| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 2778697
[patent_doc_number] => 05154730
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-10-13
[patent_title] => 'Semiconductor wafer processing module having an inclined rotating wafer handling turret and a method of using the module'
[patent_app_type] => 1
[patent_app_number] => 7/701771
[patent_app_country] => US
[patent_app_date] => 1991-05-17
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/154/05154730.pdf
[firstpage_image] =>[orig_patent_app_number] => 701771
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/701771 | Semiconductor wafer processing module having an inclined rotating wafer handling turret and a method of using the module | May 16, 1991 | Issued |
Array
(
[id] => 3009566
[patent_doc_number] => 05281556
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-01-25
[patent_title] => 'Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane'
[patent_app_type] => 1
[patent_app_number] => 7/701183
[patent_app_country] => US
[patent_app_date] => 1991-05-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 3088
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/281/05281556.pdf
[firstpage_image] =>[orig_patent_app_number] => 701183
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/701183 | Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane | May 15, 1991 | Issued |
Array
(
[id] => 2916657
[patent_doc_number] => 05206188
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-04-27
[patent_title] => 'Method of manufacturing a high lead count circuit board'
[patent_app_type] => 1
[patent_app_number] => 7/700251
[patent_app_country] => US
[patent_app_date] => 1991-05-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 3000
[patent_no_of_claims] => 9
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/206/05206188.pdf
[firstpage_image] =>[orig_patent_app_number] => 700251
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/700251 | Method of manufacturing a high lead count circuit board | May 14, 1991 | Issued |
Array
(
[id] => 2920622
[patent_doc_number] => 05192682
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-03-09
[patent_title] => 'Manufacturing method for thin semiconductor device assemblies'
[patent_app_type] => 1
[patent_app_number] => 7/697963
[patent_app_country] => US
[patent_app_date] => 1991-05-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 1705
[patent_no_of_claims] => 8
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/192/05192682.pdf
[firstpage_image] =>[orig_patent_app_number] => 697963
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/697963 | Manufacturing method for thin semiconductor device assemblies | May 9, 1991 | Issued |
Array
(
[id] => 2812416
[patent_doc_number] => 05086018
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-02-04
[patent_title] => 'Method of making a planarized thin film covered wire bonded semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 7/694719
[patent_app_country] => US
[patent_app_date] => 1991-05-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 2986
[patent_no_of_claims] => 11
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[patent_words_short_claim] => 149
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/086/05086018.pdf
[firstpage_image] =>[orig_patent_app_number] => 694719
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/694719 | Method of making a planarized thin film covered wire bonded semiconductor package | May 1, 1991 | Issued |
| 07/691627 | INTEGRATED CIRCUIT PACKAGING USING FLEXIBLE SUBSTRATE | Apr 24, 1991 | Abandoned |
Array
(
[id] => 2919185
[patent_doc_number] => 05186719
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-02-16
[patent_title] => 'Apparatus for conveying semiconductor lead frame strip using guide rails'
[patent_app_type] => 1
[patent_app_number] => 7/688295
[patent_app_country] => US
[patent_app_date] => 1991-04-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/186/05186719.pdf
[firstpage_image] =>[orig_patent_app_number] => 688295
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/688295 | Apparatus for conveying semiconductor lead frame strip using guide rails | Apr 21, 1991 | Issued |
| 07/690171 | METHOD OF DEPOSITING CONDUCTORS IN HIGH ASPECT RATIO APERTURES | Apr 18, 1991 | Abandoned |
Array
(
[id] => 2807627
[patent_doc_number] => 05140404
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-08-18
[patent_title] => 'Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape'
[patent_app_type] => 1
[patent_app_number] => 7/688023
[patent_app_country] => US
[patent_app_date] => 1991-04-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 2999
[patent_no_of_claims] => 15
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[patent_words_short_claim] => 142
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/140/05140404.pdf
[firstpage_image] =>[orig_patent_app_number] => 688023
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/688023 | Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape | Apr 18, 1991 | Issued |
Array
(
[id] => 2919163
[patent_doc_number] => 05186718
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-02-16
[patent_title] => 'Staged-vacuum wafer processing system and method'
[patent_app_type] => 1
[patent_app_number] => 7/685976
[patent_app_country] => US
[patent_app_date] => 1991-04-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2766
[patent_no_of_claims] => 23
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/186/05186718.pdf
