Search

David E. Graybill

Examiner (ID: 16212, Phone: (571)272-1930 , Office: P/2894 )

Most Active Art Unit
2894
Art Unit(s)
2894, 2827, 1763, 2812, 3727, 1107, 2822, 2814
Total Applications
1844
Issued Applications
1278
Pending Applications
38
Abandoned Applications
533

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 2771741 [patent_doc_number] => 05075252 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-12-24 [patent_title] => 'Interdigitated trans-die lead method of construction for maximizing population density of chip-on-board construction' [patent_app_type] => 1 [patent_app_number] => 7/522947 [patent_app_country] => US [patent_app_date] => 1990-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 4808 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/075/05075252.pdf [firstpage_image] =>[orig_patent_app_number] => 522947 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/522947
Interdigitated trans-die lead method of construction for maximizing population density of chip-on-board construction May 13, 1990 Issued
Array ( [id] => 2681682 [patent_doc_number] => 05045502 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-09-03 [patent_title] => 'PdIn ohmic contact to GaAs' [patent_app_type] => 1 [patent_app_number] => 7/522175 [patent_app_country] => US [patent_app_date] => 1990-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 4287 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/045/05045502.pdf [firstpage_image] =>[orig_patent_app_number] => 522175 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/522175
PdIn ohmic contact to GaAs May 9, 1990 Issued
Array ( [id] => 2845205 [patent_doc_number] => 05106784 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-04-21 [patent_title] => 'Method of making a post molded cavity package with internal dam bar for integrated circuit' [patent_app_type] => 1 [patent_app_number] => 7/511877 [patent_app_country] => US [patent_app_date] => 1990-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 4171 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/106/05106784.pdf [firstpage_image] =>[orig_patent_app_number] => 511877 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/511877
Method of making a post molded cavity package with internal dam bar for integrated circuit Apr 19, 1990 Issued
Array ( [id] => 2712908 [patent_doc_number] => 05010036 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-04-23 [patent_title] => 'Low temperature semiconductor bonding process with chemical vapor reaction' [patent_app_type] => 1 [patent_app_number] => 7/511588 [patent_app_country] => US [patent_app_date] => 1990-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 765 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/010/05010036.pdf [firstpage_image] =>[orig_patent_app_number] => 511588 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/511588
Low temperature semiconductor bonding process with chemical vapor reaction Apr 19, 1990 Issued
Array ( [id] => 2714412 [patent_doc_number] => 05008213 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-04-16 [patent_title] => 'Hybrid wafer scale microcircuit integration' [patent_app_type] => 1 [patent_app_number] => 7/511475 [patent_app_country] => US [patent_app_date] => 1990-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 18 [patent_no_of_words] => 8484 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/008/05008213.pdf [firstpage_image] =>[orig_patent_app_number] => 511475 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/511475
Hybrid wafer scale microcircuit integration Apr 12, 1990 Issued
Array ( [id] => 2692875 [patent_doc_number] => 05064782 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-11-12 [patent_title] => 'Method of adhesively and hermetically sealing a semiconductor package lid by scrubbing' [patent_app_type] => 1 [patent_app_number] => 7/505591 [patent_app_country] => US [patent_app_date] => 1990-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 2481 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/064/05064782.pdf [firstpage_image] =>[orig_patent_app_number] => 505591 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/505591
Method of adhesively and hermetically sealing a semiconductor package lid by scrubbing Apr 5, 1990 Issued
07/505596 APPARATUS FOR PROCESSING SEMI-CONDUCTOR WAFERS Apr 5, 1990 Abandoned
Array ( [id] => 2707254 [patent_doc_number] => 05041395 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-08-20 [patent_title] => 'Method of encapsulating an integrated circuit using a punched metal grid attached to a perforated dielectric strip' [patent_app_type] => 1 [patent_app_number] => 7/504961 [patent_app_country] => US [patent_app_date] => 1990-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 2757 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 27 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/041/05041395.pdf [firstpage_image] =>[orig_patent_app_number] => 504961 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/504961
Method of encapsulating an integrated circuit using a punched metal grid attached to a perforated dielectric strip Apr 4, 1990 Issued
Array ( [id] => 2758090 [patent_doc_number] => 05059557 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-10-22 [patent_title] => 'Method of electrically connecting integrated circuits by edge-insertion in grooved support members' [patent_app_type] => 1 [patent_app_number] => 7/503020 [patent_app_country] => US [patent_app_date] => 1990-04-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 1905 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 161 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/059/05059557.pdf [firstpage_image] =>[orig_patent_app_number] => 503020 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/503020
Method of electrically connecting integrated circuits by edge-insertion in grooved support members Apr 1, 1990 Issued
Array ( [id] => 2754321 [patent_doc_number] => 05043296 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-08-27 [patent_title] => 'Method of manufacturing LED rows using a temporary rigid auxiliary carrier' [patent_app_type] => 1 [patent_app_number] => 7/466305 [patent_app_country] => US [patent_app_date] => 1990-04-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 2934 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/043/05043296.pdf [firstpage_image] =>[orig_patent_app_number] => 466305 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/466305
Method of manufacturing LED rows using a temporary rigid auxiliary carrier Apr 1, 1990 Issued
