| Application number | Title of the application | Filing Date | Status |
|---|
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[patent_issue_date] => 1991-07-16
[patent_title] => 'Method of mass-producing integrated circuit devices using strip lead frame'
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Array
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[patent_doc_number] => 04987100
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[patent_issue_date] => 1991-01-22
[patent_title] => 'Flexible carrier for an electronic device'
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[firstpage_image] =>[orig_patent_app_number] => 429807
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/429807 | Flexible carrier for an electronic device | Oct 29, 1989 | Issued |
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[patent_doc_number] => 05075259
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[patent_kind] => NA
[patent_issue_date] => 1991-12-24
[patent_title] => 'Method for forming semiconductor contacts by electroless plating'
[patent_app_type] => 1
[patent_app_number] => 7/396713
[patent_app_country] => US
[patent_app_date] => 1989-08-22
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[firstpage_image] =>[orig_patent_app_number] => 396713
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Array
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[patent_doc_number] => 05057456
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[patent_issue_date] => 1991-10-15
[patent_title] => 'Method of manufacturing a tab semiconductor package by securing a thin insulating frame to inner leads of the package'
[patent_app_type] => 1
[patent_app_number] => 7/396690
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[patent_app_date] => 1989-08-22
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[firstpage_image] =>[orig_patent_app_number] => 396690
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[patent_issue_date] => 1991-12-03
[patent_title] => 'Method of removing flash from a semiconductor leadframe using coated leadframe and solvent'
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[patent_app_number] => 7/391986
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[patent_app_date] => 1989-08-10
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[firstpage_image] =>[orig_patent_app_number] => 391986
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Array
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[patent_issue_date] => 1991-05-07
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Array
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[id] => 2742659
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[patent_kind] => NA
[patent_issue_date] => 1991-06-11
[patent_title] => 'Rigid strip carrier for integrated circuits'
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[patent_app_date] => 1989-07-14
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[firstpage_image] =>[orig_patent_app_number] => 380174
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/380174 | Rigid strip carrier for integrated circuits | Jul 13, 1989 | Issued |
| 07/377241 | FABRICATING ELECTRONIC CIRCUITRY UNIT CONTAINING STACKED IC LAYERS HAVING LEAD REROUTING | Jul 6, 1989 | Abandoned |
Array
(
[id] => 2704810
[patent_doc_number] => 04992390
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[patent_kind] => NA
[patent_issue_date] => 1991-02-12
[patent_title] => 'Trench gate structure with thick bottom oxide'
[patent_app_type] => 1
[patent_app_number] => 7/376072
[patent_app_country] => US
[patent_app_date] => 1989-07-06
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[pdf_file] => patents/04/992/04992390.pdf
[firstpage_image] =>[orig_patent_app_number] => 376072
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/376072 | Trench gate structure with thick bottom oxide | Jul 5, 1989 | Issued |
| 07/355008 | STAGED-VACUUM SEMICONDUCTOR WAFER PROCESSING SYSTEM AND METHOD | May 18, 1989 | Abandoned |
Array
(
[id] => 2747496
[patent_doc_number] => 05037778
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[patent_issue_date] => 1991-08-06
[patent_title] => 'Die attach using gold ribbon with gold/silicon eutectic alloy cladding'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 07/351863 | Die attach using gold ribbon with gold/silicon eutectic alloy cladding | May 11, 1989 | Issued |
Array
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[patent_issue_date] => 1992-07-14
[patent_title] => 'Hetero-epitaxially grown compound semiconductor substrate and a method of growing the same'
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[patent_issue_date] => 1991-12-03
[patent_title] => 'Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal'
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Array
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Array
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