| Application number | Title of the application | Filing Date | Status |
|---|
Array
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[id] => 2771741
[patent_doc_number] => 05075252
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-12-24
[patent_title] => 'Interdigitated trans-die lead method of construction for maximizing population density of chip-on-board construction'
[patent_app_type] => 1
[patent_app_number] => 7/522947
[patent_app_country] => US
[patent_app_date] => 1990-05-14
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[firstpage_image] =>[orig_patent_app_number] => 522947
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Array
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[id] => 2681682
[patent_doc_number] => 05045502
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-09-03
[patent_title] => 'PdIn ohmic contact to GaAs'
[patent_app_type] => 1
[patent_app_number] => 7/522175
[patent_app_country] => US
[patent_app_date] => 1990-05-10
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[pdf_file] => patents/05/045/05045502.pdf
[firstpage_image] =>[orig_patent_app_number] => 522175
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/522175 | PdIn ohmic contact to GaAs | May 9, 1990 | Issued |
Array
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[id] => 2845205
[patent_doc_number] => 05106784
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-04-21
[patent_title] => 'Method of making a post molded cavity package with internal dam bar for integrated circuit'
[patent_app_type] => 1
[patent_app_number] => 7/511877
[patent_app_country] => US
[patent_app_date] => 1990-04-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => patents/05/106/05106784.pdf
[firstpage_image] =>[orig_patent_app_number] => 511877
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/511877 | Method of making a post molded cavity package with internal dam bar for integrated circuit | Apr 19, 1990 | Issued |
Array
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[id] => 2712908
[patent_doc_number] => 05010036
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-04-23
[patent_title] => 'Low temperature semiconductor bonding process with chemical vapor reaction'
[patent_app_type] => 1
[patent_app_number] => 7/511588
[patent_app_country] => US
[patent_app_date] => 1990-04-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[firstpage_image] =>[orig_patent_app_number] => 511588
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/511588 | Low temperature semiconductor bonding process with chemical vapor reaction | Apr 19, 1990 | Issued |
Array
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[id] => 2714412
[patent_doc_number] => 05008213
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-04-16
[patent_title] => 'Hybrid wafer scale microcircuit integration'
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[patent_app_number] => 7/511475
[patent_app_country] => US
[patent_app_date] => 1990-04-13
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[firstpage_image] =>[orig_patent_app_number] => 511475
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/511475 | Hybrid wafer scale microcircuit integration | Apr 12, 1990 | Issued |
Array
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[id] => 2692875
[patent_doc_number] => 05064782
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-11-12
[patent_title] => 'Method of adhesively and hermetically sealing a semiconductor package lid by scrubbing'
[patent_app_type] => 1
[patent_app_number] => 7/505591
[patent_app_country] => US
[patent_app_date] => 1990-04-06
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[firstpage_image] =>[orig_patent_app_number] => 505591
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/505591 | Method of adhesively and hermetically sealing a semiconductor package lid by scrubbing | Apr 5, 1990 | Issued |
| 07/505596 | APPARATUS FOR PROCESSING SEMI-CONDUCTOR WAFERS | Apr 5, 1990 | Abandoned |
Array
(
[id] => 2707254
[patent_doc_number] => 05041395
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[patent_issue_date] => 1991-08-20
[patent_title] => 'Method of encapsulating an integrated circuit using a punched metal grid attached to a perforated dielectric strip'
[patent_app_type] => 1
[patent_app_number] => 7/504961
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[patent_app_date] => 1990-04-05
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[pdf_file] => patents/05/041/05041395.pdf
[firstpage_image] =>[orig_patent_app_number] => 504961
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/504961 | Method of encapsulating an integrated circuit using a punched metal grid attached to a perforated dielectric strip | Apr 4, 1990 | Issued |
Array
(
[id] => 2758090
[patent_doc_number] => 05059557
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-10-22
[patent_title] => 'Method of electrically connecting integrated circuits by edge-insertion in grooved support members'
[patent_app_type] => 1
[patent_app_number] => 7/503020
[patent_app_country] => US
[patent_app_date] => 1990-04-02
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[pdf_file] => patents/05/059/05059557.pdf
[firstpage_image] =>[orig_patent_app_number] => 503020
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/503020 | Method of electrically connecting integrated circuits by edge-insertion in grooved support members | Apr 1, 1990 | Issued |
Array
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[id] => 2754321
[patent_doc_number] => 05043296
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[patent_kind] => NA
[patent_issue_date] => 1991-08-27
[patent_title] => 'Method of manufacturing LED rows using a temporary rigid auxiliary carrier'
[patent_app_type] => 1
[patent_app_number] => 7/466305
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[patent_app_date] => 1990-04-02
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[pdf_file] => patents/05/043/05043296.pdf
[firstpage_image] =>[orig_patent_app_number] => 466305
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/466305 | Method of manufacturing LED rows using a temporary rigid auxiliary carrier | Apr 1, 1990 | Issued |
Array
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[id] => 2658478
[patent_doc_number] => 05065484
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[patent_kind] => NA
[patent_issue_date] => 1991-11-19
[patent_title] => 'Rotating rectifier assembly'
[patent_app_type] => 1
[patent_app_number] => 7/476344
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[patent_app_date] => 1990-02-07
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[firstpage_image] =>[orig_patent_app_number] => 476344
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/476344 | Rotating rectifier assembly | Feb 6, 1990 | Issued |
Array
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[patent_kind] => NA
[patent_issue_date] => 1992-03-17
[patent_title] => 'Method of making plastic encapsulated multichip hybrid integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 7/476511
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[pdf_file] => patents/05/096/05096852.pdf
[firstpage_image] =>[orig_patent_app_number] => 476511
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/476511 | Method of making plastic encapsulated multichip hybrid integrated circuits | Feb 6, 1990 | Issued |
Array
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[patent_issue_date] => 1991-08-06
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 07/471763 | Direct contact TAB method | Jan 28, 1990 | Issued |
Array
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[patent_issue_date] => 1992-04-21
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[patent_issue_date] => 1990-12-18
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[rel_patent_id] =>[rel_patent_doc_number] =>) 07/452110 | Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made | Dec 13, 1989 | Issued |
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