Search

David M. Ostrowski

Examiner (ID: 18512)

Most Active Art Unit
2508
Art Unit(s)
2814, 2899, 2508
Total Applications
439
Issued Applications
348
Pending Applications
12
Abandoned Applications
79

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3837196 [patent_doc_number] => 05814881 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-29 [patent_title] => 'Stacked integrated chip package and method of making same' [patent_app_type] => 1 [patent_app_number] => 8/770872 [patent_app_country] => US [patent_app_date] => 1996-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2563 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/814/05814881.pdf [firstpage_image] =>[orig_patent_app_number] => 770872 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/770872
Stacked integrated chip package and method of making same Dec 19, 1996 Issued
Array ( [id] => 3782266 [patent_doc_number] => 05818101 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-06 [patent_title] => 'Arrangement for the protection of electrical and electronic components against electrostatic discharge' [patent_app_type] => 1 [patent_app_number] => 8/767030 [patent_app_country] => US [patent_app_date] => 1996-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1539 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/818/05818101.pdf [firstpage_image] =>[orig_patent_app_number] => 767030 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/767030
Arrangement for the protection of electrical and electronic components against electrostatic discharge Dec 11, 1996 Issued
Array ( [id] => 3766955 [patent_doc_number] => 05844309 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-01 [patent_title] => 'Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition' [patent_app_type] => 1 [patent_app_number] => 8/754061 [patent_app_country] => US [patent_app_date] => 1996-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 36128 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 12 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/844/05844309.pdf [firstpage_image] =>[orig_patent_app_number] => 754061 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/754061
Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition Dec 2, 1996 Issued
Array ( [id] => 3864958 [patent_doc_number] => 05793098 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-08-11 [patent_title] => 'Package including conductive layers having notches formed' [patent_app_type] => 1 [patent_app_number] => 8/755014 [patent_app_country] => US [patent_app_date] => 1996-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 11 [patent_no_of_words] => 2070 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/793/05793098.pdf [firstpage_image] =>[orig_patent_app_number] => 755014 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/755014
Package including conductive layers having notches formed Nov 21, 1996 Issued
Array ( [id] => 3812660 [patent_doc_number] => 05831331 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-03 [patent_title] => 'Self-shielding inductor for multi-layer semiconductor integrated circuits' [patent_app_type] => 1 [patent_app_number] => 8/754346 [patent_app_country] => US [patent_app_date] => 1996-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 4431 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/831/05831331.pdf [firstpage_image] =>[orig_patent_app_number] => 754346 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/754346
Self-shielding inductor for multi-layer semiconductor integrated circuits Nov 21, 1996 Issued
Array ( [id] => 3845311 [patent_doc_number] => 05847448 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-08 [patent_title] => 'Method and device for interconnecting integrated circuits in three dimensions' [patent_app_type] => 1 [patent_app_number] => 8/749660 [patent_app_country] => US [patent_app_date] => 1996-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 2568 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/847/05847448.pdf [firstpage_image] =>[orig_patent_app_number] => 749660 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/749660
Method and device for interconnecting integrated circuits in three dimensions Nov 14, 1996 Issued
Array ( [id] => 3732940 [patent_doc_number] => 05703397 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-12-30 [patent_title] => 'Semiconductor package having an aluminum nitride substrate' [patent_app_type] => 1 [patent_app_number] => 8/745367 [patent_app_country] => US [patent_app_date] => 1996-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 18 [patent_no_of_words] => 11266 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/703/05703397.pdf [firstpage_image] =>[orig_patent_app_number] => 745367 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/745367
Semiconductor package having an aluminum nitride substrate Nov 7, 1996 Issued
Array ( [id] => 3933394 [patent_doc_number] => 05877553 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-02 [patent_title] => 'Metallic electronic component packaging arrangement' [patent_app_type] => 1 [patent_app_number] => 8/739662 [patent_app_country] => US [patent_app_date] => 1996-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3595 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/877/05877553.pdf [firstpage_image] =>[orig_patent_app_number] => 739662 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/739662
Metallic electronic component packaging arrangement Oct 30, 1996 Issued
Array ( [id] => 3750927 [patent_doc_number] => 05717253 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-02-10 [patent_title] => 'Structure for forming an improved quality silicidation layer' [patent_app_type] => 1 [patent_app_number] => 8/736490 [patent_app_country] => US [patent_app_date] => 1996-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 11 [patent_no_of_words] => 1849 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/717/05717253.pdf [firstpage_image] =>[orig_patent_app_number] => 736490 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/736490