[firstpage_image] =>[orig_patent_app_number] => 685976
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/685976 | Staged-vacuum wafer processing system and method | Apr 14, 1991 | Issued |
Array
(
[id] => 2894182
[patent_doc_number] => 05244833
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-09-14
[patent_title] => 'Method for manufacturing an integrated circuit chip bump electrode using a polymer layer and a photoresist layer'
[patent_app_type] => 1
[patent_app_number] => 7/683893
[patent_app_country] => US
[patent_app_date] => 1991-04-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/05/244/05244833.pdf
[firstpage_image] =>[orig_patent_app_number] => 683893
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/683893 | Method for manufacturing an integrated circuit chip bump electrode using a polymer layer and a photoresist layer | Apr 10, 1991 | Issued |
| 07/679525 | ELECTRONIC SUBSTRATE MULTIPLE LOCATION CONDUCTOR ATTACHMENT TECHNOLOGY | Apr 1, 1991 | Abandoned |
Array
(
[id] => 2834170
[patent_doc_number] => 05120665
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-06-09
[patent_title] => 'Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits'
[patent_app_type] => 1
[patent_app_number] => 7/671472
[patent_app_country] => US
[patent_app_date] => 1991-03-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/05/120/05120665.pdf
[firstpage_image] =>[orig_patent_app_number] => 671472
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/671472 | Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits | Mar 18, 1991 | Issued |
Array
(
[id] => 2854951
[patent_doc_number] => 05166098
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-11-24
[patent_title] => 'Method of manufacturing an encapsulated semiconductor device with a can type housing'
[patent_app_type] => 1
[patent_app_number] => 7/652967
[patent_app_country] => US
[patent_app_date] => 1991-03-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/05/166/05166098.pdf
[firstpage_image] =>[orig_patent_app_number] => 652967
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/652967 | Method of manufacturing an encapsulated semiconductor device with a can type housing | Mar 10, 1991 | Issued |
| 07/665253 | STRUCTURE AND METHOD FOR SELF-ALIGNED CONTACT FORMATION | Mar 4, 1991 | Abandoned |
Array
(
[id] => 2828374
[patent_doc_number] => 05175060
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-12-29
[patent_title] => 'Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same'
[patent_app_type] => 1
[patent_app_number] => 7/663933
[patent_app_country] => US
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[pdf_file] => patents/05/175/05175060.pdf
[firstpage_image] =>[orig_patent_app_number] => 663933
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/663933 | Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same | Feb 28, 1991 | Issued |
Array
(
[id] => 2804454
[patent_doc_number] => 05147815
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-09-15
[patent_title] => 'Method for fabricating a multichip semiconductor device having two interdigitated leadframes'
[patent_app_type] => 1
[patent_app_number] => 7/663223
[patent_app_country] => US
[patent_app_date] => 1991-03-01
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[pdf_file] => patents/05/147/05147815.pdf
[firstpage_image] =>[orig_patent_app_number] => 663223
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/663223 | Method for fabricating a multichip semiconductor device having two interdigitated leadframes | Feb 28, 1991 | Issued |
Array
(
[id] => 2771793
[patent_doc_number] => 05075255
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-12-24
[patent_title] => 'Method of removing contaminants from a plated article with a clean burning hydrogen flame'
[patent_app_type] => 1
[patent_app_number] => 7/661143
[patent_app_country] => US
[patent_app_date] => 1991-02-27
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[pdf_file] => patents/05/075/05075255.pdf
[firstpage_image] =>[orig_patent_app_number] => 661143
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/661143 | Method of removing contaminants from a plated article with a clean burning hydrogen flame | Feb 26, 1991 | Issued |
Array
(
[id] => 2953446
[patent_doc_number] => 05231052
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-07-27
[patent_title] => 'Process for forming a multilayer polysilicon semiconductor electrode'
[patent_app_type] => 1
[patent_app_number] => 7/655123
[patent_app_country] => US
[patent_app_date] => 1991-02-14
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/231/05231052.pdf
[firstpage_image] =>[orig_patent_app_number] => 655123
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/655123 | Process for forming a multilayer polysilicon semiconductor electrode | Feb 13, 1991 | Issued |
Array
(
[id] => 2805050
[patent_doc_number] => 05156997
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-10-20
[patent_title] => 'Method of making semiconductor bonding bumps using metal cluster ion deposition'
[patent_app_type] => 1
[patent_app_number] => 7/653609
[patent_app_country] => US
[patent_app_date] => 1991-02-11
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[pdf_file] => patents/05/156/05156997.pdf
[firstpage_image] =>[orig_patent_app_number] => 653609
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/653609 | Method of making semiconductor bonding bumps using metal cluster ion deposition | Feb 10, 1991 | Issued |