Search

David M. Ostrowski

Examiner (ID: 14710)

Most Active Art Unit
2508
Art Unit(s)
2814, 2508, 2899
Total Applications
439
Issued Applications
348
Pending Applications
12
Abandoned Applications
79

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3077324 [patent_doc_number] => 05365109 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-11-15 [patent_title] => 'MIS semiconductor device with polysilicon gate electrode' [patent_app_type] => 1 [patent_app_number] => 7/928878 [patent_app_country] => US [patent_app_date] => 1992-08-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 1841 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/365/05365109.pdf [firstpage_image] =>[orig_patent_app_number] => 928878 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/928878
MIS semiconductor device with polysilicon gate electrode Aug 10, 1992 Issued
07/920482 METHOD AND DEVICE FOR INTERCONNECTING INTEGRATED CIRCUITS IN THREE DIMENSIONS Aug 5, 1992 Abandoned
Array ( [id] => 2967751 [patent_doc_number] => 05264729 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-11-23 [patent_title] => 'Semiconductor package having programmable interconnect' [patent_app_type] => 1 [patent_app_number] => 7/921806 [patent_app_country] => US [patent_app_date] => 1992-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 3084 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 262 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/264/05264729.pdf [firstpage_image] =>[orig_patent_app_number] => 921806 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/921806
Semiconductor package having programmable interconnect Jul 28, 1992 Issued
07/920168 PLASTIC MOLD TYPE SEMICONDUCTOR DEVICE Jul 26, 1992 Abandoned
Array ( [id] => 2981161 [patent_doc_number] => 05256901 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-10-26 [patent_title] => 'Ceramic package for memory semiconductor' [patent_app_type] => 1 [patent_app_number] => 7/915404 [patent_app_country] => US [patent_app_date] => 1992-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2119 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/256/05256901.pdf [firstpage_image] =>[orig_patent_app_number] => 915404 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/915404
Ceramic package for memory semiconductor Jul 19, 1992 Issued
Array ( [id] => 3090559 [patent_doc_number] => 05285105 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-02-08 [patent_title] => 'Semiconductor die packages having lead support frame' [patent_app_type] => 1 [patent_app_number] => 7/912030 [patent_app_country] => US [patent_app_date] => 1992-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 36 [patent_no_of_words] => 3129 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/285/05285105.pdf [firstpage_image] =>[orig_patent_app_number] => 912030 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/912030
Semiconductor die packages having lead support frame Jul 8, 1992 Issued
Array ( [id] => 2896750 [patent_doc_number] => 05270572 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-12-14 [patent_title] => 'Liquid impingement cooling module for semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 7/903458 [patent_app_country] => US [patent_app_date] => 1992-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 17 [patent_no_of_words] => 7562 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/270/05270572.pdf [firstpage_image] =>[orig_patent_app_number] => 903458 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/903458
Liquid impingement cooling module for semiconductor devices Jun 23, 1992 Issued
Array ( [id] => 3055036 [patent_doc_number] => 05283467 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-02-01 [patent_title] => 'Heat sink mounting system for semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 7/894678 [patent_app_country] => US [patent_app_date] => 1992-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2461 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 173 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/283/05283467.pdf [firstpage_image] =>[orig_patent_app_number] => 894678 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/894678
Heat sink mounting system for semiconductor devices Jun 4, 1992 Issued
Array ( [id] => 3049700 [patent_doc_number] => 05287001 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-02-15 [patent_title] => 'Cooling structures and package modules for semiconductors' [patent_app_type] => 1 [patent_app_number] => 7/874246 [patent_app_country] => US [patent_app_date] => 1992-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 5559 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 249 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/287/05287001.pdf [firstpage_image] =>[orig_patent_app_number] => 874246 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/874246
Cooling structures and package modules for semiconductors Apr 23, 1992 Issued
Array ( [id] => 2981016 [patent_doc_number] => 05256895 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-10-26 [patent_title] => 'Pad oxide protect sealed interface isolation' [patent_app_type] => 1 [patent_app_number] => 7/863519 [patent_app_country] => US [patent_app_date] => 1992-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 1822 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/256/05256895.pdf [firstpage_image] =>[orig_patent_app_number] => 863519 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/863519
Pad oxide protect sealed interface isolation Mar 30, 1992 Issued
