Search

David L. Miller

Examiner (ID: 325, Phone: (571)270-1297 , Office: P/1763 )

Most Active Art Unit
1763
Art Unit(s)
1763
Total Applications
552
Issued Applications
301
Pending Applications
70
Abandoned Applications
192

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 16218536 [patent_doc_number] => 10734358 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2020-08-04 [patent_title] => Multi-packaging for single-socketing [patent_app_type] => utility [patent_app_number] => 16/008457 [patent_app_country] => US [patent_app_date] => 2018-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 5766 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16008457 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/008457
Multi-packaging for single-socketing Jun 13, 2018 Issued
Array ( [id] => 15061431 [patent_doc_number] => 10461027 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-10-29 [patent_title] => Semiconductor device including via plug and method of forming the same [patent_app_type] => utility [patent_app_number] => 16/008319 [patent_app_country] => US [patent_app_date] => 2018-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 31 [patent_no_of_words] => 7080 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16008319 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/008319
Semiconductor device including via plug and method of forming the same Jun 13, 2018 Issued
Array ( [id] => 15274379 [patent_doc_number] => 20190385924 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2019-12-19 [patent_title] => Stress Buffer Layer in Embedded Package [patent_app_type] => utility [patent_app_number] => 16/008119 [patent_app_country] => US [patent_app_date] => 2018-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6747 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16008119 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/008119
Stress buffer layer in embedded package Jun 13, 2018 Issued
Array ( [id] => 15200171 [patent_doc_number] => 10497587 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2019-12-03 [patent_title] => Ion manipulation methods and related apparatuses and systems for semiconductor encapsulation materials [patent_app_type] => utility [patent_app_number] => 16/007038 [patent_app_country] => US [patent_app_date] => 2018-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 19 [patent_no_of_words] => 7911 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16007038 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/007038
Ion manipulation methods and related apparatuses and systems for semiconductor encapsulation materials Jun 12, 2018 Issued
Array ( [id] => 15200309 [patent_doc_number] => 10497657 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2019-12-03 [patent_title] => Semiconductor package device and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/007745 [patent_app_country] => US [patent_app_date] => 2018-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 30 [patent_figures_cnt] => 31 [patent_no_of_words] => 7415 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16007745 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/007745
Semiconductor package device and method of manufacturing the same Jun 12, 2018 Issued
Array ( [id] => 14333003 [patent_doc_number] => 10297530 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-05-21 [patent_title] => Press member for semiconductor stack unit [patent_app_type] => utility [patent_app_number] => 16/007141 [patent_app_country] => US [patent_app_date] => 2018-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 18 [patent_no_of_words] => 5298 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16007141 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/007141
Press member for semiconductor stack unit Jun 12, 2018 Issued
Array ( [id] => 13785535 [patent_doc_number] => 20190006306 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2019-01-03 [patent_title] => SEMICONDUCTOR CHIP [patent_app_type] => utility [patent_app_number] => 16/006623 [patent_app_country] => US [patent_app_date] => 2018-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12038 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16006623 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/006623
Semiconductor chip Jun 11, 2018 Issued
Array ( [id] => 13598247 [patent_doc_number] => 20180350672 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2018-12-06 [patent_title] => DECOUPLED VIA FILL [patent_app_type] => utility [patent_app_number] => 16/005175 [patent_app_country] => US [patent_app_date] => 2018-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6400 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16005175 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/005175
Decoupled via fill Jun 10, 2018 Issued
Array ( [id] => 14011593 [patent_doc_number] => 10224272 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-03-05 [patent_title] => Semiconductor package including a rewiring layer with an embedded chip [patent_app_type] => utility [patent_app_number] => 16/004539 [patent_app_country] => US [patent_app_date] => 2018-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 17 [patent_no_of_words] => 8965 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 240 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16004539 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/004539
Semiconductor package including a rewiring layer with an embedded chip Jun 10, 2018 Issued
Array ( [id] => 14801103 [patent_doc_number] => 10403561 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-09-03 [patent_title] => Power module apparatus, cooling structure, and electric vehicle or hybrid electric vehicle [patent_app_type] => utility [patent_app_number] => 15/997195 [patent_app_country] => US [patent_app_date] => 2018-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 47 [patent_no_of_words] => 12977 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15997195 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/997195
