Search

David H. Kruse

Examiner (ID: 5674, Phone: (571)272-0799 , Office: P/1663 )

Most Active Art Unit
1663
Art Unit(s)
1638, 1663
Total Applications
2040
Issued Applications
1524
Pending Applications
150
Abandoned Applications
393

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1419473 [patent_doc_number] => 06512183 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-01-28 [patent_title] => 'Electronic component mounted member and repair method thereof' [patent_app_type] => B2 [patent_app_number] => 09/893106 [patent_app_country] => US [patent_app_date] => 2001-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 4424 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/512/06512183.pdf [firstpage_image] =>[orig_patent_app_number] => 09893106 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/893106
Electronic component mounted member and repair method thereof Jun 26, 2001 Issued
Array ( [id] => 1455036 [patent_doc_number] => 06462281 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-10-08 [patent_title] => 'High-insulated stud and printed circuit board therewith' [patent_app_type] => B2 [patent_app_number] => 09/891803 [patent_app_country] => US [patent_app_date] => 2001-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 13 [patent_no_of_words] => 3585 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/462/06462281.pdf [firstpage_image] =>[orig_patent_app_number] => 09891803 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/891803
High-insulated stud and printed circuit board therewith Jun 25, 2001 Issued
Array ( [id] => 6631628 [patent_doc_number] => 20030006061 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-09 [patent_title] => 'HYBRID SURFACE MOUNT AND PIN THRU HOLE CIRCUIT BOARD' [patent_app_type] => new [patent_app_number] => 09/885614 [patent_app_country] => US [patent_app_date] => 2001-06-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 5229 [patent_no_of_claims] => 37 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20030006061.pdf [firstpage_image] =>[orig_patent_app_number] => 09885614 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/885614
Hybrid surface mount and pin thru hole circuit board Jun 19, 2001 Issued
Array ( [id] => 6517456 [patent_doc_number] => 20020108776 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-15 [patent_title] => 'Multilayer printed circuit board and method of making the same' [patent_app_type] => new [patent_app_number] => 09/880037 [patent_app_country] => US [patent_app_date] => 2001-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5393 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0108/20020108776.pdf [firstpage_image] =>[orig_patent_app_number] => 09880037 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/880037
Multilayer printed circuit board and method of making the same Jun 13, 2001 Issued
Array ( [id] => 6137701 [patent_doc_number] => 20020000571 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-03 [patent_title] => 'High-temperature superconductor arrangement' [patent_app_type] => new [patent_app_number] => 09/867426 [patent_app_country] => US [patent_app_date] => 2001-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2774 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0000/20020000571.pdf [firstpage_image] =>[orig_patent_app_number] => 09867426 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/867426
High-temperature superconductor arrangement May 30, 2001 Abandoned
Array ( [id] => 1427269 [patent_doc_number] => 06504111 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-01-07 [patent_title] => 'Solid via layer to layer interconnect' [patent_app_type] => B2 [patent_app_number] => 09/867312 [patent_app_country] => US [patent_app_date] => 2001-05-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2133 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/504/06504111.pdf [firstpage_image] =>[orig_patent_app_number] => 09867312 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/867312
Solid via layer to layer interconnect May 28, 2001 Issued
Array ( [id] => 6894933 [patent_doc_number] => 20010025723 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-10-04 [patent_title] => 'Mounting structure of electronic component on substrate board' [patent_app_type] => new [patent_app_number] => 09/858500 [patent_app_country] => US [patent_app_date] => 2001-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 6749 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0025/20010025723.pdf [firstpage_image] =>[orig_patent_app_number] => 09858500 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/858500
Mounting structure of electronic component on substrate board May 16, 2001 Issued
Array ( [id] => 1538356 [patent_doc_number] => 06337796 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-01-08 [patent_title] => 'Semiconductor device mount structure having heat dissipating member for dissipating heat generated from semiconductor device' [patent_app_type] => B2 [patent_app_number] => 09/852701 [patent_app_country] => US [patent_app_date] => 2001-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 3591 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/337/06337796.pdf [firstpage_image] =>[orig_patent_app_number] => 09852701 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/852701
Semiconductor device mount structure having heat dissipating member for dissipating heat generated from semiconductor device May 10, 2001 Issued
Array ( [id] => 5782005 [patent_doc_number] => 20020157861 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-31 [patent_title] => 'Printed circuit board with mixed metallurgy pads and method of fabrication' [patent_app_type] => new [patent_app_number] => 09/844814 [patent_app_country] => US [patent_app_date] => 2001-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3416 [patent_no_of_claims] => 54 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0157/20020157861.pdf [firstpage_image] =>[orig_patent_app_number] => 09844814 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/844814
Printed circuit board with mixed metallurgy pads and method of fabrication Apr 26, 2001 Issued
Array ( [id] => 6224794 [patent_doc_number] => 20020004324 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-10 [patent_title] => 'Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin' [patent_app_type] => new [patent_app_number] => 09/829441 [patent_app_country] => US [patent_app_date] => 2001-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 14135 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0004/20020004324.pdf [firstpage_image] =>[orig_patent_app_number] => 09829441 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/829441
