| Application number | Title of the application | Filing Date | Status |
|---|
| 07/691627 | INTEGRATED CIRCUIT PACKAGING USING FLEXIBLE SUBSTRATE | Apr 24, 1991 | Abandoned |
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| 07/690171 | METHOD OF DEPOSITING CONDUCTORS IN HIGH ASPECT RATIO APERTURES | Apr 18, 1991 | Abandoned |
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| 07/679525 | ELECTRONIC SUBSTRATE MULTIPLE LOCATION CONDUCTOR ATTACHMENT TECHNOLOGY | Apr 1, 1991 | Abandoned |
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| 07/665253 | STRUCTURE AND METHOD FOR SELF-ALIGNED CONTACT FORMATION | Mar 4, 1991 | Abandoned |
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| 07/643635 | LEADLESS CHIP RESISTOR CAPACITOR CARRIER FOR HYBRID CIRCUITS AND A METHOD OF MAKING THE SAME | Jan 21, 1991 | Abandoned |
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