Power module apparatus, cooling structure, and electric vehicle or hybrid electric vehicle Jun 3, 2018 Issued
Array ( [id] => 16233900 [patent_doc_number] => 10741463 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2020-08-11 [patent_title] => Shielded module [patent_app_type] => utility [patent_app_number] => 15/995534 [patent_app_country] => US [patent_app_date] => 2018-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 13 [patent_no_of_words] => 4438 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15995534 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/995534
Shielded module May 31, 2018 Issued
Array ( [id] => 13435215 [patent_doc_number] => 20180269150 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2018-09-20 [patent_title] => METAL INTERCONNECTS FOR SUPER (SKIP) VIA INTEGRATION [patent_app_type] => utility [patent_app_number] => 15/983168 [patent_app_country] => US [patent_app_date] => 2018-05-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2920 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15983168 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/983168
Metal interconnects for super (skip) via integration May 17, 2018 Issued
Array ( [id] => 13257119 [patent_doc_number] => 10141254 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2018-11-27 [patent_title] => Direct bonded copper power module with elevated common source inductance [patent_app_type] => utility [patent_app_number] => 15/978552 [patent_app_country] => US [patent_app_date] => 2018-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 16 [patent_no_of_words] => 4334 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15978552 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/978552
Direct bonded copper power module with elevated common source inductance May 13, 2018 Issued
Array ( [id] => 13419965 [patent_doc_number] => 20180261525 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2018-09-13 [patent_title] => DIRECT BONDED COPPER SEMICONDUCTOR PACKAGES AND RELATED METHODS [patent_app_type] => utility [patent_app_number] => 15/973873 [patent_app_country] => US [patent_app_date] => 2018-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8670 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15973873 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/973873
Direct bonded copper semiconductor packages and related methods May 7, 2018 Issued
Array ( [id] => 15315447 [patent_doc_number] => 10522437 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-12-31 [patent_title] => Methods and apparatus for package with interposers [patent_app_type] => utility [patent_app_number] => 15/958949 [patent_app_country] => US [patent_app_date] => 2018-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 6186 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15958949 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/958949
Methods and apparatus for package with interposers Apr 19, 2018 Issued
Array ( [id] => 13976625 [patent_doc_number] => 10217677 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-02-26 [patent_title] => Removable sacrificial connections for semiconductor devices [patent_app_type] => utility [patent_app_number] => 15/953581 [patent_app_country] => US [patent_app_date] => 2018-04-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3070 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15953581 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/953581
Removable sacrificial connections for semiconductor devices Apr 15, 2018 Issued
Array ( [id] => 14366989 [patent_doc_number] => 10304807 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-05-28 [patent_title] => Fan-out semiconductor package [patent_app_type] => utility [patent_app_number] => 15/951571 [patent_app_country] => US [patent_app_date] => 2018-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 13 [patent_no_of_words] => 11146 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15951571 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/951571
Fan-out semiconductor package Apr 11, 2018 Issued
Array ( [id] => 15000759 [patent_doc_number] => 20190319337 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2019-10-17 [patent_title] => SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 15/951091 [patent_app_country] => US [patent_app_date] => 2018-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6557 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15951091 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/951091
Semiconductor device package and method of manufacturing the same Apr 10, 2018 Issued
Array ( [id] => 14999961 [patent_doc_number] => 20190318938 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2019-10-17 [patent_title] => SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 15/951093 [patent_app_country] => US [patent_app_date] => 2018-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5823 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15951093 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/951093
Semiconductor device package and method of manufacturing the same Apr 10, 2018 Issued
Array ( [id] => 14205213 [patent_doc_number] => 10269728 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-04-23 [patent_title] => Semiconductor device with shielding structure for cross-talk reduction [patent_app_type] => utility [patent_app_number] => 15/950722 [patent_app_country] => US [patent_app_date] => 2018-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 43 [patent_no_of_words] => 11391 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15950722 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/950722
Semiconductor device with shielding structure for cross-talk reduction Apr 10, 2018 Issued
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