
David L. Fitzgerald
Examiner (ID: 5263)
| Most Active Art Unit | 1812 |
| Art Unit(s) | 1812, 1647, 1646 |
| Total Applications | 420 |
| Issued Applications | 256 |
| Pending Applications | 66 |
| Abandoned Applications | 98 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4226227
[patent_doc_number] => 06135345
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-24
[patent_title] => 'Metal material bonding method'
[patent_app_type] => 1
[patent_app_number] => 9/246709
[patent_app_country] => US
[patent_app_date] => 1999-02-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 10032
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 142
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/135/06135345.pdf
[firstpage_image] =>[orig_patent_app_number] => 246709
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/246709 | Metal material bonding method | Feb 8, 1999 | Issued |
Array
(
[id] => 4231346
[patent_doc_number] => 06206271
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-03-27
[patent_title] => 'Method for sealing a vacuum double wall container made of metal and associated sealed thereof'
[patent_app_type] => 1
[patent_app_number] => 9/244526
[patent_app_country] => US
[patent_app_date] => 1999-02-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 7
[patent_no_of_words] => 2585
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[patent_words_short_claim] => 164
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[pdf_file] => patents/06/206/06206271.pdf
[firstpage_image] =>[orig_patent_app_number] => 244526
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/244526 | Method for sealing a vacuum double wall container made of metal and associated sealed thereof | Feb 3, 1999 | Issued |
Array
(
[id] => 4273075
[patent_doc_number] => 06179200
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-30
[patent_title] => 'Method for forming solder bumps of improved height and devices formed'
[patent_app_type] => 1
[patent_app_number] => 9/243031
[patent_app_country] => US
[patent_app_date] => 1999-02-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 3980
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[patent_words_short_claim] => 170
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[pdf_file] => patents/06/179/06179200.pdf
[firstpage_image] =>[orig_patent_app_number] => 243031
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/243031 | Method for forming solder bumps of improved height and devices formed | Feb 2, 1999 | Issued |
Array
(
[id] => 4113038
[patent_doc_number] => 06119918
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-09-19
[patent_title] => 'Solder head control mechanism'
[patent_app_type] => 1
[patent_app_number] => 9/243112
[patent_app_country] => US
[patent_app_date] => 1999-02-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 1675
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[patent_words_short_claim] => 167
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[pdf_file] => patents/06/119/06119918.pdf
[firstpage_image] =>[orig_patent_app_number] => 243112
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/243112 | Solder head control mechanism | Feb 2, 1999 | Issued |
Array
(
[id] => 4215151
[patent_doc_number] => 06164524
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-12-26
[patent_title] => 'HIP-bonded body and method of producing the same'
[patent_app_type] => 1
[patent_app_number] => 9/243664
[patent_app_country] => US
[patent_app_date] => 1999-02-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
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[patent_no_of_words] => 4499
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[pdf_file] => patents/06/164/06164524.pdf
[firstpage_image] =>[orig_patent_app_number] => 243664
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/243664 | HIP-bonded body and method of producing the same | Feb 1, 1999 | Issued |
Array
(
[id] => 4228269
[patent_doc_number] => 06220503
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-04-24
[patent_title] => 'Rework and underfill nozzle for electronic components'
[patent_app_type] => 1
[patent_app_number] => 9/244565
[patent_app_country] => US
[patent_app_date] => 1999-02-02
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[pdf_file] => patents/06/220/06220503.pdf
[firstpage_image] =>[orig_patent_app_number] => 244565
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/244565 | Rework and underfill nozzle for electronic components | Feb 1, 1999 | Issued |
Array
(
[id] => 4149283
[patent_doc_number] => 06138889
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-31
[patent_title] => 'Device for assembling motor-vehicle bodies by spot-welding'
[patent_app_type] => 1
[patent_app_number] => 9/240600
[patent_app_country] => US
[patent_app_date] => 1999-02-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 4732
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/138/06138889.pdf
[firstpage_image] =>[orig_patent_app_number] => 240600
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/240600 | Device for assembling motor-vehicle bodies by spot-welding | Jan 31, 1999 | Issued |
Array
(
[id] => 1588523
[patent_doc_number] => 06382501
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-07
[patent_title] => 'Furnace brazing'
[patent_app_type] => B1
[patent_app_number] => 09/240392
[patent_app_country] => US
[patent_app_date] => 1999-01-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2374
[patent_no_of_claims] => 11
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[pdf_file] => patents/06/382/06382501.pdf
[firstpage_image] =>[orig_patent_app_number] => 09240392
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/240392 | Furnace brazing | Jan 28, 1999 | Issued |
Array
(
[id] => 4343613
[patent_doc_number] => 06173884
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-16
[patent_title] => 'Semiconductor device and equipment for manufacturing the same as well as method of fabricating the same'
[patent_app_type] => 1
[patent_app_number] => 9/238426
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[patent_app_date] => 1999-01-28