Array ( [id] => 2658478 [patent_doc_number] => 05065484 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-11-19 [patent_title] => 'Rotating rectifier assembly' [patent_app_type] => 1 [patent_app_number] => 7/476344 [patent_app_country] => US [patent_app_date] => 1990-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 18 [patent_no_of_words] => 4901 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/065/05065484.pdf [firstpage_image] =>[orig_patent_app_number] => 476344 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/476344
Rotating rectifier assembly Feb 6, 1990 Issued
Array ( [id] => 2866512 [patent_doc_number] => 05096852 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-03-17 [patent_title] => 'Method of making plastic encapsulated multichip hybrid integrated circuits' [patent_app_type] => 1 [patent_app_number] => 7/476511 [patent_app_country] => US [patent_app_date] => 1990-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3104 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 344 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/096/05096852.pdf [firstpage_image] =>[orig_patent_app_number] => 476511 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/476511
Method of making plastic encapsulated multichip hybrid integrated circuits Feb 6, 1990 Issued
Array ( [id] => 2747528 [patent_doc_number] => 05037780 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-08-06 [patent_title] => 'Method for attaching semiconductors to a transparent substrate using a light-curable resin' [patent_app_type] => 1 [patent_app_number] => 7/473925 [patent_app_country] => US [patent_app_date] => 1990-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 17 [patent_no_of_words] => 4305 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 411 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/037/05037780.pdf [firstpage_image] =>[orig_patent_app_number] => 473925 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/473925
Method for attaching semiconductors to a transparent substrate using a light-curable resin Jan 31, 1990 Issued
Array ( [id] => 2705334 [patent_doc_number] => 04981776 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-01-01 [patent_title] => 'Method of manufacturing a plastic encapsulated semiconductor device with insulated heat sink' [patent_app_type] => 1 [patent_app_number] => 7/473478 [patent_app_country] => US [patent_app_date] => 1990-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 14 [patent_no_of_words] => 3097 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/981/04981776.pdf [firstpage_image] =>[orig_patent_app_number] => 473478 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/473478
Method of manufacturing a plastic encapsulated semiconductor device with insulated heat sink Jan 31, 1990 Issued
Array ( [id] => 2765547 [patent_doc_number] => 05006486 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-04-09 [patent_title] => 'Direct contact TAB method' [patent_app_type] => 1 [patent_app_number] => 7/471763 [patent_app_country] => US [patent_app_date] => 1990-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1445 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/006/05006486.pdf [firstpage_image] =>[orig_patent_app_number] => 471763 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/471763
Direct contact TAB method Jan 28, 1990 Issued
Array ( [id] => 2845230 [patent_doc_number] => 05106785 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-04-21 [patent_title] => 'Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant' [patent_app_type] => 1 [patent_app_number] => 7/464934 [patent_app_country] => US [patent_app_date] => 1990-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 22 [patent_no_of_words] => 3945 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/106/05106785.pdf [firstpage_image] =>[orig_patent_app_number] => 464934 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/464934
Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant Jan 15, 1990 Issued
Array ( [id] => 2658011 [patent_doc_number] => 04978638 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-12-18 [patent_title] => 'Method for attaching heat sink to plastic packaged electronic component' [patent_app_type] => 1 [patent_app_number] => 7/454655 [patent_app_country] => US [patent_app_date] => 1989-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 1896 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/978/04978638.pdf [firstpage_image] =>[orig_patent_app_number] => 454655 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/454655
Method for attaching heat sink to plastic packaged electronic component Dec 20, 1989 Issued
Array ( [id] => 2713598 [patent_doc_number] => 05068714 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-11-26 [patent_title] => 'Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made' [patent_app_type] => 1 [patent_app_number] => 7/452110 [patent_app_country] => US [patent_app_date] => 1989-12-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 5173 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/068/05068714.pdf [firstpage_image] =>[orig_patent_app_number] => 452110 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/452110
Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made Dec 13, 1989 Issued
Array ( [id] => 2723281 [patent_doc_number] => 05057460 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-10-15 [patent_title] => 'Method of making an electronic module, for insertion into an electronic memory-card body' [patent_app_type] => 1 [patent_app_number] => 7/441587 [patent_app_country] => US [patent_app_date] => 1989-11-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 3434 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 196 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/057/05057460.pdf [firstpage_image] =>[orig_patent_app_number] => 441587 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/441587
Method of making an electronic module, for insertion into an electronic memory-card body Nov 26, 1989 Issued
Array ( [id] => 2743394 [patent_doc_number] => 05002895 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-03-26 [patent_title] => 'Wire bonding method with a frame, for connecting an electronic component for testing and mounting' [patent_app_type] => 1 [patent_app_number] => 7/431448 [patent_app_country] => US [patent_app_date] => 1989-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 1995 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/002/05002895.pdf [firstpage_image] =>[orig_patent_app_number] => 431448 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/431448
Wire bonding method with a frame, for connecting an electronic component for testing and mounting Nov 2, 1989 Issued
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