] => 8/297559 [patent_app_country] => US [patent_app_date] => 1994-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 17 [patent_no_of_words] => 5523 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/521/05521122.pdf [firstpage_image] =>[orig_patent_app_number] => 297559 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/297559
Process of manufacturing a multichip module using a temporary support base Aug 30, 1994 Issued
08/297065 INTERCONNECT BUMP APPARATUS AND METHOD FOR FORMING SAME Aug 28, 1994 Abandoned
Array ( [id] => 3448227 [patent_doc_number] => 05424254 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-06-13 [patent_title] => 'Process for recovering bare semiconductor chips from plastic packaged modules by thermal shock' [patent_app_type] => 1 [patent_app_number] => 8/296399 [patent_app_country] => US [patent_app_date] => 1994-08-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3940 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/424/05424254.pdf [firstpage_image] =>[orig_patent_app_number] => 296399 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/296399
Process for recovering bare semiconductor chips from plastic packaged modules by thermal shock Aug 25, 1994 Issued
08/295415 SEMICONDUCTOR DEVICE AND PROCESS OF PRODUCING SAME Aug 24, 1994 Abandoned
Array ( [id] => 3601780 [patent_doc_number] => 05578532 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-11-26 [patent_title] => 'Wafer surface protection in a gas deposition process' [patent_app_type] => 1 [patent_app_number] => 8/294514 [patent_app_country] => US [patent_app_date] => 1994-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 12 [patent_no_of_words] => 7511 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/578/05578532.pdf [firstpage_image] =>[orig_patent_app_number] => 294514 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/294514
Wafer surface protection in a gas deposition process Aug 22, 1994 Issued
08/294183 PACKAGING FOR A SEMICONDUCTOR DEVICE Aug 21, 1994 Abandoned
Array ( [id] => 3456031 [patent_doc_number] => 05401672 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-03-28 [patent_title] => 'Process of bonding semiconductor wafers having conductive semiconductor material extending through each wafer at the bond areas' [patent_app_type] => 1 [patent_app_number] => 8/292097 [patent_app_country] => US [patent_app_date] => 1994-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 2307 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/401/05401672.pdf [firstpage_image] =>[orig_patent_app_number] => 292097 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/292097
Process of bonding semiconductor wafers having conductive semiconductor material extending through each wafer at the bond areas Aug 16, 1994 Issued
Array ( [id] => 3554932 [patent_doc_number] => 05543363 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-08-06 [patent_title] => 'Process for adhesively attaching a semiconductor device to an electrode plate' [patent_app_type] => 1 [patent_app_number] => 8/291753 [patent_app_country] => US [patent_app_date] => 1994-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 34 [patent_figures_cnt] => 47 [patent_no_of_words] => 11623 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 307 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/543/05543363.pdf [firstpage_image] =>[orig_patent_app_number] => 291753 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/291753
Process for adhesively attaching a semiconductor device to an electrode plate Aug 15, 1994 Issued
Array ( [id] => 3869755 [patent_doc_number] => 05763296 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-06-09 [patent_title] => 'Method for fabricating an electronic device structure with studs locating lead frame on backing plate' [patent_app_type] => 1 [patent_app_number] => 8/289773 [patent_app_country] => US [patent_app_date] => 1994-08-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 2349 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 221 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/763/05763296.pdf [firstpage_image] =>[orig_patent_app_number] => 289773 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/289773
Method for fabricating an electronic device structure with studs locating lead frame on backing plate Aug 11, 1994 Issued
Array ( [id] => 3729966 [patent_doc_number] => 05701031 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-12-23 [patent_title] => 'Sealed stacked arrangement of semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 8/280381 [patent_app_country] => US [patent_app_date] => 1994-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 45 [patent_figures_cnt] => 67 [patent_no_of_words] => 25331 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 327 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/701/05701031.pdf [firstpage_image] =>[orig_patent_app_number] => 280381 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/280381
Sealed stacked arrangement of semiconductor devices Jul 24, 1994 Issued
Array ( [id] => 4397968 [patent_doc_number] => 06171350 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-09 [patent_title] => 'Apparatus for mounting electronic parts to a mounting body' [patent_app_type] => 1 [patent_app_number] => 8/277013 [patent_app_country] => US [patent_app_date] => 1994-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 5640 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 215 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/171/06171350.pdf [firstpage_image] =>[orig_patent_app_number] => 277013 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/277013
Apparatus for mounting electronic parts to a mounting body Jul 18, 1994 Issued
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