Search

David E. Graybill

Examiner (ID: 8531)

Most Active Art Unit
2894
Art Unit(s)
1763, 3727, 2894, 1107, 2822, 2812, 2814, 2827
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3109620 [patent_doc_number] => 05413970 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-05-09 [patent_title] => 'Process for manufacturing a semiconductor package having two rows of interdigitated leads' [patent_app_type] => 1 [patent_app_number] => 8/134149 [patent_app_country] => US [patent_app_date] => 1993-10-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 2792 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/413/05413970.pdf [firstpage_image] =>[orig_patent_app_number] => 134149 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/134149
Process for manufacturing a semiconductor package having two rows of interdigitated leads Oct 7, 1993 Issued
Array ( [id] => 3410128 [patent_doc_number] => 05438020 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-08-01 [patent_title] => 'Process for flip-chip bonding a semiconductor chip using wire leads' [patent_app_type] => 1 [patent_app_number] => 8/121881 [patent_app_country] => US [patent_app_date] => 1993-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 9 [patent_no_of_words] => 2088 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/438/05438020.pdf [firstpage_image] =>[orig_patent_app_number] => 121881 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/121881
Process for flip-chip bonding a semiconductor chip using wire leads Sep 16, 1993 Issued
Array ( [id] => 3580286 [patent_doc_number] => 05539550 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-07-23 [patent_title] => 'Liquid crystal display having adhered circuit tiles' [patent_app_type] => 1 [patent_app_number] => 8/119292 [patent_app_country] => US [patent_app_date] => 1993-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 29 [patent_no_of_words] => 6135 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/539/05539550.pdf [firstpage_image] =>[orig_patent_app_number] => 119292 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/119292
Liquid crystal display having adhered circuit tiles Sep 8, 1993 Issued
08/114705 LOW COST LEAD FRAME DESIGN AND MANUFACTURING PROCESS Aug 30, 1993 Abandoned
Array ( [id] => 2989011 [patent_doc_number] => 05346836 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-09-13 [patent_title] => 'Process for forming low resistance contacts between silicide areas and upper level polysilicon interconnects' [patent_app_type] => 1 [patent_app_number] => 8/108147 [patent_app_country] => US [patent_app_date] => 1993-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 1652 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/346/05346836.pdf [firstpage_image] =>[orig_patent_app_number] => 108147 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/108147
Process for forming low resistance contacts between silicide areas and upper level polysilicon interconnects Aug 16, 1993 Issued
Array ( [id] => 3524606 [patent_doc_number] => 05504035 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-04-02 [patent_title] => 'Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate' [patent_app_type] => 1 [patent_app_number] => 8/105547 [patent_app_country] => US [patent_app_date] => 1993-08-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 36 [patent_no_of_words] => 15332 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/504/05504035.pdf [firstpage_image] =>[orig_patent_app_number] => 105547 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/105547
Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate Aug 11, 1993 Issued
Array ( [id] => 3552320 [patent_doc_number] => 05492866 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-02-20 [patent_title] => 'Process for correcting warped surface of plastic encapsulated semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/100323 [patent_app_country] => US [patent_app_date] => 1993-08-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 20 [patent_no_of_words] => 5097 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 241 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/492/05492866.pdf [firstpage_image] =>[orig_patent_app_number] => 100323 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/100323
Process for correcting warped surface of plastic encapsulated semiconductor device Aug 1, 1993 Issued
08/096539 TAB SEMICONDUCTOR DEVICE WITH SELF-ALIGNING CAVITY AND INTRINSIC STANDOFF AND METHOD FOR MAKING THE SAME Jul 25, 1993 Pending
Array ( [id] => 3107361 [patent_doc_number] => 05407864 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-04-18 [patent_title] => 'Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip' [patent_app_type] => 1 [patent_app_number] => 8/095375 [patent_app_country] => US [patent_app_date] => 1993-07-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 1916 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/407/05407864.pdf [firstpage_image] =>[orig_patent_app_number] => 095375 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/095375
Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip Jul 22, 1993 Issued
