Search

David E. Graybill

Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )

Most Active Art Unit
2894
Art Unit(s)
2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 2926992 [patent_doc_number] => 05187123 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-02-16 [patent_title] => 'Method for bonding a semiconductor device to a lead frame die pad using plural adhesive spots' [patent_app_type] => 1 [patent_app_number] => 7/815621 [patent_app_country] => US [patent_app_date] => 1991-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 33 [patent_no_of_words] => 7653 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 315 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/187/05187123.pdf [firstpage_image] =>[orig_patent_app_number] => 815621 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/815621
Method for bonding a semiconductor device to a lead frame die pad using plural adhesive spots Dec 29, 1991 Issued
Array ( [id] => 2933069 [patent_doc_number] => 05229324 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-07-20 [patent_title] => 'Method for forming contacts to p-type HgCdTe semiconductor material using lead and tin' [patent_app_type] => 1 [patent_app_number] => 7/813249 [patent_app_country] => US [patent_app_date] => 1991-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 9 [patent_no_of_words] => 2717 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/229/05229324.pdf [firstpage_image] =>[orig_patent_app_number] => 813249 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/813249
Method for forming contacts to p-type HgCdTe semiconductor material using lead and tin Dec 22, 1991 Issued
Array ( [id] => 2839384 [patent_doc_number] => 05171712 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-12-15 [patent_title] => 'Method of constructing termination electrodes on yielded semiconductor die by visibly aligning the die pads through a transparent substrate' [patent_app_type] => 1 [patent_app_number] => 7/811755 [patent_app_country] => US [patent_app_date] => 1991-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 3086 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 211 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/171/05171712.pdf [firstpage_image] =>[orig_patent_app_number] => 811755 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/811755
Method of constructing termination electrodes on yielded semiconductor die by visibly aligning the die pads through a transparent substrate Dec 19, 1991 Issued
Array ( [id] => 2931489 [patent_doc_number] => 05188982 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-02-23 [patent_title] => 'Method of bonding a semiconductor die to a package using a gold/silicon preform and cooling the die and package through a monotonically decreasing temperature sequence' [patent_app_type] => 1 [patent_app_number] => 7/811495 [patent_app_country] => US [patent_app_date] => 1991-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2890 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/188/05188982.pdf [firstpage_image] =>[orig_patent_app_number] => 811495 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/811495
Method of bonding a semiconductor die to a package using a gold/silicon preform and cooling the die and package through a monotonically decreasing temperature sequence Dec 19, 1991 Issued
Array ( [id] => 2899107 [patent_doc_number] => 05217922 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-06-08 [patent_title] => 'Method for forming a silicide layer and barrier layer on a semiconductor device rear surface' [patent_app_type] => 1 [patent_app_number] => 7/810313 [patent_app_country] => US [patent_app_date] => 1991-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 25 [patent_no_of_words] => 6148 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/217/05217922.pdf [firstpage_image] =>[orig_patent_app_number] => 810313 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/810313
Method for forming a silicide layer and barrier layer on a semiconductor device rear surface Dec 18, 1991 Issued
Array ( [id] => 3056141 [patent_doc_number] => 05310410 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-05-10 [patent_title] => 'Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus' [patent_app_type] => 1 [patent_app_number] => 7/807162 [patent_app_country] => US [patent_app_date] => 1991-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3154 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/310/05310410.pdf [firstpage_image] =>[orig_patent_app_number] => 807162 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/807162
Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus Dec 12, 1991 Issued
Array ( [id] => 2986186 [patent_doc_number] => 05212115 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-05-18 [patent_title] => 'Method for microelectronic device packaging employing capacitively coupled connections' [patent_app_type] => 1 [patent_app_number] => 7/802929 [patent_app_country] => US [patent_app_date] => 1991-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 3159 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/212/05212115.pdf [firstpage_image] =>[orig_patent_app_number] => 802929 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/802929
Method for microelectronic device packaging employing capacitively coupled connections Dec 5, 1991 Issued
Array ( [id] => 2921066 [patent_doc_number] => 05200363 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-04-06 [patent_title] => 'Method for manufacturing a semiconductor package including a glass support' [patent_app_type] => 1 [patent_app_number] => 7/830205 [patent_app_country] => US [patent_app_date] => 1991-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1678 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/200/05200363.pdf [firstpage_image] =>[orig_patent_app_number] => 830205 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/830205
Method for manufacturing a semiconductor package including a glass support Nov 19, 1991 Issued
Array ( [id] => 2935406 [patent_doc_number] => 05197185 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-03-30 [patent_title] => 'Process of forming electrical connections between conductive layers using thermosonic wire bonded bump vias and thick film techniques' [patent_app_type] => 1 [patent_app_number] => 7/794097 [patent_app_country] => US [patent_app_date] => 1991-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 6 [patent_no_of_words] => 1001 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/197/05197185.pdf [firstpage_image] =>[orig_patent_app_number] => 794097 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/794097
