
David H. Kruse
Examiner (ID: 5674, Phone: (571)272-0799 , Office: P/1663 )
| Most Active Art Unit | 1663 |
| Art Unit(s) | 1638, 1663 |
| Total Applications | 2040 |
| Issued Applications | 1524 |
| Pending Applications | 150 |
| Abandoned Applications | 393 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6858514
[patent_doc_number] => 20030089522
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-05-15
[patent_title] => 'Low impedance / high density connectivity of surface mount components on a printed wiring board'
[patent_app_type] => new
[patent_app_number] => 10/000902
[patent_app_country] => US
[patent_app_date] => 2001-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2717
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0089/20030089522.pdf
[firstpage_image] =>[orig_patent_app_number] => 10000902
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/000902 | Low impedance / high density connectivity of surface mount components on a printed wiring board | Nov 14, 2001 | Abandoned |
Array
(
[id] => 6091349
[patent_doc_number] => 20020050406
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-05-02
[patent_title] => 'Substrate for mounting semiconductor integrated circuit device'
[patent_app_type] => new
[patent_app_number] => 09/983502
[patent_app_country] => US
[patent_app_date] => 2001-10-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 8103
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0050/20020050406.pdf
[firstpage_image] =>[orig_patent_app_number] => 09983502
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/983502 | Substrate for mounting semiconductor integrated circuit device | Oct 23, 2001 | Issued |
Array
(
[id] => 1309102
[patent_doc_number] => 06617527
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-09-09
[patent_title] => 'Printed circuit board having a pair of grooves extending the entire length'
[patent_app_type] => B2
[patent_app_number] => 09/969032
[patent_app_country] => US
[patent_app_date] => 2001-10-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 0
[patent_no_of_words] => 4291
[patent_no_of_claims] => 1
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 217
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/617/06617527.pdf
[firstpage_image] =>[orig_patent_app_number] => 09969032
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/969032 | Printed circuit board having a pair of grooves extending the entire length | Oct 2, 2001 | Issued |
Array
(
[id] => 6122211
[patent_doc_number] => 20020074157
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-06-20
[patent_title] => 'Apparatus and method for connecting high-frequency circuit boards provided with connecting electrodes formed on bar-shaped member'
[patent_app_type] => new
[patent_app_number] => 09/957432
[patent_app_country] => US
[patent_app_date] => 2001-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 5277
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 36
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0074/20020074157.pdf
[firstpage_image] =>[orig_patent_app_number] => 09957432
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/957432 | Apparatus for connecting high-frequency circuit boards provided with connecting electrodes formed on bar-shaped member | Sep 19, 2001 | Issued |
Array
(
[id] => 7634490
[patent_doc_number] => 06657130
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-12-02
[patent_title] => 'Electrical and physical design integration method and apparatus for providing interconnections on first level ceramic chip carrier packages'
[patent_app_type] => B2
[patent_app_number] => 09/956679
[patent_app_country] => US
[patent_app_date] => 2001-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 0
[patent_no_of_words] => 8010
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 15
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/657/06657130.pdf
[firstpage_image] =>[orig_patent_app_number] => 09956679
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/956679 | Electrical and physical design integration method and apparatus for providing interconnections on first level ceramic chip carrier packages | Sep 19, 2001 | Issued |
Array
(
[id] => 6284159
[patent_doc_number] => 20020053465
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-05-09
[patent_title] => 'Circuit board electrically insulating material, circuit board and method for manufacturing the same'
[patent_app_type] => new
[patent_app_number] => 09/956205
[patent_app_country] => US
[patent_app_date] => 2001-09-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 10327
[patent_no_of_claims] => 46
[patent_no_of_ind_claims] => 9
[patent_words_short_claim] => 58
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0053/20020053465.pdf
[firstpage_image] =>[orig_patent_app_number] => 09956205
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/956205 | Circuit board having an interstitial inner via hole structure | Sep 17, 2001 | Issued |
| 09/786014 | Integrated circuit with electrical contact | Aug 26, 2001 | Abandoned |
Array
(
[id] => 5996486
[patent_doc_number] => 20020027019
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-03-07
[patent_title] => 'Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument'
[patent_app_type] => new
[patent_app_number] => 09/938515
[patent_app_country] => US
[patent_app_date] => 2001-08-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 9168
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 105
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0027/20020027019.pdf
[firstpage_image] =>[orig_patent_app_number] => 09938515
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/938515 | Semiconductor device with a plurality of stacked boards and method of making | Aug 26, 2001 | Issued |
Array
(
[id] => 1313600
[patent_doc_number] => 06613988
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-09-02
[patent_title] => 'Circuit board system with raised interconnects of conductive circuit traces'
[patent_app_type] => B2
[patent_app_number] => 09/938127
[patent_app_country] => US
[patent_app_date] => 2001-08-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 12
[patent_no_of_words] => 1641
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/613/06613988.pdf
[firstpage_image] =>[orig_patent_app_number] => 09938127
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/938127 | Circuit board system with raised interconnects of conductive circuit traces | Aug 22, 2001 | Issued |
Array
(
[id] => 1224882
[patent_doc_number] => 06700071
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-03-02
[patent_title] => 'Multi-layer circuit board having at least two or more circuit patterns connected'
[patent_app_type] => B2
[patent_app_number] => 09/928966
[patent_app_country] => US
[patent_app_date] => 2001-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 41
[patent_no_of_words] => 8805
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 159
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/700/06700071.pdf
[firstpage_image] =>[orig_patent_app_number] => 09928966
