David M. Ostrowski

Array ( [id] => 2750607 [patent_doc_number] => 05028987 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-07-02 [patent_title] => 'High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip' [patent_app_type] => 1 [patent_app_number] => 7/375569 [patent_app_country] => US [patent_app_date] => 1989-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 14 [patent_no_of_words] => 3991 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/028/05028987.pdf [firstpage_image] =>[orig_patent_app_number] => 375569 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2676256 [patent_doc_number] => 04954878 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-09-04 [patent_title] => 'Method of packaging and powering integrated circuit chips and the chip assembly formed thereby' [patent_app_type] => 1 [patent_app_number] => 7/373960 [patent_app_country] => US [patent_app_date] => 1989-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3091 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/954/04954878.pdf [firstpage_image] =>[orig_patent_app_number] => 373960 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2752094 [patent_doc_number] => 05023700 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-06-11 [patent_title] => 'Minutely patterned structure' [patent_app_type] => 1 [patent_app_number] => 7/367257 [patent_app_country] => US [patent_app_date] => 1989-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 28 [patent_no_of_words] => 4399 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/023/05023700.pdf [firstpage_image] =>[orig_patent_app_number] => 367257 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2651392 [patent_doc_number] => 04971676 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-11-20 [patent_title] => 'Support device for a thin substrate of a semiconductor material' [patent_app_type] => 1 [patent_app_number] => 7/365861 [patent_app_country] => US [patent_app_date] => 1989-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 1790 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/971/04971676.pdf [firstpage_image] =>[orig_patent_app_number] => 365861 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2638641 [patent_doc_number] => 04958222 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-09-18 [patent_title] => 'Semiconductor integrated circuit device' [patent_app_type] => 1 [patent_app_number] => 7/363759 [patent_app_country] => US [patent_app_date] => 1989-06-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 3748 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 534 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/958/04958222.pdf [firstpage_image] =>[orig_patent_app_number] => 363759 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2741005 [patent_doc_number] => 04998159 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-03-05 [patent_title] => 'Ceramic laminated circuit substrate' [patent_app_type] => 1 [patent_app_number] => 7/362924 [patent_app_country] => US [patent_app_date] => 1989-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 14 [patent_no_of_words] => 11075 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/998/04998159.pdf [firstpage_image] =>[orig_patent_app_number] => 362924 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2633697 [patent_doc_number] => 04967244 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-10-30 [patent_title] => 'Power semiconductor component with switch-off facility' [patent_app_type] => 1 [patent_app_number] => 7/334567 [patent_app_country] => US [patent_app_date] => 1989-04-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 3108 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 28 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/967/04967244.pdf [firstpage_image] =>[orig_patent_app_number] => 334567 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2596433 [patent_doc_number] => 04970572 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-11-13 [patent_title] => 'Semiconductor integrated circuit device of multilayer interconnection structure' [patent_app_type] => 1 [patent_app_number] => 7/318791 [patent_app_country] => US [patent_app_date] => 1989-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 3302 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/970/04970572.pdf [firstpage_image] =>[orig_patent_app_number] => 318791 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2700647 [patent_doc_number] => 05019891 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-05-28 [patent_title] => 'Semiconductor device and method of fabricating the same' [patent_app_type] => 1 [patent_app_number] => 7/296003 [patent_app_country] => US [patent_app_date] => 1989-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 31 [patent_no_of_words] => 7203 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 19 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/019/05019891.pdf [firstpage_image] =>[orig_patent_app_number] => 296003 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2754633 [patent_doc_number] => 05016089 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-05-14 [patent_title] => 'Substrate for hybrid IC, hybrid IC using the substrate and its applications' [patent_app_type] => 1 [patent_app_number] => 7/293443 [patent_app_country] => US [patent_app_date] => 1989-01-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 5463 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/016/05016089.pdf [firstpage_image] =>[orig_patent_app_number] => 293443 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2599903 [patent_doc_number] => 04918512 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-04-17 [patent_title] => 'Semiconductor package having an outwardly arced die cavity' [patent_app_type] => 1 [patent_app_number] => 7/286676 [patent_app_country] => US [patent_app_date] => 1988-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 999 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 38 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/918/04918512.pdf [firstpage_image] =>[orig_patent_app_number] => 286676 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2687164 [patent_doc_number] => 05005070 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-04-02 [patent_title] => 'Soldering interconnect method and apparatus for semiconductor packages' [patent_app_type] => 1 [patent_app_number] => 7/285988 [patent_app_country] => US [patent_app_date] => 1988-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 3979 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/005/05005070.pdf [firstpage_image] =>[orig_patent_app_number] => 285988 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2714294 [patent_doc_number] => 05014111 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-05-07 [patent_title] => 'Electrical contact bump and a package provided with the same' [patent_app_type] => 1 [patent_app_number] => 7/279101 [patent_app_country] => US [patent_app_date] => 1988-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 15 [patent_no_of_words] => 4229 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/014/05014111.pdf [firstpage_image] =>[orig_patent_app_number] => 279101 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2653450 [patent_doc_number] => 04980753 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-12-25 [patent_title] => 'Low-cost high-performance semiconductor chip package' [patent_app_type] => 1 [patent_app_number] => 7/274290 [patent_app_country] => US [patent_app_date] => 1988-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 27 [patent_no_of_words] => 12391 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 175 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/980/04980753.pdf [firstpage_image] =>[orig_patent_app_number] => 274290 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2638850 [patent_doc_number] => 04977444 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-12-11 [patent_title] => 'Semiconductor cooling apparatus' [patent_app_type] => 1 [patent_app_number] => 7/261639 [patent_app_country] => US [patent_app_date] => 1988-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 33 [patent_no_of_words] => 17438 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 169 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/977/04977444.pdf [firstpage_image] =>[orig_patent_app_number] => 261639 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2649953 [patent_doc_number] => 04939570 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1990-07-03 [patent_title] => 'High power, pluggable tape automated bonding package' [patent_app_type] => 1 [patent_app_number] => 7/223580 [patent_app_country] => US [patent_app_date] => 1988-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2019 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 187 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/04/939/04939570.pdf [firstpage_image] =>[orig_patent_app_number] => 223580 [rel_patent_id] =>[rel_patent_doc_number] =>)