Search

David E. Graybill

Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )

Most Active Art Unit
2894
Art Unit(s)
2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 2767416 [patent_doc_number] => 05036024 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-07-30 [patent_title] => 'Method of treating a hardened semiconductor resin encapsulated layer with ultraviolet radiation' [patent_app_type] => 1 [patent_app_number] => 7/580054 [patent_app_country] => US [patent_app_date] => 1990-09-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 5258 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/036/05036024.pdf [firstpage_image] =>[orig_patent_app_number] => 580054 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/580054
Method of treating a hardened semiconductor resin encapsulated layer with ultraviolet radiation Sep 9, 1990 Issued
07/576255 METHOD OF ATTACHING CONDUCTIVE TRACES TO AN ENCAPSULATED SEMICONDUCTOR DIE USING A REMOVABLE TRANSFER FILM Aug 30, 1990 Abandoned
Array ( [id] => 2866492 [patent_doc_number] => 05096851 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-03-17 [patent_title] => 'Method of packaging an electronic device using a common holder to carry the device in both a CVD and molding step' [patent_app_type] => 1 [patent_app_number] => 7/572331 [patent_app_country] => US [patent_app_date] => 1990-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 1424 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/096/05096851.pdf [firstpage_image] =>[orig_patent_app_number] => 572331 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/572331
Method of packaging an electronic device using a common holder to carry the device in both a CVD and molding step Aug 23, 1990 Issued
Array ( [id] => 2789720 [patent_doc_number] => 05102831 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-04-07 [patent_title] => 'Method of manufacturing multi-chip package' [patent_app_type] => 1 [patent_app_number] => 7/573260 [patent_app_country] => US [patent_app_date] => 1990-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 17 [patent_no_of_words] => 2248 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/102/05102831.pdf [firstpage_image] =>[orig_patent_app_number] => 573260 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/573260
Method of manufacturing multi-chip package Aug 23, 1990 Issued
Array ( [id] => 2713234 [patent_doc_number] => 05053357 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-10-01 [patent_title] => 'Method of aligning and mounting an electronic device on a printed circuit board using a flexible substrate having fixed lead arrays thereon' [patent_app_type] => 1 [patent_app_number] => 7/567838 [patent_app_country] => US [patent_app_date] => 1990-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 4150 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 222 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/053/05053357.pdf [firstpage_image] =>[orig_patent_app_number] => 567838 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/567838
Method of aligning and mounting an electronic device on a printed circuit board using a flexible substrate having fixed lead arrays thereon Aug 13, 1990 Issued
Array ( [id] => 2771847 [patent_doc_number] => 05075258 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-12-24 [patent_title] => 'Method for plating tab leads in an assembled semiconductor package' [patent_app_type] => 1 [patent_app_number] => 7/560915 [patent_app_country] => US [patent_app_date] => 1990-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2205 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/075/05075258.pdf [firstpage_image] =>[orig_patent_app_number] => 560915 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/560915
Method for plating tab leads in an assembled semiconductor package Jul 30, 1990 Issued
Array ( [id] => 2693754 [patent_doc_number] => 04996170 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-02-26 [patent_title] => 'Molding process for encapsulating semiconductor devices using a thixotropic compound' [patent_app_type] => 1 [patent_app_number] => 7/559922 [patent_app_country] => US [patent_app_date] => 1990-07-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2100 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/996/04996170.pdf [firstpage_image] =>[orig_patent_app_number] => 559922 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/559922
Molding process for encapsulating semiconductor devices using a thixotropic compound Jul 29, 1990 Issued
07/557015 SEMICONDUCTOR DEVICE SUPPORT CARRIER Jul 24, 1990 Abandoned
Array ( [id] => 2709408 [patent_doc_number] => 05061657 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-10-29 [patent_title] => 'Method of making integrated circuit to package electrical connections after encapsulation with an organic polymer' [patent_app_type] => 1 [patent_app_number] => 7/557449 [patent_app_country] => US [patent_app_date] => 1990-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 1166 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/061/05061657.pdf [firstpage_image] =>[orig_patent_app_number] => 557449 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/557449
Method of making integrated circuit to package electrical connections after encapsulation with an organic polymer Jul 17, 1990 Issued
Array ( [id] => 2748559 [patent_doc_number] => 05035034 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-07-30 [patent_title] => 'Hold-down clamp with mult-fingered interchangeable insert for wire bonding semiconductor lead frames' [patent_app_type] => 1 [patent_app_number] => 7/553015 [patent_app_country] => US [patent_app_date] => 1990-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2025 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/035/05035034.pdf [firstpage_image] =>[orig_patent_app_number] => 553015 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/553015