Process of forming electrical connections between conductive layers using thermosonic wire bonded bump vias and thick film techniques Nov 17, 1991 Issued
Array ( [id] => 2804567 [patent_doc_number] => 05147821 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-09-15 [patent_title] => 'Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation' [patent_app_type] => 1 [patent_app_number] => 7/786205 [patent_app_country] => US [patent_app_date] => 1991-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 4886 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/147/05147821.pdf [firstpage_image] =>[orig_patent_app_number] => 786205 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/786205
Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation Oct 30, 1991 Issued
Array ( [id] => 2894273 [patent_doc_number] => 05244838 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-09-14 [patent_title] => 'Process and apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device' [patent_app_type] => 1 [patent_app_number] => 7/784303 [patent_app_country] => US [patent_app_date] => 1991-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3058 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/244/05244838.pdf [firstpage_image] =>[orig_patent_app_number] => 784303 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/784303
Process and apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device Oct 30, 1991 Issued
Array ( [id] => 2933122 [patent_doc_number] => 05229327 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-07-20 [patent_title] => 'Process for manufacturing semiconductor device structures cooled by Peltier junctions and electrical interconnect assemblies therefor' [patent_app_type] => 1 [patent_app_number] => 7/781087 [patent_app_country] => US [patent_app_date] => 1991-10-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 5383 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/229/05229327.pdf [firstpage_image] =>[orig_patent_app_number] => 781087 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/781087
Process for manufacturing semiconductor device structures cooled by Peltier junctions and electrical interconnect assemblies therefor Oct 20, 1991 Issued
Array ( [id] => 3007432 [patent_doc_number] => 05275970 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-01-04 [patent_title] => 'Method of forming bonding bumps by punching a metal ribbon' [patent_app_type] => 1 [patent_app_number] => 7/777903 [patent_app_country] => US [patent_app_date] => 1991-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3430 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/275/05275970.pdf [firstpage_image] =>[orig_patent_app_number] => 777903 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/777903
Method of forming bonding bumps by punching a metal ribbon Oct 16, 1991 Issued
Array ( [id] => 2935273 [patent_doc_number] => 05260234 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-11-09 [patent_title] => 'Method for bonding a lead to a die pad using an electroless plating solution' [patent_app_type] => 1 [patent_app_number] => 7/773519 [patent_app_country] => US [patent_app_date] => 1991-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2958 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 173 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/260/05260234.pdf [firstpage_image] =>[orig_patent_app_number] => 773519 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/773519
Method for bonding a lead to a die pad using an electroless plating solution Oct 8, 1991 Issued
Array ( [id] => 2805081 [patent_doc_number] => 05156998 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-10-20 [patent_title] => 'Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal barrier layer to block migration of tin through via holes' [patent_app_type] => 1 [patent_app_number] => 7/767949 [patent_app_country] => US [patent_app_date] => 1991-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 2781 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 31 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/156/05156998.pdf [firstpage_image] =>[orig_patent_app_number] => 767949 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/767949
Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal barrier layer to block migration of tin through via holes Sep 29, 1991 Issued
Array ( [id] => 2921102 [patent_doc_number] => 05200365 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-04-06 [patent_title] => 'System for achieving desired bondlength of adhesive between a semiconductor chip package and a heatsink' [patent_app_type] => 1 [patent_app_number] => 7/765597 [patent_app_country] => US [patent_app_date] => 1991-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 2408 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/200/05200365.pdf [firstpage_image] =>[orig_patent_app_number] => 765597 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/765597
System for achieving desired bondlength of adhesive between a semiconductor chip package and a heatsink Sep 25, 1991 Issued
07/760869 TESTING AND FINISHING SYSTEM FOR INTEGRATED CIRCUIT PACKAGE UNITS Sep 15, 1991 Abandoned
Array ( [id] => 2921048 [patent_doc_number] => 05200362 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-04-06 [patent_title] => 'Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film' [patent_app_type] => 1 [patent_app_number] => 7/756952 [patent_app_country] => US [patent_app_date] => 1991-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 2328 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/200/05200362.pdf [firstpage_image] =>[orig_patent_app_number] => 756952 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/756952
Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film Sep 8, 1991 Issued
07/753457 STACKED LEADFRAME ARRAY PACKAGE AND METHOD OF MAKING Sep 2, 1991 Abandoned
Array ( [id] => 3017918 [patent_doc_number] => 05288667 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-02-22 [patent_title] => 'Method of manufacturing a molded semiconductor package having a lead frame and an connecting coupler' [patent_app_type] => 1 [patent_app_number] => 7/747587 [patent_app_country] => US [patent_app_date] => 1991-08-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 16 [patent_no_of_words] => 2250 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 242 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/288/05288667.pdf [firstpage_image] =>[orig_patent_app_number] => 747587 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/747587
Method of manufacturing a molded semiconductor package having a lead frame and an connecting coupler Aug 19, 1991 Issued
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