David E. Graybill

Array ( [id] => 2782205 [patent_doc_number] => 05164328 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-11-17 [patent_title] => 'Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip' [patent_app_type] => 1 [patent_app_number] => 7/884314 [patent_app_country] => US [patent_app_date] => 1992-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1251 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/164/05164328.pdf [firstpage_image] =>[orig_patent_app_number] => 884314 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2985048 [patent_doc_number] => 05266501 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-11-30 [patent_title] => 'Method for manufacturing a solid state image sensing device using transparent thermosetting resin layers' [patent_app_type] => 1 [patent_app_number] => 7/879013 [patent_app_country] => US [patent_app_date] => 1992-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 2179 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/266/05266501.pdf [firstpage_image] =>[orig_patent_app_number] => 879013 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2999951 [patent_doc_number] => 05371044 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-12-06 [patent_title] => 'Method of uniformly encapsulating a semiconductor device in resin' [patent_app_type] => 1 [patent_app_number] => 7/876349 [patent_app_country] => US [patent_app_date] => 1992-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 22 [patent_no_of_words] => 5569 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/371/05371044.pdf [firstpage_image] =>[orig_patent_app_number] => 876349 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2960835 [patent_doc_number] => 05273938 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-12-28 [patent_title] => 'Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film' [patent_app_type] => 1 [patent_app_number] => 7/876315 [patent_app_country] => US [patent_app_date] => 1992-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 14 [patent_no_of_words] => 4838 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/273/05273938.pdf [firstpage_image] =>[orig_patent_app_number] => 876315 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3063530 [patent_doc_number] => 05336272 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-08-09 [patent_title] => 'Method for molding a semiconductor package on a continuous leadframe' [patent_app_type] => 1 [patent_app_number] => 7/876306 [patent_app_country] => US [patent_app_date] => 1992-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 15 [patent_no_of_words] => 3867 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/336/05336272.pdf [firstpage_image] =>[orig_patent_app_number] => 876306 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3086351 [patent_doc_number] => 05278104 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-01-11 [patent_title] => 'Semiconductor wafer carrier having a dust cover' [patent_app_type] => 1 [patent_app_number] => 7/870240 [patent_app_country] => US [patent_app_date] => 1992-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 17 [patent_no_of_words] => 2451 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/278/05278104.pdf [firstpage_image] =>[orig_patent_app_number] => 870240 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3093490 [patent_doc_number] => 05369059 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-11-29 [patent_title] => 'Method for constructing a reduced capacitance chip carrier' [patent_app_type] => 1 [patent_app_number] => 7/865675 [patent_app_country] => US [patent_app_date] => 1992-04-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 8 [patent_no_of_words] => 4060 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/369/05369059.pdf [firstpage_image] =>[orig_patent_app_number] => 865675 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2977690 [patent_doc_number] => 05266119 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-11-30 [patent_title] => 'Vacuum sealing mechanism for a semiconductor device manufacturing apparatus having inner and outer bellows' [patent_app_type] => 1 [patent_app_number] => 7/854875 [patent_app_country] => US [patent_app_date] => 1992-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 9 [patent_no_of_words] => 5246 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/266/05266119.pdf [firstpage_image] =>[orig_patent_app_number] => 854875 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2935615 [patent_doc_number] => 05254172 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-10-19 [patent_title] => 'Rotating furnace tube having a non-rotating slidable work holder for processing semiconductor substrates' [patent_app_type] => 1 [patent_app_number] => 7/854037 [patent_app_country] => US [patent_app_date] => 1992-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 3198 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/254/05254172.pdf [firstpage_image] =>[orig_patent_app_number] => 854037 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2967729 [patent_doc_number] => 05258331 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-11-02 [patent_title] => 'Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars' [patent_app_type] => 1 [patent_app_number] => 7/852457 [patent_app_country] => US [patent_app_date] => 1992-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 26 [patent_no_of_words] => 5663 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 318 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/258/05258331.pdf [firstpage_image] =>[orig_patent_app_number] => 852457 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2967625 [patent_doc_number] => 05258325 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-11-02 [patent_title] => 'Method for manufacturing a semiconductor device using a circuit transfer film' [patent_app_type] => 1 [patent_app_number] => 7/834849 [patent_app_country] => US [patent_app_date] => 1992-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 29 [patent_no_of_words] => 6144 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/258/05258325.pdf [firstpage_image] =>[orig_patent_app_number] => 834849 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3083249 [patent_doc_number] => 05279975 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-01-18 [patent_title] => 'Method of testing individual dies on semiconductor wafers prior to singulation' [patent_app_type] => 1 [patent_app_number] => 7/832785 [patent_app_country] => US [patent_app_date] => 1992-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 9 [patent_no_of_words] => 3748 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 247 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/279/05279975.pdf [firstpage_image] =>[orig_patent_app_number] => 832785 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2982549 [patent_doc_number] => 05250470 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-10-05 [patent_title] => 'Method for manufacturing a semiconductor device with corrosion resistant leads' [patent_app_type] => 1 [patent_app_number] => 7/826689 [patent_app_country] => US [patent_app_date] => 1992-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 2972 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 207 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/250/05250470.pdf [firstpage_image] =>[orig_patent_app_number] => 826689 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3036271 [patent_doc_number] => 05286296 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-02-15 [patent_title] => 'Multi-chamber wafer process equipment having plural, physically communicating transfer means' [patent_app_type] => 1 [patent_app_number] => 7/818535 [patent_app_country] => US [patent_app_date] => 1992-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 14 [patent_no_of_words] => 6219 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/286/05286296.pdf [firstpage_image] =>[orig_patent_app_number] => 818535 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2784990 [patent_doc_number] => 05155068 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-10-13 [patent_title] => 'Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal' [patent_app_type] => 1 [patent_app_number] => 7/818469 [patent_app_country] => US [patent_app_date] => 1992-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 9 [patent_no_of_words] => 1573 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/155/05155068.pdf [firstpage_image] =>[orig_patent_app_number] => 818469 [rel_patent_id] =>[rel_patent_doc_number] =>)