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/928966 | Multi-layer circuit board having at least two or more circuit patterns connected | Aug 13, 2001 | Issued |
Array
(
[id] => 1534268
[patent_doc_number] => 06410857
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-25
[patent_title] => 'Signal cross-over interconnect for a double-sided circuit card assembly'
[patent_app_type] => B1
[patent_app_number] => 09/927643
[patent_app_country] => US
[patent_app_date] => 2001-08-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 4032
[patent_no_of_claims] => 29
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 211
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/410/06410857.pdf
[firstpage_image] =>[orig_patent_app_number] => 09927643
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/927643 | Signal cross-over interconnect for a double-sided circuit card assembly | Aug 12, 2001 | Issued |
Array
(
[id] => 6137055
[patent_doc_number] => 20020000329
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-01-03
[patent_title] => 'Processing of circuit boards with protective, adhesive-less covers on area array bonding sites'
[patent_app_type] => new
[patent_app_number] => 09/924711
[patent_app_country] => US
[patent_app_date] => 2001-08-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 4561
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 69
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0000/20020000329.pdf
[firstpage_image] =>[orig_patent_app_number] => 09924711
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/924711 | Adhesive-less cover on area array bonding site of circuit board | Aug 7, 2001 | Issued |
Array
(
[id] => 1468280
[patent_doc_number] => 06459045
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-01
[patent_title] => 'PCB structure for regulating constant power source and strengthening ground connections'
[patent_app_type] => B1
[patent_app_number] => 09/924880
[patent_app_country] => US
[patent_app_date] => 2001-08-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2946
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 170
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/459/06459045.pdf
[firstpage_image] =>[orig_patent_app_number] => 09924880
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/924880 | PCB structure for regulating constant power source and strengthening ground connections | Aug 7, 2001 | Issued |
Array
(
[id] => 5839536
[patent_doc_number] => 20020129970
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-09-19
[patent_title] => 'Portable electronic medium and manufacturing method thereof'
[patent_app_type] => new
[patent_app_number] => 09/919996
[patent_app_country] => US
[patent_app_date] => 2001-08-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 18
[patent_no_of_words] => 5284
[patent_no_of_claims] => 20
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0129/20020129970.pdf
[firstpage_image] =>[orig_patent_app_number] => 09919996
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/919996 | Portable electronic medium and manufacturing method thereof | Aug 1, 2001 | Abandoned |
Array
(
[id] => 6455701
[patent_doc_number] => 20020020555
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-02-21
[patent_title] => 'Printed wiring board and method of producing the same'
[patent_app_type] => new
[patent_app_number] => 09/921202
[patent_app_country] => US
[patent_app_date] => 2001-08-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 17
[patent_no_of_words] => 3695
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0020/20020020555.pdf
[firstpage_image] =>[orig_patent_app_number] => 09921202
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/921202 | Printed wiring board for attachment to a socket connector, having recesses and conductive tabs | Jul 31, 2001 | Issued |
Array
(
[id] => 1358167
[patent_doc_number] => 06580618
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-06-17
[patent_title] => 'Low-profile multi-chip module'
[patent_app_type] => B2
[patent_app_number] => 09/912276
[patent_app_country] => US
[patent_app_date] => 2001-07-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 5
[patent_no_of_words] => 2167
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 132
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/580/06580618.pdf
[firstpage_image] =>[orig_patent_app_number] => 09912276
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/912276 | Low-profile multi-chip module | Jul 23, 2001 | Issued |
Array
(
[id] => 6332281
[patent_doc_number] => 20020033275
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-03-21
[patent_title] => 'Paste for filling throughhole and printed wiring board using same'
[patent_app_type] => new
[patent_app_number] => 09/904097
[patent_app_country] => US
[patent_app_date] => 2001-07-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 9193
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0033/20020033275.pdf
[firstpage_image] =>[orig_patent_app_number] => 09904097
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/904097 | Paste for filling throughhole and printed wiring board using same | Jul 12, 2001 | Issued |
Array
(
[id] => 1397917
[patent_doc_number] => 06545227
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-04-08
[patent_title] => 'Pocket mounted chip having microstrip line'
[patent_app_type] => B2
[patent_app_number] => 09/903292
[patent_app_country] => US
[patent_app_date] => 2001-07-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 13
[patent_no_of_words] => 3392
[patent_no_of_claims] => 18
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/545/06545227.pdf
[firstpage_image] =>[orig_patent_app_number] => 09903292
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/903292 | Pocket mounted chip having microstrip line | Jul 10, 2001 | Issued |
Array
(
[id] => 5947854
[patent_doc_number] => 20020005292
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-01-17
[patent_title] => 'Bump-attached wiring circuit board and method for manufacturing same'
[patent_app_type] => new
[patent_app_number] => 09/895210
[patent_app_country] => US
[patent_app_date] => 2001-07-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0005/20020005292.pdf
[firstpage_image] =>[orig_patent_app_number] => 09895210
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/895210 | Bump-attached wiring circuit board and method for manufacturing same | Jul 1, 2001 | Issued |
Array
(
[id] => 1345873
[patent_doc_number] => 06586684
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-07-01
[patent_title] => 'Circuit housing clamp and method of manufacture therefor'
[patent_app_type] => B2
[patent_app_number] => 09/896409
[patent_app_country] => US
[patent_app_date] => 2001-06-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_no_of_words] => 5992
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/586/06586684.pdf
[firstpage_image] =>[orig_patent_app_number] => 09896409
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/896409 | Circuit housing clamp and method of manufacture therefor | Jun 28, 2001 | Issued |