Pin solder jointed to a resin substrate, made having a predetermined hardness and dimensions Apr 9, 2001 Issued
Array ( [id] => 6152966 [patent_doc_number] => 20020144840 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-10 [patent_title] => 'Leadframe package with dummy chip' [patent_app_type] => new [patent_app_number] => 09/829506 [patent_app_country] => US [patent_app_date] => 2001-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1153 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0144/20020144840.pdf [firstpage_image] =>[orig_patent_app_number] => 09829506 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/829506
Leadframe package with dummy chip Apr 8, 2001 Abandoned
Array ( [id] => 996754 [patent_doc_number] => 06914196 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-07-05 [patent_title] => 'Reel-deployed printed circuit board' [patent_app_type] => utility [patent_app_number] => 09/827112 [patent_app_country] => US [patent_app_date] => 2001-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 3646 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/914/06914196.pdf [firstpage_image] =>[orig_patent_app_number] => 09827112 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/827112
Reel-deployed printed circuit board Apr 4, 2001 Issued
Array ( [id] => 1266025 [patent_doc_number] => 06660942 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-12-09 [patent_title] => 'Semiconductor device with an exposed external-connection terminal' [patent_app_type] => B2 [patent_app_number] => 09/826512 [patent_app_country] => US [patent_app_date] => 2001-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 20 [patent_no_of_words] => 10410 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/660/06660942.pdf [firstpage_image] =>[orig_patent_app_number] => 09826512 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/826512
Semiconductor device with an exposed external-connection terminal Apr 4, 2001 Issued
Array ( [id] => 1213781 [patent_doc_number] => 06710255 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-23 [patent_title] => 'Printed circuit board having buried intersignal capacitance and method of making' [patent_app_type] => B2 [patent_app_number] => 09/822715 [patent_app_country] => US [patent_app_date] => 2001-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2639 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/710/06710255.pdf [firstpage_image] =>[orig_patent_app_number] => 09822715 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/822715
Printed circuit board having buried intersignal capacitance and method of making Mar 29, 2001 Issued
Array ( [id] => 1501962 [patent_doc_number] => 06486411 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-11-26 [patent_title] => 'Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate' [patent_app_type] => B2 [patent_app_number] => 09/811445 [patent_app_country] => US [patent_app_date] => 2001-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 6197 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/486/06486411.pdf [firstpage_image] =>[orig_patent_app_number] => 09811445 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/811445
Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate Mar 19, 2001 Issued
Array ( [id] => 6027934 [patent_doc_number] => 20020017399 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-02-14 [patent_title] => 'Coaxial via hole and process of fabricating the same' [patent_app_type] => new [patent_app_number] => 09/809310 [patent_app_country] => US [patent_app_date] => 2001-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 5349 [patent_no_of_claims] => 50 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0017/20020017399.pdf [firstpage_image] =>[orig_patent_app_number] => 09809310 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/809310
Coaxial via hole and process of fabricating the same Mar 15, 2001 Issued
Array ( [id] => 1572451 [patent_doc_number] => 06468091 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-10-22 [patent_title] => 'Electrical distribution center' [patent_app_type] => B2 [patent_app_number] => 09/802436 [patent_app_country] => US [patent_app_date] => 2001-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 1760 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/468/06468091.pdf [firstpage_image] =>[orig_patent_app_number] => 09802436 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/802436
Electrical distribution center Mar 8, 2001 Issued
Array ( [id] => 6986234 [patent_doc_number] => 20010036066 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-11-01 [patent_title] => 'Method and apparatus for delivering power to high performance electronic assemblies' [patent_app_type] => new [patent_app_number] => 09/801437 [patent_app_country] => US [patent_app_date] => 2001-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 7682 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20010036066.pdf [firstpage_image] =>[orig_patent_app_number] => 09801437 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/801437
Apparatus for delivering power to high performance electronic assemblies Mar 7, 2001 Issued
Array ( [id] => 4308307 [patent_doc_number] => 06326557 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-04 [patent_title] => 'Multi-layer circuit board' [patent_app_type] => 1 [patent_app_number] => 9/799900 [patent_app_country] => US [patent_app_date] => 2001-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2583 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 306 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/326/06326557.pdf [firstpage_image] =>[orig_patent_app_number] => 799900 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/799900
Multi-layer circuit board Mar 5, 2001 Issued
Array ( [id] => 1491580 [patent_doc_number] => 06417460 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-09 [patent_title] => 'Multi-layer circuit board having signal, ground and power layers' [patent_app_type] => B1 [patent_app_number] => 09/800412 [patent_app_country] => US [patent_app_date] => 2001-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 3987 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 321 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/417/06417460.pdf [firstpage_image] =>[orig_patent_app_number] => 09800412 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/800412
Multi-layer circuit board having signal, ground and power layers Mar 5, 2001 Issued
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