| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 2771847
[patent_doc_number] => 05075258
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-12-24
[patent_title] => 'Method for plating tab leads in an assembled semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 7/560915
[patent_app_country] => US
[patent_app_date] => 1990-07-31
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[pdf_file] => patents/05/075/05075258.pdf
[firstpage_image] =>[orig_patent_app_number] => 560915
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/560915 | Method for plating tab leads in an assembled semiconductor package | Jul 30, 1990 | Issued |
Array
(
[id] => 2693754
[patent_doc_number] => 04996170
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-02-26
[patent_title] => 'Molding process for encapsulating semiconductor devices using a thixotropic compound'
[patent_app_type] => 1
[patent_app_number] => 7/559922
[patent_app_country] => US
[patent_app_date] => 1990-07-30
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/04/996/04996170.pdf
[firstpage_image] =>[orig_patent_app_number] => 559922
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/559922 | Molding process for encapsulating semiconductor devices using a thixotropic compound | Jul 29, 1990 | Issued |
| 07/557015 | SEMICONDUCTOR DEVICE SUPPORT CARRIER | Jul 24, 1990 | Abandoned |
Array
(
[id] => 2709408
[patent_doc_number] => 05061657
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-10-29
[patent_title] => 'Method of making integrated circuit to package electrical connections after encapsulation with an organic polymer'
[patent_app_type] => 1
[patent_app_number] => 7/557449
[patent_app_country] => US
[patent_app_date] => 1990-07-18
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[pdf_file] => patents/05/061/05061657.pdf
[firstpage_image] =>[orig_patent_app_number] => 557449
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/557449 | Method of making integrated circuit to package electrical connections after encapsulation with an organic polymer | Jul 17, 1990 | Issued |
Array
(
[id] => 2748559
[patent_doc_number] => 05035034
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-07-30
[patent_title] => 'Hold-down clamp with mult-fingered interchangeable insert for wire bonding semiconductor lead frames'
[patent_app_type] => 1
[patent_app_number] => 7/553015
[patent_app_country] => US
[patent_app_date] => 1990-07-16
[patent_effective_date] => 0000-00-00
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[patent_no_of_words] => 2025
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[pdf_file] => patents/05/035/05035034.pdf
[firstpage_image] =>[orig_patent_app_number] => 553015
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/553015 | Hold-down clamp with mult-fingered interchangeable insert for wire bonding semiconductor lead frames | Jul 15, 1990 | Issued |
Array
(
[id] => 2712940
[patent_doc_number] => 05010038
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-04-23
[patent_title] => 'Method of cooling and powering an integrated circuit chip using a compliant interposing pad'
[patent_app_type] => 1
[patent_app_number] => 7/549611
[patent_app_country] => US
[patent_app_date] => 1990-07-09
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/010/05010038.pdf
[firstpage_image] =>[orig_patent_app_number] => 549611
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/549611 | Method of cooling and powering an integrated circuit chip using a compliant interposing pad | Jul 8, 1990 | Issued |
Array
(
[id] => 2779305
[patent_doc_number] => 05113565
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-05-19
[patent_title] => 'Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames'
[patent_app_type] => 1
[patent_app_number] => 7/549577
[patent_app_country] => US
[patent_app_date] => 1990-07-06
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[pdf_file] => patents/05/113/05113565.pdf
[firstpage_image] =>[orig_patent_app_number] => 549577
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/549577 | Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames | Jul 5, 1990 | Issued |
| 07/543003 | SENSOR AND INTEGRATED CIRCUIT HYBRID ASSEMBLY | Jun 24, 1990 | Abandoned |
| 07/539178 | WAFER SCALE INTEGRATION BY PROXIMITY PLACEMENT OF PRECISION FORMED CHIPS | Jun 17, 1990 | Abandoned |
Array
(
[id] => 2812990
[patent_doc_number] => 05079189
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-01-07
[patent_title] => 'Method of making RIS or ROS array bars using replaceable subunits'
[patent_app_type] => 1
[patent_app_number] => 7/539340
[patent_app_country] => US
[patent_app_date] => 1990-06-18
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/079/05079189.pdf
[firstpage_image] =>[orig_patent_app_number] => 539340
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/539340 | Method of making RIS or ROS array bars using replaceable subunits | Jun 17, 1990 | Issued |
Array
(
[id] => 2805101
[patent_doc_number] => 05156999
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-10-20
[patent_title] => 'Packaging method for semiconductor laser/detector devices'
[patent_app_type] => 1
[patent_app_number] => 7/536136
[patent_app_country] => US
[patent_app_date] => 1990-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => patents/05/156/05156999.pdf
[firstpage_image] =>[orig_patent_app_number] => 536136