Array ( [id] => 3080013 [patent_doc_number] => 05296739 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-03-22 [patent_title] => 'Circuit arrangement with a cooling member' [patent_app_type] => 1 [patent_app_number] => 7/861186 [patent_app_country] => US [patent_app_date] => 1992-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4436 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 187 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/296/05296739.pdf [firstpage_image] =>[orig_patent_app_number] => 861186 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/861186
Circuit arrangement with a cooling member Mar 30, 1992 Issued
Array ( [id] => 3100181 [patent_doc_number] => 05291178 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-03-01 [patent_title] => 'Film-type resistor assembly with full encapsulation except at the bottom surface' [patent_app_type] => 1 [patent_app_number] => 7/852580 [patent_app_country] => US [patent_app_date] => 1992-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 2923 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 204 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/291/05291178.pdf [firstpage_image] =>[orig_patent_app_number] => 852580 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/852580
Film-type resistor assembly with full encapsulation except at the bottom surface Mar 16, 1992 Issued
Array ( [id] => 2883514 [patent_doc_number] => RE034269 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-06-01 [patent_title] => 'Semiconductor integrated circuit packages' [patent_app_type] => 2 [patent_app_number] => 7/837573 [patent_app_country] => US [patent_app_date] => 1992-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 1225 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/RE/034/RE034269.pdf [firstpage_image] =>[orig_patent_app_number] => 837573 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/837573
Semiconductor integrated circuit packages Feb 17, 1992 Issued
Array ( [id] => 3068744 [patent_doc_number] => 05311059 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-05-10 [patent_title] => 'Backplane grounding for flip-chip integrated circuit' [patent_app_type] => 1 [patent_app_number] => 7/825367 [patent_app_country] => US [patent_app_date] => 1992-01-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 1798 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/311/05311059.pdf [firstpage_image] =>[orig_patent_app_number] => 825367 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/825367
Backplane grounding for flip-chip integrated circuit Jan 23, 1992 Issued
07/817972 DEVICE PACKAGING USING HEAT SPREADERS AND ASSISTED DEPOSITION OF WIRE BONDS Jan 5, 1992 Abandoned
Array ( [id] => 2898903 [patent_doc_number] => 05272375 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-12-21 [patent_title] => 'Electronic assembly with optimum heat dissipation' [patent_app_type] => 1 [patent_app_number] => 7/814024 [patent_app_country] => US [patent_app_date] => 1991-12-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 4720 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 303 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/272/05272375.pdf [firstpage_image] =>[orig_patent_app_number] => 814024 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/814024
Electronic assembly with optimum heat dissipation Dec 25, 1991 Issued
Array ( [id] => 3098065 [patent_doc_number] => 05291063 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-03-01 [patent_title] => 'High-power RF device with heat spreader bushing' [patent_app_type] => 1 [patent_app_number] => 7/812694 [patent_app_country] => US [patent_app_date] => 1991-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 2474 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/291/05291063.pdf [firstpage_image] =>[orig_patent_app_number] => 812694 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/812694
High-power RF device with heat spreader bushing Dec 22, 1991 Issued
Array ( [id] => 3070151 [patent_doc_number] => 05294831 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-03-15 [patent_title] => 'Circuit pack layout with improved dissipation of heat produced by high power electronic components' [patent_app_type] => 1 [patent_app_number] => 7/807688 [patent_app_country] => US [patent_app_date] => 1991-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 17 [patent_no_of_words] => 7017 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 214 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/294/05294831.pdf [firstpage_image] =>[orig_patent_app_number] => 807688 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/807688
Circuit pack layout with improved dissipation of heat produced by high power electronic components Dec 15, 1991 Issued
07/807687 NARROW CHANNEL FINNED HEAT SINKING FOR COOLING HIGH POWER ELECTRONIC COMPONENTS Dec 15, 1991 Abandoned
Array ( [id] => 3101371 [patent_doc_number] => 05319244 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-06-07 [patent_title] => 'Triazine thin film adhesives' [patent_app_type] => 1 [patent_app_number] => 7/806410 [patent_app_country] => US [patent_app_date] => 1991-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 5729 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 39 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/319/05319244.pdf [firstpage_image] =>[orig_patent_app_number] => 806410 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/806410
Triazine thin film adhesives Dec 12, 1991 Issued
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