| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3556688
[patent_doc_number] => 05502002
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-03-26
[patent_title] => 'Polyimide passivation of GaAs microwave monolithic integrated circuit flip-chip'
[patent_app_type] => 1
[patent_app_number] => 8/317983
[patent_app_country] => US
[patent_app_date] => 1994-10-04
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[pdf_file] => patents/05/502/05502002.pdf
[firstpage_image] =>[orig_patent_app_number] => 317983
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/317983 | Polyimide passivation of GaAs microwave monolithic integrated circuit flip-chip | Oct 3, 1994 | Issued |
Array
(
[id] => 3694823
[patent_doc_number] => 05661081
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-08-26
[patent_title] => 'Method of bonding an aluminum wire to an intergrated circuit bond pad'
[patent_app_type] => 1
[patent_app_number] => 8/316083
[patent_app_country] => US
[patent_app_date] => 1994-09-30
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/661/05661081.pdf
[firstpage_image] =>[orig_patent_app_number] => 316083
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/316083 | Method of bonding an aluminum wire to an intergrated circuit bond pad | Sep 29, 1994 | Issued |
Array
(
[id] => 3941210
[patent_doc_number] => 05989934
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-23
[patent_title] => 'Process for manufacturing a semiconductor device having a logic circuit and a plurality of input/output amplifier circuits'
[patent_app_type] => 1
[patent_app_number] => 8/315619
[patent_app_country] => US
[patent_app_date] => 1994-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => patents/05/989/05989934.pdf
[firstpage_image] =>[orig_patent_app_number] => 315619
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/315619 | Process for manufacturing a semiconductor device having a logic circuit and a plurality of input/output amplifier circuits | Sep 29, 1994 | Issued |
| 08/316247 | TWO-POLE SMT MINIATURE HOUSING FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE MANUFACTURE THEREOF | Sep 29, 1994 | Abandoned |
Array
(
[id] => 3739096
[patent_doc_number] => 05753535
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-19
[patent_title] => 'Leadframe and resin-sealed semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/314269
[patent_app_country] => US
[patent_app_date] => 1994-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => patents/05/753/05753535.pdf
[firstpage_image] =>[orig_patent_app_number] => 314269
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/314269 | Leadframe and resin-sealed semiconductor device | Sep 29, 1994 | Issued |
Array
(
[id] => 3509484
[patent_doc_number] => 05563076
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-08
[patent_title] => 'Process for adjusting heights of plural semiconductor devices on a circuit board'
[patent_app_type] => 1
[patent_app_number] => 8/315263
[patent_app_country] => US
[patent_app_date] => 1994-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/05/563/05563076.pdf
[firstpage_image] =>[orig_patent_app_number] => 315263
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/315263 | Process for adjusting heights of plural semiconductor devices on a circuit board | Sep 28, 1994 | Issued |
| 08/306455 | METALLIZATION AND BONDING PROCESS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES | Sep 14, 1994 | Abandoned |
Array
(
[id] => 3589734
[patent_doc_number] => 05567653
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-22
[patent_title] => 'Process for aligning etch masks on an integrated circuit surface using electromagnetic energy'
[patent_app_type] => 1
[patent_app_number] => 8/306042
[patent_app_country] => US
[patent_app_date] => 1994-09-14
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[pdf_file] => patents/05/567/05567653.pdf
[firstpage_image] =>[orig_patent_app_number] => 306042
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/306042 | Process for aligning etch masks on an integrated circuit surface using electromagnetic energy | Sep 13, 1994 | Issued |
Array
(
[id] => 3561345
[patent_doc_number] => 05525548
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-06-11
[patent_title] => 'Process of fixing a heat sink to a semiconductor chip and package cap'
[patent_app_type] => 1
[patent_app_number] => 8/301431
[patent_app_country] => US
[patent_app_date] => 1994-09-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/525/05525548.pdf
[firstpage_image] =>[orig_patent_app_number] => 301431
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/301431 | Process of fixing a heat sink to a semiconductor chip and package cap | Sep 8, 1994 | Issued |
Array
(
[id] => 3591511
[patent_doc_number] => 05521122
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-05-28
[patent_title] => 'Process of manufacturing a multichip module using a temporary support base'
[patent_app_type] => 1
[patent_app_number] => 8/297559
