| Application number | Title of the application | Filing Date | Status |
|---|
Array
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[id] => 4097621
[patent_doc_number] => 06048754
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-11
[patent_title] => 'Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package'
[patent_app_type] => 1
[patent_app_number] => 8/260977
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/260977 | Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package | Jun 14, 1994 | Issued |
| 08/259439 | TECHNIQUES FOR ISOLATING SUPERCONDUCTING SUBSTRATES FROM HEAT GENERATED BY SEMICONDUCTOR DEVICES | Jun 13, 1994 | Abandoned |
Array
(
[id] => 3982621
[patent_doc_number] => 05861323
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-01-19
[patent_title] => 'Process for manufacturing metal ball electrodes for a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/270661
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 270661
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/270661 | Process for manufacturing metal ball electrodes for a semiconductor device | Jun 5, 1994 | Issued |
Array
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[id] => 3442134
[patent_doc_number] => 05466635
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-11-14
[patent_title] => 'Process for making an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating'
[patent_app_type] => 1
[patent_app_number] => 8/252691
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 252691
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/252691 | Process for making an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating | Jun 1, 1994 | Issued |
Array
(
[id] => 3814965
[patent_doc_number] => 05770468
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-23
[patent_title] => 'Process for mounting a semiconductor chip to a chip carrier by exposing a solder layer to a reducing atmosphere'
[patent_app_type] => 1
[patent_app_number] => 8/245657
[patent_app_country] => US
[patent_app_date] => 1994-05-18
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[firstpage_image] =>[orig_patent_app_number] => 245657
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/245657 | Process for mounting a semiconductor chip to a chip carrier by exposing a solder layer to a reducing atmosphere | May 17, 1994 | Issued |
| 08/239375 | COMPOSITE BUMP BONDING | May 5, 1994 | Abandoned |
Array
(
[id] => 3426699
[patent_doc_number] => 05403754
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-04-04
[patent_title] => 'Lithography method for direct alignment of integrated circuits multiple layers'
[patent_app_type] => 1
[patent_app_number] => 8/238194
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[patent_app_date] => 1994-05-04
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/238194 | Lithography method for direct alignment of integrated circuits multiple layers | May 3, 1994 | Issued |
| 08/237173 | PROCESS OF FABRICATING SEMICONDUCTOR UNIT EMPLOYING BUMPS TO BOND TWO COMPONENTS | May 2, 1994 | Abandoned |
| 08/235849 | ENCAPSULATE RESIN LOC PACKAGE AND METHOD OF FABRICATION | Apr 28, 1994 | Abandoned |
| 08/233941 | OPTICAL SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME | Apr 27, 1994 | Abandoned |
Array
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Array
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[id] => 3606024
[patent_doc_number] => 05565008
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-10-15
[patent_title] => 'Process of raising a semiconductor device out of a pallet using a positioning rod'
[patent_app_type] => 1
[patent_app_number] => 8/234595
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 234595
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/234595 | Process of raising a semiconductor device out of a pallet using a positioning rod | Apr 27, 1994 | Issued |
Array
(
[id] => 3832071
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-01-27
[patent_title] => 'Process for connecting an electrical device to a circuit substrate'
[patent_app_type] => 1
[patent_app_number] => 8/233193
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/233193 | Process for connecting an electrical device to a circuit substrate | Apr 25, 1994 | Issued |
Array
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[patent_kind] => NA
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[patent_title] => 'Low temperature ternary C4 flip chip bonding method'
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[patent_app_number] => 8/229883
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[firstpage_image] =>[orig_patent_app_number] => 229883
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/229883 | Low temperature ternary C4 flip chip bonding method | Apr 18, 1994 | Issued |
Array
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[patent_kind] => NA
[patent_issue_date] => 1997-10-28
[patent_title] => 'Method and apparatus for producing a plastic molded chip card having reduced wall thickness'
[patent_app_type] => 1
[patent_app_number] => 8/146087
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/146087 | Method and apparatus for producing a plastic molded chip card having reduced wall thickness | Apr 4, 1994 | Issued |
Array
(
[id] => 3470033
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[patent_issue_date] => 1995-07-11
[patent_title] => 'Vertical multi-process bake/chill apparatus'
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[patent_app_number] => 8/220235
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/220235 | Vertical multi-process bake/chill apparatus | Mar 29, 1994 | Issued |
Array
(
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[patent_title] => 'Method for making a thin profile semiconductor package'
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Array
(
[id] => 3855755
[patent_doc_number] => 05705424
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-01-06
[patent_title] => 'Process of fabricating active matrix pixel electrodes'
[patent_app_type] => 1
[patent_app_number] => 8/215555
[patent_app_country] => US
[patent_app_date] => 1994-03-21
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[firstpage_image] =>[orig_patent_app_number] => 215555
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/215555 | Process of fabricating active matrix pixel electrodes | Mar 20, 1994 | Issued |
| 08/213149 | 3D STACK OF IC CHIPS HAVING LEADS REACHED BY VIAS THROUGH PASSIVATION COVERING ACCESS PLANE | Mar 14, 1994 | Abandoned |
| 08/207493 | THERMAL COOLING OF PACKAGED SEMICONDUCTOR DEVICES | Mar 6, 1994 | Abandoned |