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/536136 | Packaging method for semiconductor laser/detector devices | Jun 7, 1990 | Issued |
Array
(
[id] => 2851431
[patent_doc_number] => 05089443
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-02-18
[patent_title] => 'Method of making a semiconductor heat sink'
[patent_app_type] => 1
[patent_app_number] => 7/530830
[patent_app_country] => US
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[pdf_file] => patents/05/089/05089443.pdf
[firstpage_image] =>[orig_patent_app_number] => 530830
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/530830 | Method of making a semiconductor heat sink | May 29, 1990 | Issued |
Array
(
[id] => 2684944
[patent_doc_number] => 05067218
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-11-26
[patent_title] => 'Vacuum wafer transport and processing system and method using a plurality of wafer transport arms'
[patent_app_type] => 1
[patent_app_number] => 7/526255
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[patent_app_date] => 1990-05-21
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[pdf_file] => patents/05/067/05067218.pdf
[firstpage_image] =>[orig_patent_app_number] => 526255
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/526255 | Vacuum wafer transport and processing system and method using a plurality of wafer transport arms | May 20, 1990 | Issued |
Array
(
[id] => 2871469
[patent_doc_number] => 05091341
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-02-25
[patent_title] => 'Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member'
[patent_app_type] => 1
[patent_app_number] => 7/524434
[patent_app_country] => US
[patent_app_date] => 1990-05-17
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[firstpage_image] =>[orig_patent_app_number] => 524434
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/524434 | Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member | May 16, 1990 | Issued |
Array
(
[id] => 2747510
[patent_doc_number] => 05037779
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-08-06
[patent_title] => 'Method of encapsulating a sensor device using capillary action and the device so encapsulated'
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[firstpage_image] =>[orig_patent_app_number] => 524005
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/524005 | Method of encapsulating a sensor device using capillary action and the device so encapsulated | May 15, 1990 | Issued |
Array
(
[id] => 2771741
[patent_doc_number] => 05075252
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[patent_kind] => NA
[patent_issue_date] => 1991-12-24
[patent_title] => 'Interdigitated trans-die lead method of construction for maximizing population density of chip-on-board construction'
[patent_app_type] => 1
[patent_app_number] => 7/522947
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[pdf_file] => patents/05/075/05075252.pdf
[firstpage_image] =>[orig_patent_app_number] => 522947
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/522947 | Interdigitated trans-die lead method of construction for maximizing population density of chip-on-board construction | May 13, 1990 | Issued |
Array
(
[id] => 2681682
[patent_doc_number] => 05045502
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[patent_kind] => NA
[patent_issue_date] => 1991-09-03
[patent_title] => 'PdIn ohmic contact to GaAs'
[patent_app_type] => 1
[patent_app_number] => 7/522175
[patent_app_country] => US
[patent_app_date] => 1990-05-10
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[pdf_file] => patents/05/045/05045502.pdf
[firstpage_image] =>[orig_patent_app_number] => 522175
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/522175 | PdIn ohmic contact to GaAs | May 9, 1990 | Issued |
Array
(
[id] => 2845205
[patent_doc_number] => 05106784
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[patent_kind] => NA
[patent_issue_date] => 1992-04-21
[patent_title] => 'Method of making a post molded cavity package with internal dam bar for integrated circuit'
[patent_app_type] => 1
[patent_app_number] => 7/511877
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[patent_app_date] => 1990-04-20
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[rel_patent_id] =>[rel_patent_doc_number] =>) 07/511877 | Method of making a post molded cavity package with internal dam bar for integrated circuit | Apr 19, 1990 | Issued |
Array
(
[id] => 2712908
[patent_doc_number] => 05010036
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-04-23
[patent_title] => 'Low temperature semiconductor bonding process with chemical vapor reaction'
[patent_app_type] => 1
[patent_app_number] => 7/511588
[patent_app_country] => US
[patent_app_date] => 1990-04-20
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Array
(
[id] => 2714412
[patent_doc_number] => 05008213
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[patent_kind] => NA
[patent_issue_date] => 1991-04-16
[patent_title] => 'Hybrid wafer scale microcircuit integration'
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[patent_app_country] => US
[patent_app_date] => 1990-04-13
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[firstpage_image] =>[orig_patent_app_number] => 511475
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/511475 | Hybrid wafer scale microcircuit integration | Apr 12, 1990 | Issued |