Array ( [id] => 3006717 [patent_doc_number] => 05354711 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-10-11 [patent_title] => 'Process for etching and depositing integrated circuit interconnections and contacts' [patent_app_type] => 1 [patent_app_number] => 8/089408 [patent_app_country] => US [patent_app_date] => 1993-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 14 [patent_no_of_words] => 1635 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 204 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/354/05354711.pdf [firstpage_image] =>[orig_patent_app_number] => 089408 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/089408
Process for etching and depositing integrated circuit interconnections and contacts Jul 7, 1993 Issued
Array ( [id] => 3439315 [patent_doc_number] => 05400548 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-03-28 [patent_title] => 'Process for manufacturing semiconductor wafers having deformation ground in a defined way' [patent_app_type] => 1 [patent_app_number] => 8/088171 [patent_app_country] => US [patent_app_date] => 1993-07-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 3127 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/400/05400548.pdf [firstpage_image] =>[orig_patent_app_number] => 088171 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/088171
Process for manufacturing semiconductor wafers having deformation ground in a defined way Jul 6, 1993 Issued
Array ( [id] => 3051795 [patent_doc_number] => 05350428 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-09-27 [patent_title] => 'Electrostatic apparatus and method for removing particles from semiconductor wafers' [patent_app_type] => 1 [patent_app_number] => 8/080165 [patent_app_country] => US [patent_app_date] => 1993-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4974 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/350/05350428.pdf [firstpage_image] =>[orig_patent_app_number] => 080165 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/080165
Electrostatic apparatus and method for removing particles from semiconductor wafers Jun 16, 1993 Issued
08/080167 METHOD AND APPARATUS FOR REMOVING PARTICLES FROM SEMICONDUCTOR WAFERS USING A PARTICLE WITHDRAWING MEANS Jun 16, 1993 Pending
90/003099 METHOD OF ENCAPSULATING A SEMICONDUCTOR ELEMENT USING A RESIN MOLD HAVING UPPER AND LOWER MOLD HALF RESIN INFLOW OPENINGS Jun 15, 1993 Issued
Array ( [id] => 3051778 [patent_doc_number] => 05350427 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-09-27 [patent_title] => 'Wafer retaining platen having peripheral clamp and wafer lifting means' [patent_app_type] => 1 [patent_app_number] => 8/076509 [patent_app_country] => US [patent_app_date] => 1993-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2289 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/350/05350427.pdf [firstpage_image] =>[orig_patent_app_number] => 076509 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/076509
Wafer retaining platen having peripheral clamp and wafer lifting means Jun 13, 1993 Issued
Array ( [id] => 2982917 [patent_doc_number] => 05346513 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-09-13 [patent_title] => 'Method for producing semiconductor device using a vacuum sealing mechanism having inner and outer bellows' [patent_app_type] => 1 [patent_app_number] => 8/065756 [patent_app_country] => US [patent_app_date] => 1993-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 9 [patent_no_of_words] => 5249 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 238 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/346/05346513.pdf [firstpage_image] =>[orig_patent_app_number] => 065756 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/065756
Method for producing semiconductor device using a vacuum sealing mechanism having inner and outer bellows May 23, 1993 Issued
08/064291 METHOD FOR MAKING A BALANCED CAPACITANCE LEAD FRAME FOR INTERGRATED CIRCUITS HAVING A POWER BUS AND DUMMY LEADS May 17, 1993 Pending
Array ( [id] => 3045754 [patent_doc_number] => 05304513 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-04-19 [patent_title] => 'Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame' [patent_app_type] => 1 [patent_app_number] => 8/060704 [patent_app_country] => US [patent_app_date] => 1993-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2190 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 201 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/304/05304513.pdf [firstpage_image] =>[orig_patent_app_number] => 060704 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/060704
Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame May 12, 1993 Issued
Array ( [id] => 3456237 [patent_doc_number] => 05401687 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1995-03-28 [patent_title] => 'Process for high density interconnection of substrates and integrated circuit chips containing sensitive structures' [patent_app_type] => 1 [patent_app_number] => 8/046299 [patent_app_country] => US [patent_app_date] => 1993-04-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 4689 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/401/05401687.pdf [firstpage_image] =>[orig_patent_app_number] => 046299 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/046299
Process for high density interconnection of substrates and integrated circuit chips containing sensitive structures Apr 14, 1993 Issued
08/046189 SILICONE OVERMOLD OF A FLIP-CHIP DEVICE Apr 11, 1993 Pending
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