[patent_app_country] => US
[patent_app_date] => 1994-08-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/521/05521122.pdf
[firstpage_image] =>[orig_patent_app_number] => 297559
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/297559 | Process of manufacturing a multichip module using a temporary support base | Aug 30, 1994 | Issued |
| 08/297065 | INTERCONNECT BUMP APPARATUS AND METHOD FOR FORMING SAME | Aug 28, 1994 | Abandoned |
Array
(
[id] => 3448227
[patent_doc_number] => 05424254
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-06-13
[patent_title] => 'Process for recovering bare semiconductor chips from plastic packaged modules by thermal shock'
[patent_app_type] => 1
[patent_app_number] => 8/296399
[patent_app_country] => US
[patent_app_date] => 1994-08-26
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[pdf_file] => patents/05/424/05424254.pdf
[firstpage_image] =>[orig_patent_app_number] => 296399
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/296399 | Process for recovering bare semiconductor chips from plastic packaged modules by thermal shock | Aug 25, 1994 | Issued |
| 08/295415 | SEMICONDUCTOR DEVICE AND PROCESS OF PRODUCING SAME | Aug 24, 1994 | Abandoned |
Array
(
[id] => 3601780
[patent_doc_number] => 05578532
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-11-26
[patent_title] => 'Wafer surface protection in a gas deposition process'
[patent_app_type] => 1
[patent_app_number] => 8/294514
[patent_app_country] => US
[patent_app_date] => 1994-08-23
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/578/05578532.pdf
[firstpage_image] =>[orig_patent_app_number] => 294514
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/294514 | Wafer surface protection in a gas deposition process | Aug 22, 1994 | Issued |
| 08/294183 | PACKAGING FOR A SEMICONDUCTOR DEVICE | Aug 21, 1994 | Abandoned |
Array
(
[id] => 3456031
[patent_doc_number] => 05401672
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-03-28
[patent_title] => 'Process of bonding semiconductor wafers having conductive semiconductor material extending through each wafer at the bond areas'
[patent_app_type] => 1
[patent_app_number] => 8/292097
[patent_app_country] => US
[patent_app_date] => 1994-08-17
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[pdf_file] => patents/05/401/05401672.pdf
[firstpage_image] =>[orig_patent_app_number] => 292097
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/292097 | Process of bonding semiconductor wafers having conductive semiconductor material extending through each wafer at the bond areas | Aug 16, 1994 | Issued |
Array
(
[id] => 3554932
[patent_doc_number] => 05543363
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-08-06
[patent_title] => 'Process for adhesively attaching a semiconductor device to an electrode plate'
[patent_app_type] => 1
[patent_app_number] => 8/291753
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[patent_app_date] => 1994-08-16
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[pdf_file] => patents/05/543/05543363.pdf
[firstpage_image] =>[orig_patent_app_number] => 291753
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/291753 | Process for adhesively attaching a semiconductor device to an electrode plate | Aug 15, 1994 | Issued |
Array
(
[id] => 3869755
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-09
[patent_title] => 'Method for fabricating an electronic device structure with studs locating lead frame on backing plate'
[patent_app_type] => 1
[patent_app_number] => 8/289773
[patent_app_country] => US
[patent_app_date] => 1994-08-12
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[firstpage_image] =>[orig_patent_app_number] => 289773
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/289773 | Method for fabricating an electronic device structure with studs locating lead frame on backing plate | Aug 11, 1994 | Issued |
Array
(
[id] => 3729966
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-12-23
[patent_title] => 'Sealed stacked arrangement of semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 8/280381
[patent_app_country] => US
[patent_app_date] => 1994-07-25
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[firstpage_image] =>[orig_patent_app_number] => 280381
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/280381 | Sealed stacked arrangement of semiconductor devices | Jul 24, 1994 | Issued |
Array
(
[id] => 4397968
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-09
[patent_title] => 'Apparatus for mounting electronic parts to a mounting body'
[patent_app_type] => 1
[patent_app_number] => 8/277013
[patent_app_country] => US
[patent_app_date] => 1994-07-19
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[pdf_file] => patents/06/171/06171350.pdf
[firstpage_image] =>[orig_patent_app_number] => 277013
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/277013 | Apparatus for mounting electronic parts to a mounting body | Jul 18, 1994 | Issued |