| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 3575310
[patent_doc_number] => 05539214
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-23
[patent_title] => 'Quantum bridges fabricated by selective etching of superlattice structures'
[patent_app_type] => 1
[patent_app_number] => 8/384166
[patent_app_country] => US
[patent_app_date] => 1995-02-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/539/05539214.pdf
[firstpage_image] =>[orig_patent_app_number] => 384166
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/384166 | Quantum bridges fabricated by selective etching of superlattice structures | Feb 5, 1995 | Issued |
Array
(
[id] => 3620903
[patent_doc_number] => 05534999
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-09
[patent_title] => 'Monitoring sub-micron particles'
[patent_app_type] => 1
[patent_app_number] => 8/383683
[patent_app_country] => US
[patent_app_date] => 1995-02-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 9
[patent_no_of_words] => 3468
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/534/05534999.pdf
[firstpage_image] =>[orig_patent_app_number] => 383683
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/383683 | Monitoring sub-micron particles | Jan 31, 1995 | Issued |
| 08/382276 | SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE DEVICES | Jan 31, 1995 | Abandoned |
Array
(
[id] => 3727853
[patent_doc_number] => 05682064
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-10-28
[patent_title] => 'Repairable wafer scale integration system'
[patent_app_type] => 1
[patent_app_number] => 8/611602
[patent_app_country] => US
[patent_app_date] => 1995-01-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 8
[patent_no_of_words] => 3385
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 121
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/682/05682064.pdf
[firstpage_image] =>[orig_patent_app_number] => 611602
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/611602 | Repairable wafer scale integration system | Jan 22, 1995 | Issued |
Array
(
[id] => 3885770
[patent_doc_number] => 05798565
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-08-25
[patent_title] => 'Repairable wafer scale integration system'
[patent_app_type] => 1
[patent_app_number] => 8/659866
[patent_app_country] => US
[patent_app_date] => 1995-01-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 8
[patent_no_of_words] => 3392
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 4
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/798/05798565.pdf
[firstpage_image] =>[orig_patent_app_number] => 659866
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/659866 | Repairable wafer scale integration system | Jan 22, 1995 | Issued |
Array
(
[id] => 3666825
[patent_doc_number] => 05625227
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-04-29
[patent_title] => 'Circuit board-mounted IC package cooling apparatus'
[patent_app_type] => 1
[patent_app_number] => 8/374320
[patent_app_country] => US
[patent_app_date] => 1995-01-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 2431
[patent_no_of_claims] => 17
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[patent_words_short_claim] => 158
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/625/05625227.pdf
[firstpage_image] =>[orig_patent_app_number] => 374320
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/374320 | Circuit board-mounted IC package cooling apparatus | Jan 17, 1995 | Issued |
Array
(
[id] => 3735076
[patent_doc_number] => 05635754
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-06-03
[patent_title] => 'Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages'
[patent_app_type] => 1
[patent_app_number] => 8/372289
[patent_app_country] => US
[patent_app_date] => 1995-01-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 36
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[patent_no_of_words] => 7754
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/635/05635754.pdf
[firstpage_image] =>[orig_patent_app_number] => 372289
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/372289 | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages | Jan 12, 1995 | Issued |
Array
(
[id] => 3627646
[patent_doc_number] => 05612564
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-03-18
[patent_title] => 'Semiconductor device with limiter diode'
[patent_app_type] => 1
[patent_app_number] => 8/369772
[patent_app_country] => US
[patent_app_date] => 1995-01-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 13
[patent_no_of_words] => 6051
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 165
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/612/05612564.pdf
[firstpage_image] =>[orig_patent_app_number] => 369772
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/369772 | Semiconductor device with limiter diode | Jan 5, 1995 | Issued |
Array
(
[id] => 3612537
[patent_doc_number] => 05589711
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-12-31