Structure for forming an improved quality silicidation layer Oct 23, 1996 Issued
Array ( [id] => 3692175 [patent_doc_number] => 05691549 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-25 [patent_title] => 'Sidewall strap' [patent_app_type] => 1 [patent_app_number] => 8/720991 [patent_app_country] => US [patent_app_date] => 1996-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 3532 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/691/05691549.pdf [firstpage_image] =>[orig_patent_app_number] => 720991 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/720991
Sidewall strap Oct 14, 1996 Issued
Array ( [id] => 4054555 [patent_doc_number] => 05869901 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-02-09 [patent_title] => 'Semiconductor device having aluminum interconnection and method of manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 8/730598 [patent_app_country] => US [patent_app_date] => 1996-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 37 [patent_no_of_words] => 13004 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/869/05869901.pdf [firstpage_image] =>[orig_patent_app_number] => 730598 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/730598
Semiconductor device having aluminum interconnection and method of manufacturing the same Oct 14, 1996 Issued
Array ( [id] => 3880340 [patent_doc_number] => 05825081 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-20 [patent_title] => 'Tape carrier and assembly structure thereof' [patent_app_type] => 1 [patent_app_number] => 8/729420 [patent_app_country] => US [patent_app_date] => 1996-10-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 13 [patent_no_of_words] => 4644 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/825/05825081.pdf [firstpage_image] =>[orig_patent_app_number] => 729420 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/729420
Tape carrier and assembly structure thereof Oct 10, 1996 Issued
Array ( [id] => 3904016 [patent_doc_number] => 05751057 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-12 [patent_title] => 'Lead on chip lead frame design without jumpover wiring' [patent_app_type] => 1 [patent_app_number] => 8/728534 [patent_app_country] => US [patent_app_date] => 1996-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2847 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/751/05751057.pdf [firstpage_image] =>[orig_patent_app_number] => 728534 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/728534
Lead on chip lead frame design without jumpover wiring Oct 8, 1996 Issued
Array ( [id] => 3794626 [patent_doc_number] => 05841178 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-24 [patent_title] => 'Optical component package' [patent_app_type] => 1 [patent_app_number] => 8/720888 [patent_app_country] => US [patent_app_date] => 1996-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 1702 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/841/05841178.pdf [firstpage_image] =>[orig_patent_app_number] => 720888 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/720888
Optical component package Oct 3, 1996 Issued
Array ( [id] => 3880450 [patent_doc_number] => 05825089 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-20 [patent_title] => 'Low thermal resistance spring biased RF semiconductor package mounting structure' [patent_app_type] => 1 [patent_app_number] => 8/722698 [patent_app_country] => US [patent_app_date] => 1996-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 1836 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/825/05825089.pdf [firstpage_image] =>[orig_patent_app_number] => 722698 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/722698
Low thermal resistance spring biased RF semiconductor package mounting structure Sep 29, 1996 Issued
08/720430 SEMICONDUCTOR DEVICE Sep 29, 1996 Abandoned
08/720262 ELECTRICALLY CONDUCTIVE THERMAL INTERFACE Sep 25, 1996 Abandoned
Array ( [id] => 3692492 [patent_doc_number] => 05691570 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-25 [patent_title] => 'Integrated circuits having patterns of mirror images and packages incorporating the same' [patent_app_type] => 1 [patent_app_number] => 8/719336 [patent_app_country] => US [patent_app_date] => 1996-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 25 [patent_no_of_words] => 5645 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/691/05691570.pdf [firstpage_image] =>[orig_patent_app_number] => 719336 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/719336
Integrated circuits having patterns of mirror images and packages incorporating the same Sep 24, 1996 Issued
Array ( [id] => 3766749 [patent_doc_number] => 05852327 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-22 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/709592 [patent_app_country] => US [patent_app_date] => 1996-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 58 [patent_no_of_words] => 10813 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/852/05852327.pdf [firstpage_image] =>[orig_patent_app_number] => 709592 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/709592
Semiconductor device Sep 8, 1996 Issued
Array ( [id] => 3818234 [patent_doc_number] => 05710459 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-01-20 [patent_title] => 'Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability' [patent_app_type] => 1 [patent_app_number] => 8/689534 [patent_app_country] => US [patent_app_date] => 1996-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2602 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/710/05710459.pdf [firstpage_image] =>[orig_patent_app_number] => 689534 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/689534
Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability Aug 8, 1996 Issued
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