David H. Kruse

Array ( [id] => 1405253 [patent_doc_number] => 06538209 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-03-25 [patent_title] => 'Substrate for mounting semiconductor element having circuit patterns, and an insulating layer made of photosensitive and thermally-melting type adhesive resin' [patent_app_type] => B1 [patent_app_number] => 09/397111 [patent_app_country] => US [patent_app_date] => 1999-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 5469 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/538/06538209.pdf [firstpage_image] =>[orig_patent_app_number] => 09397111 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1343098 [patent_doc_number] => 06590165 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-07-08 [patent_title] => 'Printed wiring board having throughole and annular lands' [patent_app_type] => B1 [patent_app_number] => 09/341792 [patent_app_country] => US [patent_app_date] => 1999-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 32 [patent_figures_cnt] => 67 [patent_no_of_words] => 25968 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/590/06590165.pdf [firstpage_image] =>[orig_patent_app_number] => 09341792 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1384675 [patent_doc_number] => 06555762 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-04-29 [patent_title] => 'Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition' [patent_app_type] => B2 [patent_app_number] => 09/345428 [patent_app_country] => US [patent_app_date] => 1999-07-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 5614 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/555/06555762.pdf [firstpage_image] =>[orig_patent_app_number] => 09345428 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4291531 [patent_doc_number] => 06268569 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-07-31 [patent_title] => 'Printed wiring board assembly with a substrate having a glass fabric reinforced, condensation reacted and thermally crosslinked nadic end-capped polyimide resin' [patent_app_type] => 1 [patent_app_number] => 9/345199 [patent_app_country] => US [patent_app_date] => 1999-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 2239 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/268/06268569.pdf [firstpage_image] =>[orig_patent_app_number] => 345199 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4357745 [patent_doc_number] => 06291779 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-09-18 [patent_title] => 'Fine pitch circuitization with filled plated through holes' [patent_app_type] => 1 [patent_app_number] => 9/345573 [patent_app_country] => US [patent_app_date] => 1999-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 6368 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 222 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/291/06291779.pdf [firstpage_image] =>[orig_patent_app_number] => 345573 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1441804 [patent_doc_number] => 06335495 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-01-01 [patent_title] => 'Patterning a layered chrome-copper structure disposed on a dielectric substrate' [patent_app_type] => B1 [patent_app_number] => 09/343073 [patent_app_country] => US [patent_app_date] => 1999-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 4047 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/335/06335495.pdf [firstpage_image] =>[orig_patent_app_number] => 09343073 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1140324 [patent_doc_number] => 06781064 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-08-24 [patent_title] => 'Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same' [patent_app_type] => B1 [patent_app_number] => 09/342584 [patent_app_country] => US [patent_app_date] => 1999-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 3269 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/781/06781064.pdf [firstpage_image] =>[orig_patent_app_number] => 09342584 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4316067 [patent_doc_number] => 06331118 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-18 [patent_title] => 'Electrode spacing conversion adaptor' [patent_app_type] => 1 [patent_app_number] => 9/334727 [patent_app_country] => US [patent_app_date] => 1999-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 14 [patent_no_of_words] => 3676 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/331/06331118.pdf [firstpage_image] =>[orig_patent_app_number] => 334727 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6241666 [patent_doc_number] => 20020045036 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-04-18 [patent_title] => 'BGA SOLDER BALL SHEAR STRENGTH' [patent_app_type] => new [patent_app_number] => 09/334083 [patent_app_country] => US [patent_app_date] => 1999-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3219 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0045/20020045036.pdf [firstpage_image] =>[orig_patent_app_number] => 09334083 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1081147 [patent_doc_number] => 06835895 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-12-28 [patent_title] => 'Printed wiring board and method for manufacturing the same' [patent_app_type] => B1 [patent_app_number] => 09/319258 [patent_app_country] => US [patent_app_date] => 1999-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 43 [patent_no_of_words] => 13566 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 32 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/835/06835895.pdf [firstpage_image] =>[orig_patent_app_number] => 09319258 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1579841 [patent_doc_number] => 06448504 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-09-10 [patent_title] => 'Printed circuit board and semiconductor package using the same' [patent_app_type] => B1 [patent_app_number] => 09/330939 [patent_app_country] => US [patent_app_date] => 1999-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 1612 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/448/06448504.pdf [firstpage_image] =>[orig_patent_app_number] => 09330939 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4308293 [patent_doc_number] => 06326556 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-04 [patent_title] => 'Multilayered printed wiring board' [patent_app_type] => 1 [patent_app_number] => 9/319257 [patent_app_country] => US [patent_app_date] => 1999-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 9 [patent_no_of_words] => 3182 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/326/06326556.pdf [firstpage_image] =>[orig_patent_app_number] => 319257 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4276557 [patent_doc_number] => 06323438 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-11-27 [patent_title] => 'Printed circuit board and semiconductor device using the same' [patent_app_type] => 1 [patent_app_number] => 9/328411 [patent_app_country] => US [patent_app_date] => 1999-06-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2326 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/323/06323438.pdf [firstpage_image] =>[orig_patent_app_number] => 328411 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1562819 [patent_doc_number] => 06362433 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-03-26 [patent_title] => 'Flexible printed circuit board' [patent_app_type] => B1 [patent_app_number] => 09/326275 [patent_app_country] => US [patent_app_date] => 1999-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 10163 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/362/06362433.pdf [firstpage_image] =>[orig_patent_app_number] => 09326275 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1419527 [patent_doc_number] => 06521843 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-02-18 [patent_title] => 'Multilayer printed circuit board having signal, power and ground through holes' [patent_app_type] => B1 [patent_app_number] => 09/304631 [patent_app_country] => US [patent_app_date] => 1999-05-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 20 [patent_no_of_words] => 8331 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 177 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/521/06521843.pdf [firstpage_image] =>[orig_patent_app_number] => 09304631 [rel_patent_id] =>[rel_patent_doc_number] =>)