Array
(
[id] => 6141708
[patent_doc_number] => 20020001872
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-01-03
[patent_title] => 'SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE MOUNTED ON CIRCUIT BOARD AND METHOD OF ASSEMBLING SEMICONDUCTOR PACKAGE'
[patent_app_type] => new
[patent_app_number] => 09/231663
[patent_app_country] => US
[patent_app_date] => 1999-01-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 5424
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 80
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0001/20020001872.pdf
[firstpage_image] =>[orig_patent_app_number] => 09231663
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/231663 | Semiconductor package having semiconductor element mounting structure of semiconductor package mounted on circuit board and method of assembling semiconductor package | Jan 14, 1999 | Issued |