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[pdf_file] => patents/06/173/06173884.pdf
[firstpage_image] =>[orig_patent_app_number] => 238426
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/238426 | Semiconductor device and equipment for manufacturing the same as well as method of fabricating the same | Jan 27, 1999 | Issued |
Array
(
[id] => 4164322
[patent_doc_number] => 06149050
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-11-21
[patent_title] => 'Method for attaching solderable wire leads to a lead frame'
[patent_app_type] => 1
[patent_app_number] => 9/238229
[patent_app_country] => US
[patent_app_date] => 1999-01-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 2115
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[pdf_file] => patents/06/149/06149050.pdf
[firstpage_image] =>[orig_patent_app_number] => 238229
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/238229 | Method for attaching solderable wire leads to a lead frame | Jan 26, 1999 | Issued |
Array
(
[id] => 4339212
[patent_doc_number] => 06189764
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-02-20
[patent_title] => 'Fitting gear'
[patent_app_type] => 1
[patent_app_number] => 9/236382
[patent_app_country] => US
[patent_app_date] => 1999-01-25
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/189/06189764.pdf
[firstpage_image] =>[orig_patent_app_number] => 236382
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/236382 | Fitting gear | Jan 24, 1999 | Issued |
Array
(
[id] => 4171207
[patent_doc_number] => 06152353
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-11-28
[patent_title] => 'Printed circuit board header attachment station'
[patent_app_type] => 1
[patent_app_number] => 9/245125
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[patent_app_date] => 1999-01-14
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[pdf_file] => patents/06/152/06152353.pdf
[firstpage_image] =>[orig_patent_app_number] => 245125
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/245125 | Printed circuit board header attachment station | Jan 13, 1999 | Issued |
Array
(
[id] => 1454129
[patent_doc_number] => 06390353
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-21
[patent_title] => 'Integral solder and plated sealing cover and method of making the same'
[patent_app_type] => B1
[patent_app_number] => 09/226339
[patent_app_country] => US
[patent_app_date] => 1999-01-06
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[pdf_file] => patents/06/390/06390353.pdf
[firstpage_image] =>[orig_patent_app_number] => 09226339
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/226339 | Integral solder and plated sealing cover and method of making the same | Jan 5, 1999 | Issued |
Array
(
[id] => 4405288
[patent_doc_number] => 06238819
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-05-29
[patent_title] => 'Metal foam support, electrode and method of making same'
[patent_app_type] => 1
[patent_app_number] => 9/213240
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[patent_app_date] => 1998-12-17
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[pdf_file] => patents/06/238/06238819.pdf
[firstpage_image] =>[orig_patent_app_number] => 213240
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/213240 | Metal foam support, electrode and method of making same | Dec 16, 1998 | Issued |
Array
(
[id] => 4378409
[patent_doc_number] => 06277524
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-08-21
[patent_title] => 'Lithium-ion-conductive solid electrolyte and solid-electrolyte lithium battery'
[patent_app_type] => 1
[patent_app_number] => 9/206961
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[firstpage_image] =>[orig_patent_app_number] => 206961
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/206961 | Lithium-ion-conductive solid electrolyte and solid-electrolyte lithium battery | Dec 7, 1998 | Issued |
Array
(
[id] => 4344908
[patent_doc_number] => 06168070
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-02
[patent_title] => 'Method for soldering DPAK-type electronic components to circuit boards'
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[pdf_file] => patents/06/168/06168070.pdf
[firstpage_image] =>[orig_patent_app_number] => 172047
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/172047 | Method for soldering DPAK-type electronic components to circuit boards | Oct 13, 1998 | Issued |
Array
(
[id] => 4217454
[patent_doc_number] => 06073830
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-06-13
[patent_title] => 'Sputter target/backing plate assembly and method of making same'
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[pdf_file] => patents/06/073/06073830.pdf
[firstpage_image] =>[orig_patent_app_number] => 172311
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/172311 | Sputter target/backing plate assembly and method of making same | Oct 13, 1998 | Issued |
Array
(
[id] => 4344927
[patent_doc_number] => 06168071
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-01-02
[patent_title] => 'Method for joining materials together by a diffusion process using silver/germanium alloys and a silver/germanium alloy for use in the method'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/170924 | Method for joining materials together by a diffusion process using silver/germanium alloys and a silver/germanium alloy for use in the method | Oct 12, 1998 | Issued |
Array
(
[id] => 4178113
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Array
(
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[patent_issue_date] => 2003-07-22
[patent_title] => 'Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement'
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[patent_app_number] => 09/167763
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[pdf_file] => patents/06/595/06595408.pdf
[firstpage_image] =>[orig_patent_app_number] => 09167763
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/167763 | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement | Oct 6, 1998 | Issued |