Hold-down clamp with mult-fingered interchangeable insert for wire bonding semiconductor lead frames Jul 15, 1990 Issued
Array ( [id] => 2712940 [patent_doc_number] => 05010038 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-04-23 [patent_title] => 'Method of cooling and powering an integrated circuit chip using a compliant interposing pad' [patent_app_type] => 1 [patent_app_number] => 7/549611 [patent_app_country] => US [patent_app_date] => 1990-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3087 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/010/05010038.pdf [firstpage_image] =>[orig_patent_app_number] => 549611 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/549611
Method of cooling and powering an integrated circuit chip using a compliant interposing pad Jul 8, 1990 Issued
Array ( [id] => 2779305 [patent_doc_number] => 05113565 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-05-19 [patent_title] => 'Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames' [patent_app_type] => 1 [patent_app_number] => 7/549577 [patent_app_country] => US [patent_app_date] => 1990-07-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 32 [patent_no_of_words] => 9312 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 199 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/113/05113565.pdf [firstpage_image] =>[orig_patent_app_number] => 549577 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/549577
Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames Jul 5, 1990 Issued
07/543003 SENSOR AND INTEGRATED CIRCUIT HYBRID ASSEMBLY Jun 24, 1990 Abandoned
Array ( [id] => 2812990 [patent_doc_number] => 05079189 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-01-07 [patent_title] => 'Method of making RIS or ROS array bars using replaceable subunits' [patent_app_type] => 1 [patent_app_number] => 7/539340 [patent_app_country] => US [patent_app_date] => 1990-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 4923 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/079/05079189.pdf [firstpage_image] =>[orig_patent_app_number] => 539340 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/539340
Method of making RIS or ROS array bars using replaceable subunits Jun 17, 1990 Issued
07/539178 WAFER SCALE INTEGRATION BY PROXIMITY PLACEMENT OF PRECISION FORMED CHIPS Jun 17, 1990 Abandoned
Array ( [id] => 2805101 [patent_doc_number] => 05156999 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-10-20 [patent_title] => 'Packaging method for semiconductor laser/detector devices' [patent_app_type] => 1 [patent_app_number] => 7/536136 [patent_app_country] => US [patent_app_date] => 1990-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 18 [patent_no_of_words] => 2729 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/156/05156999.pdf [firstpage_image] =>[orig_patent_app_number] => 536136 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/536136
Packaging method for semiconductor laser/detector devices Jun 7, 1990 Issued
Array ( [id] => 2851431 [patent_doc_number] => 05089443 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-02-18 [patent_title] => 'Method of making a semiconductor heat sink' [patent_app_type] => 1 [patent_app_number] => 7/530830 [patent_app_country] => US [patent_app_date] => 1990-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 2224 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/089/05089443.pdf [firstpage_image] =>[orig_patent_app_number] => 530830 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/530830
Method of making a semiconductor heat sink May 29, 1990 Issued
Array ( [id] => 2684944 [patent_doc_number] => 05067218 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-11-26 [patent_title] => 'Vacuum wafer transport and processing system and method using a plurality of wafer transport arms' [patent_app_type] => 1 [patent_app_number] => 7/526255 [patent_app_country] => US [patent_app_date] => 1990-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2156 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/067/05067218.pdf [firstpage_image] =>[orig_patent_app_number] => 526255 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/526255
Vacuum wafer transport and processing system and method using a plurality of wafer transport arms May 20, 1990 Issued
Array ( [id] => 2871469 [patent_doc_number] => 05091341 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-02-25 [patent_title] => 'Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member' [patent_app_type] => 1 [patent_app_number] => 7/524434 [patent_app_country] => US [patent_app_date] => 1990-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 13 [patent_no_of_words] => 2844 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/091/05091341.pdf [firstpage_image] =>[orig_patent_app_number] => 524434 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/524434
Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member May 16, 1990 Issued
Array ( [id] => 2747510 [patent_doc_number] => 05037779 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-08-06 [patent_title] => 'Method of encapsulating a sensor device using capillary action and the device so encapsulated' [patent_app_type] => 1 [patent_app_number] => 7/524005 [patent_app_country] => US [patent_app_date] => 1990-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 1709 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/037/05037779.pdf [firstpage_image] =>[orig_patent_app_number] => 524005 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/524005
Method of encapsulating a sensor device using capillary action and the device so encapsulated May 15, 1990 Issued
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