[patent_title] => 'Semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 8/365502
[patent_app_country] => US
[patent_app_date] => 1994-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 13
[patent_no_of_words] => 5731
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 175
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/589/05589711.pdf
[firstpage_image] =>[orig_patent_app_number] => 365502
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/365502 | Semiconductor package | Dec 27, 1994 | Issued |
| 08/363912 | SEMICONDUCTOR DEVICE WHICH RADIATES HEAT AND APPLIES SUBSTRATE POTENTIAL FROM REAR SURFACE OF SEMICONDUCTOR CHIP | Dec 26, 1994 | Abandoned |
| 08/363284 | INTEGRATED SEMICONDUCTOR CIRCUIT WITH CAPACITORS OF PRECISELY DEFINED CAPACITANCE AND PROCESS FOR PRODUCING THE CIRCUIT | Dec 21, 1994 | Abandoned |
| 08/362692 | SIDEWALL STRAP | Dec 21, 1994 | Abandoned |
Array
(
[id] => 3557413
[patent_doc_number] => 05519252
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-05-21
[patent_title] => 'Power semiconductor device employing pin block connection arrangement for facilitated and economized manufacture'
[patent_app_type] => 1
[patent_app_number] => 8/361155
[patent_app_country] => US
[patent_app_date] => 1994-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 2319
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/519/05519252.pdf
[firstpage_image] =>[orig_patent_app_number] => 361155
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/361155 | Power semiconductor device employing pin block connection arrangement for facilitated and economized manufacture | Dec 20, 1994 | Issued |
Array
(
[id] => 3557608
[patent_doc_number] => 05574307
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-11-12
[patent_title] => 'Semiconductor device and method of producing the same'
[patent_app_type] => 1
[patent_app_number] => 8/357351
[patent_app_country] => US
[patent_app_date] => 1994-12-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 2768
[patent_no_of_claims] => 16
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[pdf_file] => patents/05/574/05574307.pdf
[firstpage_image] =>[orig_patent_app_number] => 357351
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/357351 | Semiconductor device and method of producing the same | Dec 15, 1994 | Issued |
| 08/356744 | HEAT SINK | Dec 14, 1994 | Abandoned |
Array
(
[id] => 3590643
[patent_doc_number] => 05552636
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-09-03
[patent_title] => 'Discrete transitor assembly'
[patent_app_type] => 1
[patent_app_number] => 8/345979
[patent_app_country] => US
[patent_app_date] => 1994-11-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 2048
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[pdf_file] => patents/05/552/05552636.pdf
[firstpage_image] =>[orig_patent_app_number] => 345979
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/345979 | Discrete transitor assembly | Nov 27, 1994 | Issued |
| 08/345975 | INTEGRATED CIRCUIT CHIP FORMED FROM PROCESSNG TWO OPPOSING SURFACES OF A WAFER | Nov 24, 1994 | Abandoned |
Array
(
[id] => 3616779
[patent_doc_number] => 05534718
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-09
[patent_title] => 'LED package structure of LED display'
[patent_app_type] => 1
[patent_app_number] => 8/343171
[patent_app_country] => US
[patent_app_date] => 1994-11-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => patents/05/534/05534718.pdf
[firstpage_image] =>[orig_patent_app_number] => 343171
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/343171 | LED package structure of LED display | Nov 21, 1994 | Issued |
Array
(
[id] => 3592329
[patent_doc_number] => 05550409
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-08-27
[patent_title] => 'Semiconductor device having internal wire and method of fabricating the same'
[patent_app_type] => 1
[patent_app_number] => 8/339662
[patent_app_country] => US
[patent_app_date] => 1994-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 33
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/550/05550409.pdf
[firstpage_image] =>[orig_patent_app_number] => 339662
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/339662 | Semiconductor device having internal wire and method of fabricating the same | Nov 13, 1994 | Issued |
Array
(
[id] => 3616876
[patent_doc_number] => 05534725
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-07-09
[patent_title] => 'Resin molded charge coupled device package and method for preparation thereof'
[patent_app_type] => 1
[patent_app_number] => 8/337016
[patent_app_country] => US
[patent_app_date] => 1994-11-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3068
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[pdf_file] => patents/05/534/05534725.pdf
[firstpage_image] =>[orig_patent_app_number] => 337016
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/337016 | Resin molded charge coupled device package and method for preparation thereof | Nov 6, 1994 | Issued |